MPC8572EPXAULD
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 2 Core, 32-Bit 1.333GHz 1023-FCBGA (33x33) |
|---|---|
| Quantity | 57 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8572 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e500 | Device Package | 1023-FCBGA (33x33) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | 0°C – 105°C | Package / Case | Tray | ||
| Speed | 1.333GHz | Voltage | 1.5V, 1.8V, 2.5V, 3.3V |
Overview of MPC8572EPXAULD – IC MPU MPC85XX 1.333GHZ 1023BGA
The MPC8572EPXAULD is a PowerPC e500 based microprocessor from the MPC8572 series, featuring two 32-bit Book E-enhanced cores running at 1.333 GHz in a 1023‑FCBGA (33×33) package. It targets embedded microprocessor applications that require on-chip memory controllers, high-speed interfaces and hardware security capabilities.
Designed for consumer-qualified embedded systems, the device integrates processing, memory interface support and a range of high-speed peripherals to simplify system design and accelerate time-to-market.
Key Features
- Dual e500 Cores Two high-performance, 32-bit Book E-enhanced cores running at 1.333 GHz, providing symmetric processing capability for embedded workloads.
- On-chip Memory Controllers Integrated controllers for DDR2 and DDR3 memory to support modern embedded memory architectures.
- Cache and Processing Engines 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; caches can be locked entirely or on a per-line basis. Includes a Signal-Processing Engine (SPE) APU plus embedded vector/scalar single-precision and double-precision floating-point APUs.
- Security Hardware cryptography features and a Random Number Generator for embedded security functions.
- Rich I/O and High-Speed Interfaces Documented devices and functional blocks include enhanced three-speed Ethernet (eTSEC), PCI Express, Serial RapidIO, High-Speed Serial Interfaces (HSSI) and other peripheral controllers as outlined in the hardware specification.
- Addressing and Memory Management 36-bit real addressing and an integrated Memory Management Unit (MMU) for large-address embedded systems and virtual memory support.
- Package and Mounting Supplied in a 1023‑FCBGA (33×33) package, surface-mountable for dense board-level integration.
- Qualification Consumer-qualified device suitable for consumer-class embedded designs.
Typical Applications
- Embedded Networking & Communications Use in embedded networking platforms that benefit from the device’s Ethernet and high-speed serial interfaces.
- High-Performance Embedded Compute Suitable for compute-intensive embedded tasks that leverage the dual e500 cores, SPE APU and floating-point engines.
- Memory-Driven Systems Systems requiring DDR2/DDR3 DRAM support and 36-bit addressing can take advantage of the integrated memory controllers and MMU.
- I/O-Rich Embedded Platforms Designs that require PCI Express, Serial RapidIO or HSSI connectivity can use the device’s documented high-speed interfaces.
Unique Advantages
- Dual-Core Processing: Two identical Book E-enhanced e500 cores provide parallel processing capability for multitasking and throughput-oriented embedded workloads.
- Integrated Memory Support: Built-in DDR2 and DDR3 controllers reduce external component count and simplify memory subsystem design.
- Comprehensive On-Chip Engines: Combined SPE, single-precision and double-precision FPUs and cache locking enable efficient handling of signal-processing and numeric workloads.
- Hardware Security Blocks: On-chip cryptography and a random number generator support secure boot and runtime security features without adding external crypto accelerators.
- Extensive Peripheral Set: Documented support for Ethernet, PCIe, Serial RapidIO and HSSI provides flexible connectivity options for a wide range of embedded systems.
- Compact, Surface-Mount Package: The 1023‑FCBGA (33×33) package enables high-density board layouts for space-constrained designs.
Why Choose MPC8572EPXAULD?
The MPC8572EPXAULD combines dual PowerPC e500 cores, on-chip DDR2/DDR3 memory controllers, hardware security functions and an extensive set of high-speed interfaces in a compact 1023‑FCBGA package. This integration helps reduce BOM complexity while providing the processing and I/O resources needed for embedded networking, compute and I/O‑centric applications.
With consumer qualification and a hardware specification that documents Ethernet, PCI Express, Serial RapidIO, HSSI and other subsystems, the device is a fit for designers seeking a scalable, well-documented embedded processor platform backed by the MPC8572 series hardware specifications.
Request a quote or submit a quote request to obtain pricing, availability and additional procurement details for the MPC8572EPXAULD.

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Headquarters: Eindhoven, North Brabant, Netherlands
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