MPC8572EVJAULE

IC MPU MPC85XX 1.333GHZ 1023BGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.333GHz 1023-FCPBGA (33x33)

Quantity 1,947 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SPE, Security; SECCore ProcessorPowerPC e500Device Package1023-FCPBGA (33x33)
ECCN5A002A1Ethernet10/100/1000Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case1023-BBGA, FCBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.333GHz
Supplier Device Package1023-FCPBGA (33×33)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572EVJAULE – IC MPU MPC85XX 1.333GHZ 1023BGA

The MPC8572EVJAULE is a dual-core PowerPC PowerQUICC III embedded microprocessor from NXP Semiconductors, featuring two 32-bit Book E‑enhanced Power Architecture e500 cores running at 1.333 GHz. Designed for embedded applications, the device integrates high-performance processing, on‑chip memory subsystems and a wide range of connectivity and security engines to address networking, communications and industrial embedded system designs.

This FCPBGA package (1023‑ball, 33×33 mm) device offers integrated DDR2/DDR3 memory controllers, multiple three‑speed Gigabit Ethernet ports and hardware security features, delivering a compact, high‑throughput building block for robust embedded designs operating from 0 °C to 105 °C.

Key Features

  • Core Two high‑performance, 32‑bit Book E e500 cores at 1.333 GHz providing symmetric dual‑core processing for parallel embedded workloads.
  • Caches and APUs Each core includes 32 KB L1 instruction and 32 KB L1 data caches with parity protection and configurable locking. On‑chip APUs support signal processing (SPE), single‑precision and double‑precision floating point operations.
  • Memory Integrated DDR2 and DDR3 SDRAM controllers simplify system memory design and support high bandwidth external memory configurations.
  • Connectivity Four 10/100/1000 Mbps Ethernet interfaces (eTSEC) and support for high‑speed serial interfaces including PCI Express and Serial RapidIO enable multi‑port networking and high‑speed I/O integration.
  • Security On‑chip cryptography engine and hardware random number generator provide built‑in security primitives for secure communications and embedded protection.
  • Peripheral and System Interfaces Includes DUART, I2C, GPIO, JTAG and an enhanced local bus controller (eLBC) for flexible peripheral connectivity and system control.
  • Package & Mounting 1023‑FCPBGA (33×33 mm) surface‑mount package supports high pin‑count system integration in a compact footprint.
  • Operating Range & Qualification Consumer‑qualified device with an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • Industrial Networking: Quad Gigabit Ethernet and DDR2/DDR3 support enable multi‑port switches, gateways and protocol converters for industrial networks.
  • Telecommunications Infrastructure: Dual e500 cores with SPE and high‑speed serial interfaces are suited for packet processing, control planes and telecom line cards.
  • Embedded Control Systems: High processing throughput and abundant peripheral interfaces make the device suitable for complex embedded control and automation controllers.
  • Networking Appliances: PCI Express, Serial RapidIO and multiple Ethernet ports support routing, firewall and security appliance designs requiring integrated processing and I/O.

Unique Advantages

  • Dual high‑performance cores: Two e500 cores at 1.333 GHz provide parallel processing for multitasking and packet‑centric workloads.
  • Integrated memory controllers: On‑chip DDR2/DDR3 controllers reduce external component count and simplify memory subsystem design.
  • Multi‑port Gigabit Ethernet: Four 10/100/1000 Mbps interfaces enable dense networking connectivity without extensive external MACs.
  • Built‑in security primitives: Cryptography engine and hardware RNG allow secure communications and key generation on the processor.
  • Rich peripheral set: DUART, I2C, GPIO, JTAG and eLBC provide flexible system and peripheral connectivity for varied embedded use cases.
  • High‑density BGA package: 1023‑ball FCPBGA (33×33 mm) offers the pin count needed for complex system integration while remaining surface‑mount friendly.

Why Choose MPC8572EVJAULE?

The MPC8572EVJAULE combines dual Book E e500 cores, extensive on‑chip peripherals and robust connectivity in a single 1023‑ball FCPBGA package, making it a practical choice for embedded designs that require integrated memory controllers, multi‑port Ethernet and hardware security. Its combination of processing, I/O and security features supports scalable system architectures for networking, telecom and industrial applications.

Designed for engineers who need a compact, integrated processor building block, the MPC8572EVJAULE offers long‑lived platform potential through its broad feature set and NXP‑documented hardware specifications, simplifying BOM and enabling focused system development.

Request a quote or submit a sales inquiry to evaluate the MPC8572EVJAULE for your embedded design needs.

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