MPC8572ELVTAVNE

IC MPU MPC85XX 1.5GHZ 1023FCBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.5GHz 1023-FCBGA (33x33)

Quantity 230 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; SPE, Security; SECCore ProcessorPowerPC e500Device Package1023-FCBGA (33x33)
ECCN5A002A1 FREEthernet10/100/1000Mbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case1023-BFBGA, FCBGARAM ControllersDDR2, DDR3REACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.5GHz
Supplier Device Package1023-FCBGA (33×33)Voltage – I/O1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572ELVTAVNE – PowerPC e500 2‑Core 1.5 GHz MPU

The MPC8572ELVTAVNE is a PowerPC e500-based microprocessor featuring two 32-bit cores running at 1.5 GHz. Built for embedded applications, it delivers integrated processing, memory and high-speed I/O capabilities suitable for systems requiring on-chip networking, signal-processing and security functions.

As a highly integrated MPU, the device combines dual cores with on-chip memory controllers, multiple high-speed interfaces and hardware security primitives to simplify system design and accelerate time to market.

Key Features

  • Core Dual PowerPC e500 32-bit cores running at 1.5 GHz, each with dedicated L1 instruction and data caches for responsive task execution.
  • Cache and Processing Engines 32 KB L1 instruction and 32 KB L1 data cache per core with parity protection; includes Signal Processing Engine (SPE) and floating-point/APU capabilities for vector and scalar math.
  • Memory Integrated DDR2 and DDR3 SDRAM controllers to support contemporary embedded memory systems.
  • Networking & Interfaces Four 10/100/1000 Mbps Ethernet ports and additional high-speed interfaces documented in the hardware specifications, enabling multi-port networking and system connectivity.
  • Security On-chip cryptography and a hardware random number generator provide foundation-level security features for protected communications and data handling.
  • System & Debug Integrated peripherals and system controllers including DUART, JTAG, I²C and GPIO support for system management and debug (per hardware documentation).
  • Packaging & Mounting 1023-FCBGA package (33 × 33 mm) with surface-mount mounting for compact board integration.
  • Operating Range & Compliance Qualified for consumer applications and rated for operation from 0 °C to 105 °C; RoHS compliant.

Typical Applications

  • Embedded Networking Multi-port Gigabit Ethernet interfaces make the device suited for routers, switches and network appliances that require integrated switching and packet processing.
  • Industrial Control Dual-core processing with DDR2/DDR3 support and extended temperature operation enables real-time control and automation applications.
  • Secure Communications Integrated cryptography and a hardware random number generator support secure data paths and encrypted communications in embedded systems.
  • Telecom & Data Infrastructure High-speed serial interfaces and system controllers documented in the hardware specifications enable use in telecom and data-path processing equipment.

Unique Advantages

  • High-performance dual cores: Two 32-bit PowerPC e500 cores at 1.5 GHz deliver parallel compute capacity for multitasking and packet processing workloads.
  • Integrated memory controllers: On-chip DDR2/DDR3 support reduces external glue logic and simplifies memory subsystem design.
  • Multi-port Ethernet integration: Four 10/100/1000 Mbps Ethernet ports enable consolidated networking functions without adding separate PHY/controller ICs.
  • Hardware security primitives: Built-in cryptography and a random number generator help streamline secure system design and reduce the need for external security accelerators.
  • Compact, manufacturable package: 1023-FCBGA (33×33 mm) surface-mount package facilitates compact board layouts and automated assembly.
  • Clear operational envelope: 0 °C to 105 °C rating and RoHS compliance support reliable deployment across a range of consumer embedded products.

Why Choose MPC8572ELVTAVNE?

The MPC8572ELVTAVNE combines a dual PowerPC e500 core architecture with integrated memory controllers, multi-port Gigabit Ethernet and on-chip security features to deliver a balanced mix of processing performance and system integration. Its combination of SPE/APU capabilities and hardware security primitives makes it suitable for embedded designs that require both signal-processing and protected communications.

Manufactured by NXP Semiconductors and provided in a compact 1023-FCBGA surface-mount package with a defined 0 °C to 105 °C operating range, the MPC8572ELVTAVNE is positioned for designers seeking a robust, integrated MPU platform for embedded networking, industrial control and secure communications applications.

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