MPC8572EPXAVNE

The MPC8572EPXAVNE is a dual-core PowerPC e500 microprocessor clocked at 1.5 GHz in a 1023-FCBGA (33×33) package. Designed for embedded systems, the device integrates high-performance processing, on-chip memory management and signal-processing accelerators to address networking, communications and general embedded compute tasks.

With integrated DDR2/DDR3 memory controllers, multiple gigabit Ethernet interfaces and hardware security primitives, this MPU targets designs that require balanced compute throughput, I/O integration and cryptographic support within a consumer-qualified offering from NXP Semiconductors.

Key Features

• Core and Architecture Two high-performance, 32-bit PowerPC e500 cores operating at 1.5 GHz, providing symmetric multi-core compute for embedded workloads.
• On-chip Caches and MMU Each core includes a 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and cache locking capabilities; includes an MMU and 36-bit real addressing.
• Signal and Floating‑Point Processing Integrated Signal Processing Engine (SPE) APU plus embedded vector and scalar single-precision FP APUs and a double-precision floating-point APU for compute-intensive algorithms.
• Memory Subsystem Built-in DDR2 and DDR3 SDRAM controllers to support a range of system memory configurations.
• Multi‑Gigabit Ethernet Four 10/100/1000 Mbps Ethernet interfaces for high-throughput networking and communication tasks.
• Security Features On-chip cryptography support and a hardware random number generator to assist secure communications and data protection.
• Peripheral and Serial Interfaces Integrated DUART and a broad set of on-chip controllers and serial interfaces as detailed in the hardware specifications.
• Package and Mounting 1023-FCBGA (33×33) package, surface-mount mounting type, suitable for compact board designs.
• Operating Range and Qualification Operational temperature range 0 °C to 105 °C and consumer qualification as listed in the product specifications.

Typical Applications

• Embedded Networking and Communications Four integrated gigabit Ethernet ports and high-performance cores enable routing, switching and protocol processing in network equipment.
• Industrial Embedded Systems Dual-core processing with DDR2/DDR3 support and hardware security primitives for control and secure connectivity in embedded controllers.
• Telecommunications Infrastructure On-chip signal-processing engines and floating‑point APUs support packet processing and media handling tasks in telecom line cards and appliances.
• General Embedded Compute Systems requiring balanced compute, memory interface flexibility and integrated I/O benefit from the MPC8572E architecture.

Unique Advantages

• Balanced Dual‑Core Performance: Two PowerPC e500 cores at 1.5 GHz provide parallelism for multi-threaded or partitioned embedded workloads.
• Integrated Networking I/O: Four gigabit Ethernet interfaces reduce external PHY/BMC requirements and simplify board-level connectivity.
• Flexible Memory Support: DDR2 and DDR3 memory controllers enable designers to choose memory technology that fits performance and cost targets.
• On‑Chip Security: Built-in cryptography and a random number generator help implement secure communication and boot strategies without separate security co-processors.
• Signal and Floating‑Point Acceleration: SPE APU and FP/APU units accelerate vector, integer and floating-point workloads commonly found in communications and signal processing.
• Documented Hardware Platform: Comprehensive hardware specifications from NXP Semiconductors provide detailed guidance for system integration and thermal/clocking design.

Why Choose MPC8572EPXAVNE?

The MPC8572EPXAVNE positions itself as a highly integrated embedded processor that combines dual-core PowerPC e500 compute, advanced signal and floating‑point accelerators, multi-gigabit Ethernet and on-chip security features. Its DDR2/DDR3 memory support and comprehensive hardware documentation make it suitable for designers seeking a compact, connected MPU for embedded networking and communications applications.

Backed by NXP Semiconductors’ hardware specifications, the MPC8572EPXAVNE is appropriate for projects that require multi-core performance, integrated I/O and security primitives in a 1023-FCBGA package with a 0 °C to 105 °C operating range.

Request a quote or submit an inquiry to receive pricing, availability and any additional technical information needed to evaluate the MPC8572EPXAVNE for your design.