MPC866TZP133A

IC MPU MPC8XX 133MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25)

Quantity 529 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC866
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (4), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed133MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC866TZP133A – IC MPU MPC8XX 133MHZ 357PBGA

The MPC866TZP133A is a single-core embedded microprocessor IC based on the MPC8xx family, implementing a 32-bit PowerPC core at 133 MHz. It combines processor performance with integrated communications peripherals and multiple Ethernet interfaces, targeting embedded controller and networking applications where integrated connectivity and predictable processing are required.

Designed for surface-mount implementation, the device delivers an integrated DRAM controller and Communications Processor Module (CPM) to simplify system design for communications, controller, and networked embedded systems.

Key Features

  • Processor Core  Single 32-bit MPC8xx core running at 133 MHz for embedded processing tasks.
  • Power and I/O  3.3 V I/O voltage to align with common embedded system power domains.
  • Communications Processor Module (CPM)  Integrated CPM and communications co-processor capability to support protocol handling and offload tasks from the main core.
  • Ethernet Connectivity  Multiple Ethernet interfaces including four 10 Mbps ports and one 10/100 Mbps port for flexible networking topologies.
  • Bus and Memory Support  On-chip DRAM controller to interface with external memory and support system data buffering and code execution.
  • Protocol Interfaces  Additional protocol support such as HDLC/SDLC for serial line communications and protocol framing.
  • Family-Level Memory and MMU Features  MPC8xx family implementations include data and instruction cache options and MMUs with a 32-entry TLB and support for multiple page sizes (family feature set).
  • Package and Mounting  357-pin PBGA (25×25 mm) package, surface-mount affording compact board-level integration.
  • Operating Range and Compliance  Specified operating temperature range 0 °C to 95 °C and RoHS compliant.

Typical Applications

  • Networking Equipment  Use in routers, switches, and gateway devices where integrated Ethernet ports and CPM-based protocol handling reduce external component count.
  • Communications Modules  Ideal for communication line adapters and protocol converters that benefit from HDLC/SDLC support and on-chip CPM resources.
  • Embedded Controllers  Suitable for general embedded controller applications requiring a 32-bit PowerPC core, DRAM interfacing, and reliable operation in 0 °C–95 °C environments.
  • Industrial Networking  Deployment in industrial network endpoints and monitoring devices leveraging multiple Ethernet interfaces and surface-mount packaging for compact designs.

Unique Advantages

  • Integrated Communications Processing: On-chip CPM and communications co-processor functionality reduce external logic and simplify protocol handling.
  • Multi-port Ethernet Support: Four 10 Mbps plus one 10/100 Mbps Ethernet interfaces provide flexible connectivity options for networked embedded designs.
  • Compact PBGA Packaging: 357-pin PBGA (25×25 mm) enables high pin count integration in a compact surface-mount form factor.
  • Embedded PowerPC Architecture: Single-issue 32-bit PowerPC core with family-level cache and MMU features provides a familiar architecture for embedded developers.
  • System-Level Integration: On-chip DRAM controller and serial protocol interfaces reduce BOM and board complexity for communications and controller applications.
  • Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose MPC866TZP133A?

The MPC866TZP133A combines a 32-bit PowerPC core with integrated communications peripherals and multiple Ethernet ports to deliver a compact, well-connected solution for embedded networking and controller applications. Its on-chip DRAM controller, CPM, and protocol interfaces help reduce external components while supporting predictable embedded processing.

This device is suited to designers building communications modules, network endpoints, and embedded controllers who need an integrated processing and connectivity platform with RoHS compliance and a practical operating temperature range.

Request a quote or submit a pricing inquiry to evaluate the MPC866TZP133A for your next embedded or networking design.

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