MPC8572EPXATLD

IC MPU MPC85XX 1.2GHZ 1023FCBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.2GHz 1023-FCBGA (33x33)

Quantity 587 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8572
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e500Device Package1023-FCBGA (33x33)Mounting TypeSurface Mount
Number of Cores/Bus Width2 Core, 32-BitOperating Temperature0°C – 105°CPackage / CaseTray
Speed1.2GHzVoltage1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8572EPXATLD – PowerPC e500 Dual‑Core 1.2 GHz MPU

The MPC8572EPXATLD is a dual‑core PowerPC e500 microprocessor designed for embedded systems. It integrates two Book E‑enhanced 32‑bit cores running at 1.2 GHz and delivers a tightly integrated set of memory controllers and high‑speed interfaces suited to communications and control applications.

With on‑chip cache, signal‑processing and floating‑point engines, DDR2/DDR3 memory support, and hardware security primitives, the MPC8572EPXATLD provides a compact, system‑level processing foundation for embedded designs that require compute density and a broad peripheral set.

Key Features

  • Dual PowerPC e500 cores: Two Book E‑enhanced 32‑bit cores operating at 1.2 GHz for parallel embedded processing.
  • On‑chip caches: 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and per‑line or full locking control.
  • Signal‑processing and floating‑point engines: SPE auxiliary processing unit for 64‑bit integer/fractional vector ops, embedded vector and scalar single‑precision FPUs, and a double‑precision floating‑point APU for 64‑bit FP operations.
  • Memory subsystem: Integrated DDR2 and DDR3 SDRAM controller for modern embedded memory configurations; supports 36‑bit real addressing and an MMU for advanced memory management.
  • Security primitives: Hardware cryptography support and a random number generator to enable embedded secure functions.
  • Rich peripheral and interface set: Built‑in controllers and interfaces referenced in the hardware specifications include enhanced three‑speed Ethernet (eTSEC), PCI Express, Serial RapidIO, high‑speed serial interfaces (HSSI), I2C, GPIO, DUART, JTAG and local bus controller (eLBC).
  • Package and mounting: 1023‑FCBGA (33×33) supplier device package in a surface‑mount form factor supplied in tray packaging.
  • Qualification: Consumer‑qualified device suitable for consumer embedded product designs.

Typical Applications

  • Embedded communications: Systems that require integrated Ethernet, PCIe or Serial RapidIO interfaces with on‑chip processing and memory controllers.
  • Control and automation: Embedded control platforms leveraging dual cores, SPE and FPUs for signal processing and control algorithms.
  • Appliance and consumer electronics: Consumer‑grade embedded products that benefit from integrated DDR2/DDR3 support and hardware security features.

Unique Advantages

  • Concurrent dual‑core processing: Two identical PowerPC e500 cores enable parallel task execution for responsive embedded workloads.
  • Integrated memory and I/O: DDR2/DDR3 controller plus a broad set of peripheral controllers reduce external component count and simplify system design.
  • On‑chip signal and floating‑point engines: SPE and single‑/double‑precision FPUs accelerate math‑intensive routines without relying on external accelerators.
  • Hardware security primitives: Built‑in cryptography and random number generation support secure functions directly on the processor.
  • Compact, manufacturable package: 1023‑FCBGA (33×33) surface‑mount package facilitates high‑density board layouts and automated assembly.
  • Backed by a documented hardware specification: Detailed processor hardware documentation covers DDR controllers, Ethernet, PCIe, Serial RapidIO, I/O and system design guidance to support development.

Why Choose MPC8572EPXATLD?

The MPC8572EPXATLD positions itself as a system‑level microprocessor for embedded designs that need dual PowerPC e500 cores at 1.2 GHz, integrated memory controllers for DDR2/DDR3, and a comprehensive set of interfaces. Its combination of on‑chip caches, signal‑processing and floating‑point engines, and hardware security features makes it suitable for embedded communications, control and consumer applications where integration and deterministic processing matter.

Designed and documented by NXP Semiconductors, this device offers a compact package and a broad hardware specification set to help reduce BOM complexity and accelerate development for teams building scalable, robust embedded systems.

Request a quote or contact sales to discuss availability, lead times and how the MPC8572EPXATLD can fit into your next embedded design.

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