MPC866PCZP100A

IC MPU MPC8XX 100MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25)

Quantity 1,204 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC866
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed100MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC866PCZP100A – IC MPU MPC8XX 100MHZ 357BGA

The MPC866PCZP100A is a single-core, 32‑bit microprocessor in the MPC8xx family, featuring a 100 MHz PowerPC™‑architecture core and integrated communications peripherals. It is designed for embedded and networking controller applications that require deterministic processing, multiple Ethernet interfaces, and industrial temperature operation.

This device delivers an integrated solution optimized for communications and controller systems, combining a PowerPC core with on‑chip CPM and DRAM controller support to simplify board-level design and system integration.

Key Features

  • Core  Embedded single-issue 32‑bit PowerPC core running at 100 MHz.
  • Cache and MMU  MPC866P family cache configuration with a 16 KB instruction cache and 8 KB data cache; MMU with 32‑entry TLB and support for multiple page sizes (4, 16, 512 KB) as documented for the MPC866 series.
  • Communications and Co‑processing  Includes Communications Processor Module (CPM) and communications DSP support for protocol handling and peripheral offload.
  • Memory Controller  Integrated DRAM controller to support system memory interfacing.
  • Ethernet and Serial Interfaces  Multiple Ethernet channels: four 10 Mbps ports and one 10/100 Mbps port; additional HDLC/SDLC interface support for serial link protocols.
  • Electrical  3.3 V I/O voltage for compatibility with common embedded logic levels.
  • Package and Mounting  357‑ball PBGA package (25 × 25 mm) with surface‑mount assembly.
  • Qualification and Temperature  Industrial qualification and an operating temperature range of −40 °C to 100 °C.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Networking Equipment  Protocol processing and control in switches, routers, and other network appliances using the device’s multiple Ethernet ports and CPM features.
  • Communications Controllers  Embedded controllers for telecom and data communications leveraging HDLC/SDLC interfaces and on‑chip communications coprocessing.
  • Industrial Control Systems  Deterministic embedded processing for industrial controllers and automation equipment requiring industrial temperature operation.
  • Embedded Networking Appliances  Single‑chip integration for small form‑factor appliances that need DRAM interface support and a 3.3 V I/O interface.

Unique Advantages

  • Integrated Communications Subsystem: On‑chip CPM and communications DSP support reduce external components and simplify protocol offload.
  • Multiple Ethernet Interfaces: Four 10 Mbps ports plus one 10/100 Mbps port provide flexible network connectivity options without additional PHY complexity.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployments in demanding environments.
  • PowerPC Architecture with Cache: 100 MHz PowerPC core with documented instruction and data caches and MMU features for efficient embedded code execution.
  • Compact BGA Package: 357‑ball PBGA (25 × 25 mm) surface‑mount package enables high‑density board designs.
  • RoHS Compliance: Environmentally compliant manufacturing to meet regulatory requirements.

Why Choose MPC866PCZP100A?

The MPC866PCZP100A positions itself as a compact, industrial‑qualified microprocessor tailored for communications and embedded control applications. Its 100 MHz PowerPC core, integrated CPM, DRAM controller, and multiple Ethernet interfaces deliver a balanced combination of processing and connectivity in a single device from NXP Semiconductors.

This part is suited to designers seeking an integrated communications‑focused MPU with industrial temperature capability and 3.3 V I/O. The MPC866PCZP100A supports streamlined BOMs and board layouts where on‑chip peripheral integration and deterministic embedded performance matter.

Request a quote or submit an RFQ today to begin procurement of the MPC866PCZP100A for your embedded communications and control projects.

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