MPC862TZQ100B

IC MPU MPC8XX 100MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25)

Quantity 1,683 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC862
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed100MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC862TZQ100B – IC MPU MPC8XX 100MHz 357-PBGA

The MPC862TZQ100B is an NXP Semiconductors embedded microprocessor from the MPC862 PowerQUICC family, featuring a single PowerPC-based MPC8xx core. With a 32-bit architecture running at 100 MHz and integrated communications peripherals, it is designed for embedded controller and communications/networking applications that require on-chip protocol handling and multiple Ethernet interfaces.

This device combines processor, communications co‑processing and DRAM interface capabilities in a 357‑PBGA surface‑mount package, offering a compact, RoHS‑compliant solution for consumer‑qualified designs operating from 0 °C to 105 °C.

Key Features

  • Core – Embedded single‑issue 32‑bit MPC8xx core implementing the PowerPC architecture; single core operating at 100 MHz.
  • Memory and MMU – On‑chip support for DRAM controllers; datasheet family features include instruction/data caches and a 32‑entry TLB for virtual memory management.
  • Communications Co‑processor (CPM) – Integrated communications processing resources for protocol handling and DSP‑style communications tasks.
  • Ethernet Interfaces – Multiple Ethernet controllers: four 10 Mbps interfaces and one 10/100 Mbps interface to support varied networking topologies.
  • Serial and Protocol Interfaces – Additional interfaces include HDLC/SDLC for serial protocol framing and communications link support.
  • Power and I/O – 3.3 V I/O signaling to match common embedded peripheral voltage domains.
  • Package and Mounting – 357‑PBGA supplier device package (25 × 25 mm), surface‑mount for dense board layouts.
  • Qualification and Compliance – Consumer qualification with RoHS compliance.
  • Operating Temperature – Rated for 0 °C to 105 °C operation.

Typical Applications

  • Communications & Networking Systems – On‑chip CPM and multiple Ethernet ports enable protocol handling and packet‑level processing for routers, gateways, and network appliances.
  • Embedded Controllers – Single‑chip integration of CPU, DRAM controller and I/O interfaces suits compact embedded control platforms requiring deterministic processing.
  • Protocol Gateways and Interface Units – HDLC/SDLC support and flexible Ethernet options make the device suitable for protocol conversion and interfacing modules in consumer networking equipment.

Unique Advantages

  • Integrated communications processing: The on‑chip CPM reduces external controller requirements for protocol handling, lowering BOM and board complexity.
  • Multi‑port Ethernet capability: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible network connectivity options without additional PHY/controller chips.
  • Compact surface‑mount packaging: The 357‑PBGA (25×25 mm) package enables dense PCB layouts for space‑constrained embedded designs.
  • Designed for embedded use: Consumer qualification and an operating range of 0 °C to 105 °C align the device with many consumer and commercial embedded applications.
  • Standard 3.3 V I/O: 3.3 V signaling simplifies interfacing with common peripheral devices and board ecosystems.
  • RoHS compliant: Environmentally compliant manufacturing and supply chain handling.

Why Choose MPC862TZQ100B?

The MPC862TZQ100B positions itself as a compact, communication‑focused embedded microprocessor combining a PowerPC‑based MPC8xx core with on‑chip communications processing, DRAM support and multiple Ethernet interfaces. Its integration reduces external components and simplifies board design for consumer‑qualified networking and embedded controller products.

This device is well suited for designers seeking a single‑chip solution with protocol handling capabilities and multiple Ethernet links in a surface‑mount PBGA package, providing a straightforward path to compact, network‑enabled products backed by the MPC862 family specifications.

Request a quote or submit a sourcing inquiry today to get pricing and availability for the MPC862TZQ100B.

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