MPC866TCZP100A

IC MPU MPC8XX 100MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 100MHz 357-PBGA (25x25)

Quantity 792 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC866
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed100MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC866TCZP100A – IC MPU MPC8XX 100MHz 357-PBGA

The MPC866TCZP100A is a single‑core, 32‑bit microprocessor in the MPC8xx family, based on an embedded PowerPC core. Designed as an integrated microprocessor and peripheral combination, it targets controller, communications and networking applications that require deterministic processing and on‑chip communications functionality.

Key device attributes include a 100 MHz core clock, 3.3 V I/O, multiple Ethernet interfaces and industrial temperature qualification, delivering a compact, board‑level solution in a 357‑ball PBGA (25 × 25 mm) surface‑mount package.

Key Features

  • Core and Architecture Embedded single‑issue 32‑bit PowerPC core with support for the MPC8xx family architecture and on‑chip MMU/TLB features referenced in the MPC866 family documentation.
  • Performance 100 MHz core frequency suitable for embedded controller and communications tasks.
  • Communications Co‑processor (CPM) Integrated CPM communications functionality and DSP support for serial and protocol offload.
  • Ethernet Interfaces Multiple Ethernet ports: four 10 Mbps interfaces and one 10/100 Mbps interface for flexible network connectivity.
  • Serial and HDLC/SDLC Interfaces Additional interfaces include HDLC/SDLC for protocol framing and synchronous communications.
  • Memory Controller On‑chip DRAM controller support for system memory integration.
  • Voltage and Mounting 3.3 V I/O signaling and a surface‑mount 357‑PBGA (25 × 25 mm) package for compact PCB implementations.
  • Industrial Qualification and Temperature Range Qualified for industrial use with an operating temperature range of −40 °C to 100 °C.
  • RoHS Compliant Manufactured in compliance with RoHS directives.

Typical Applications

  • Communications Equipment Packet‑handling and protocol offload for routers, switches and network modules using integrated CPM and multiple Ethernet interfaces.
  • Embedded Controllers General‑purpose controllers where a 32‑bit PowerPC core and on‑chip DRAM controller provide deterministic control and memory support.
  • Industrial Networking Industrial gateways and networked controllers that require industrial temperature operation and multiple Ethernet connections.
  • Telecommunications Systems Systems using HDLC/SDLC and CPM features for framed, synchronous communications and legacy protocol support.

Unique Advantages

  • Integrated Communications Subsystem: On‑chip CPM and DSP support reduce external components and simplify designs that require serial protocol handling and offload.
  • Multiple Ethernet Ports: Four 10 Mbps ports plus a 10/100 Mbps port provide flexible connectivity options without additional PHYs for certain architectures.
  • Industrial Temperature Rating: −40 °C to 100 °C operating range supports deployments in demanding environmental conditions.
  • Compact PBGA Package: 357‑ball PBGA (25 × 25 mm) delivers high I/O density in a compact surface‑mount footprint suitable for space‑constrained boards.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O eases integration with common memory, PHY and peripheral components.
  • RoHS Compliance: Environmentally compliant manufacturing simplifies regulatory planning for assemblies.

Why Choose MPC866TCZP100A?

The MPC866TCZP100A positions itself as a compact, industrial‑qualified microprocessor solution for communications and embedded control designs that benefit from integrated CPM communications, multiple Ethernet interfaces and a 32‑bit PowerPC core running at 100 MHz. Its combination of on‑chip peripherals and a PBGA footprint helps reduce board BOM and streamline system integration.

Backed by the MPC8xx family specification set and NXP Semiconductors heritage, the device is suited to customers developing networking modules, industrial gateways and embedded controllers that require long‑term availability, protocol flexibility and robust thermal performance.

Request a quote or submit an inquiry to get pricing, availability and technical support for the MPC866TCZP100A.

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