MPC866PVR133A

IC MPU MPC8XX 133MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25)

Quantity 687 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC866
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed133MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC866PVR133A – IC MPU MPC8XX 133MHZ 357BGA

The MPC866PVR133A is a single‑core, 32‑bit MPC8xx microprocessor running at 133 MHz, designed for embedded controller and communications applications. Built on the MPC866 PowerQUICC family architecture, the device integrates a PowerPC™‑based core with on‑chip communications peripherals to support networking and controller functions in consumer and embedded products.

With integrated DRAM controller support, a Communications Processor Module (CPM), multiple Ethernet interfaces and 3.3 V I/O, the MPC866PVR133A targets applications that require a compact, communications‑focused processor in a 357‑ball PBGA package.

Key Features

  • Processor Core  Embedded single‑issue, 32‑bit PowerPC architecture core operating at 133 MHz.
  • Cache and MMU  MPC866P family cache configuration with up to 16 KB instruction cache and 8 KB data cache; MMU with 32‑entry TLB and support for multiple page sizes (4 KB, 16 KB, 512 KB) as documented for the MPC866 family.
  • Communications Coprocessor (CPM)  On‑chip CPM and communications DSP functionality to handle protocol processing and offload the main core for networking tasks.
  • Memory Interface  Integrated DRAM controller to support external memory subsystems for application code and data.
  • Ethernet Ports  Multiple Ethernet interfaces: four 10 Mbps ports and one 10/100 Mbps port for flexible network connectivity options.
  • Serial/Protocol Interfaces  Additional interfaces including HDLC/SDLC for common serial and link‑level protocol support.
  • I/O Voltage and Mounting  3.3 V I/O signaling and surface‑mount 357‑PBGA (25 × 25 mm) package for compact board integration.
  • Operating Range and Qualification  Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.
  • Graphics  No integrated graphics acceleration.

Typical Applications

  • Embedded Communications Equipment  Use in routers, gateways and protocol converters where integrated CPM and multiple Ethernet ports simplify board design.
  • Networking Controllers  Suitable for network interface controllers and appliance control planes requiring serial protocol support (HDLC/SDLC) and Ethernet connectivity.
  • Consumer Embedded Systems  Fits consumer‑grade embedded designs needing a compact PowerPC‑based processor with integrated memory and communications peripherals.

Unique Advantages

  • Integrated Communications Subsystem  On‑chip CPM and communications DSP support reduce external component count for protocol handling and offload the main core.
  • Multiple Ethernet Interfaces  Four 10 Mbps ports plus one 10/100 Mbps port provide flexible LAN/WAN connectivity options without extensive external PHYs.
  • PowerPC Architecture  Proven 32‑bit PowerPC core architecture with hardware MMU and cache features for deterministic embedded performance.
  • Compact PBGA Package  357‑ball PBGA (25 × 25 mm) surface‑mount package enables high‑density board layouts for space‑constrained designs.
  • Standard 3.3 V I/O and RoHS Compliance  3.3 V I/O simplifies integration with common logic families and RoHS compliance supports environmental requirements.
  • Consumer Qualification and Temperature Range  Qualified for consumer applications with an operating range of 0 °C to 95 °C for typical embedded environments.

Why Choose MPC866PVR133A?

The MPC866PVR133A combines a PowerPC‑based single core with integrated communications peripherals and memory interface capabilities from the MPC866 PowerQUICC family, delivering a compact, communications‑focused processor solution. Its on‑chip CPM, multiple Ethernet interfaces and HDLC/SDLC support make it well suited for embedded networking and controller applications where integration and simplified BOM are priorities.

Manufactured by NXP Semiconductors and RoHS compliant, the MPC866PVR133A is targeted at designers of consumer and embedded networking products who need a compact PBGA package, 3.3 V I/O compatibility, and a processor built around the MPC866 family feature set.

Request a quote or submit an inquiry to receive pricing and availability for the MPC866PVR133A.

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