MPC862PVR66B

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 75 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC862
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC862PVR66B – IC MPU MPC8XX 66MHZ 357BGA

The MPC862PVR66B is a single‑core 32‑bit microprocessor in the MPC862 PowerQUICC family from NXP Semiconductors. It implements the MPC8xx PowerPC architecture and is optimized for embedded communications and controller applications where integrated protocol handling and multiple Ethernet interfaces are required.

With a 66 MHz core, on‑chip communications co‑processing and DRAM controller support, this device delivers a compact, RoHS‑compliant solution for consumer and embedded networking systems that require surface‑mount PBGA packaging and broad operating temperature support.

Key Features

  • Core and Architecture Embedded single‑issue, 32‑bit MPC8xx core implementing the PowerPC architecture; the MPC862P variant includes a 16 KB instruction cache and an 8 KB data cache for improved code and data locality.
  • Performance 66 MHz core clock speed suitable for control and communications tasks in embedded systems.
  • Memory and MMU On‑chip MMUs with a 32‑entry TLB and support for multiple page sizes (including 4 KB, 16 KB, 512 KB and 8 MB), plus DRAM controller support for system memory interfacing.
  • Communications Co‑processing (CPM) Integrated communications co‑processor resources (CPM) to offload protocol and communications processing tasks.
  • Ethernet Interfaces Multiple Ethernet ports: four 10 Mbps ports and one 10/100 Mbps port, enabling diverse network connectivity options.
  • Protocol Interfaces Additional supported interfaces include HDLC/SDLC for serial framed communications and protocol handling.
  • Power and I/O 3.3 V I/O voltage compatibility for common embedded system designs.
  • Package and Mounting 357‑ball PBGA (25 × 25 mm) surface‑mount package for compact board designs.
  • Operating Range and Compliance Operating temperature range 0 °C to 105 °C and RoHS‑compliant manufacturing.

Typical Applications

  • Communications & Networking Equipment Use as a controller and protocol offload processor in routers, switches and other network appliances requiring multiple Ethernet ports and HDLC/SDLC support.
  • Embedded Controllers Suitable for embedded control systems that need a PowerPC architecture core with on‑chip DRAM controller and MMU support.
  • Telecom and Protocol Processing Designed for systems that benefit from integrated CPM resources for handling communications tasks and protocol framing.
  • Consumer Networking Devices Targeted at consumer‑grade networking and communications products where RoHS compliance and compact PBGA packaging are important.

Unique Advantages

  • Integrated PowerPC MPC8xx Core: Single 32‑bit PowerPC core with instruction and data caches (16 KB and 8 KB on the MPC862P) to improve execution efficiency for embedded workloads.
  • On‑Chip Communications Resources (CPM): Dedicated communications co‑processing support reduces host CPU load for protocol and data‑plane tasks.
  • Multiple Ethernet Ports: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible connectivity options for diverse network topologies.
  • Memory Management and DRAM Support: 32‑entry TLB and support for multiple page sizes combined with DRAM controller capability simplify system memory architecture.
  • Compact PBGA Package: 357‑ball PBGA (25 × 25 mm) minimizes board area while supporting surface‑mount assembly processes.
  • Broad Operating Temperature and RoHS Compliance: 0 °C to 105 °C rating and RoHS‑compliant construction support reliable deployment in consumer and embedded environments.

Why Choose MPC862PVR66B?

The MPC862PVR66B balances an embedded PowerPC MPC8xx core with integrated communications co‑processing, multiple Ethernet interfaces and DRAM controller support to deliver a compact, purpose‑built solution for embedded networking and controller applications. Its PBGA package, 3.3 V I/O compatibility and RoHS compliance make it suitable for space‑constrained, assembly‑friendly board designs.

As a member of the MPC862 PowerQUICC family from NXP Semiconductors, the MPC862PVR66B is positioned for designers seeking a reliable, integrated processor option for consumer and embedded communications systems where protocol handling, multiple network interfaces and memory management are required.

Request a quote or submit a parts inquiry to get pricing, availability, and additional technical information for the MPC862PVR66B.

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