MPC870CZT133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 719 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC870 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 133MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC870CZT133 – IC MPU MPC8XX 133MHZ 256BGA
The MPC870CZT133 is a single‑core 32‑bit microprocessor based on the MPC8xx core, running at 133 MHz and designed for embedded controller, communications and networking applications. The device integrates a system integration unit and a communications processor module (CPM) to consolidate processing and peripheral functions on a single chip.
With integrated DRAM controllers, dual 10/100 Mbps Ethernet controllers, USB 2.0, I2C and a 256‑pin PBGA surface‑mount package, the MPC870CZT133 targets industrial embedded designs that require a compact, communication‑focused MPU with industrial temperature qualification.
Key Features
- Core and Architecture Single‑issue MPC8xx 32‑bit core at 133 MHz with MMU support and thirty‑two 32‑bit general‑purpose registers.
- Caches 8 KB instruction cache and 8 KB data cache to improve code and data locality for embedded workloads.
- Communication Offload (CPM) Integrated Communications Processor Module (CPM) for communications and protocol processing tasks.
- Ethernet Two 10/100 Mbps Ethernet controllers for dual‑port network connectivity.
- USB and I2C On‑chip USB 2.0 controller and I2C interface for peripheral and host connectivity.
- Memory Interface Built‑in DRAM controller to support system memory needs.
- Bus and Timing External bus maximum operation up to 80 MHz in 1:1 mode; 133 MHz core operation supports 2:1 mode.
- Power and I/O 3.3 V I/O voltage for common embedded system compatibility.
- Package and Mounting 256‑pin PBGA surface‑mount package (256‑PBGA, 23x23 mm) for compact board integration.
- Operating Range and Qualification Industrial qualification with operating temperature range −40°C to 100°C and RoHS compliance.
Typical Applications
- Industrial Controllers Use as the main processing unit for industrial control systems where an industrial temperature range and integrated communications are required.
- Networking Equipment Suitable for embedded routers, switches or network appliances that benefit from dual 10/100 Mbps Ethernet and CPM offload.
- Communications Gateways Ideal for protocol conversion and edge gateway devices that need USB, I2C and DRAM interfacing alongside communications processing.
- Embedded Systems Compact PBGA package and integrated peripherals make it a fit for space‑constrained embedded designs requiring reliable connectivity.
Unique Advantages
- Integrated Communications Subsystem: CPM integration reduces external component count for protocol handling and network tasks.
- Dual Ethernet Ports: Two 10/100 Mbps Ethernet controllers enable flexible network topologies and segregated data paths without extra PHYs on board.
- Balanced On‑Chip Peripherals: USB 2.0, I2C and DRAM controller support a wide range of peripheral and memory configurations from a single device.
- Industrial Temperature Qualification: Rated for −40°C to 100°C operation, supporting deployment in harsh or industrial environments.
- Compact PBGA Package: 256‑pin PBGA (23x23) surface‑mount package enables dense board layouts while providing significant I/O connectivity.
- RoHS Compliant: Meets lead‑free requirements for regulatory and manufacturing consistency.
Why Choose MPC870CZT133?
The MPC870CZT133 positions itself as a communication‑centric embedded microprocessor combining a 133 MHz MPC8xx core with a Communications Processor Module, dual Ethernet, USB and DRAM controller functionality in a single 256‑pin PBGA device. This integration simplifies bill‑of‑materials and PCB design for networked embedded systems and industrial controllers.
Engineers designing industrial and communications products will find the device well suited for applications requiring compact integration, reliable operation across −40°C to 100°C, and a feature set tailored to networking and protocol handling. The MPC870CZT133 offers a durable platform for scalable embedded solutions with vendor datasheet support for hardware, power and timing details.
Request a quote or submit a purchase inquiry today to evaluate the MPC870CZT133 for your next embedded or communications design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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