MPC870CZT133

IC MPU MPC8XX 133MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)

Quantity 719 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC870
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed133MHzSupplier Device Package256-PBGA (23×23)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC870CZT133 – IC MPU MPC8XX 133MHZ 256BGA

The MPC870CZT133 is a single‑core 32‑bit microprocessor based on the MPC8xx core, running at 133 MHz and designed for embedded controller, communications and networking applications. The device integrates a system integration unit and a communications processor module (CPM) to consolidate processing and peripheral functions on a single chip.

With integrated DRAM controllers, dual 10/100 Mbps Ethernet controllers, USB 2.0, I2C and a 256‑pin PBGA surface‑mount package, the MPC870CZT133 targets industrial embedded designs that require a compact, communication‑focused MPU with industrial temperature qualification.

Key Features

  • Core and Architecture  Single‑issue MPC8xx 32‑bit core at 133 MHz with MMU support and thirty‑two 32‑bit general‑purpose registers.
  • Caches  8 KB instruction cache and 8 KB data cache to improve code and data locality for embedded workloads.
  • Communication Offload (CPM)  Integrated Communications Processor Module (CPM) for communications and protocol processing tasks.
  • Ethernet  Two 10/100 Mbps Ethernet controllers for dual‑port network connectivity.
  • USB and I2C  On‑chip USB 2.0 controller and I2C interface for peripheral and host connectivity.
  • Memory Interface  Built‑in DRAM controller to support system memory needs.
  • Bus and Timing  External bus maximum operation up to 80 MHz in 1:1 mode; 133 MHz core operation supports 2:1 mode.
  • Power and I/O  3.3 V I/O voltage for common embedded system compatibility.
  • Package and Mounting  256‑pin PBGA surface‑mount package (256‑PBGA, 23x23 mm) for compact board integration.
  • Operating Range and Qualification  Industrial qualification with operating temperature range −40°C to 100°C and RoHS compliance.

Typical Applications

  • Industrial Controllers  Use as the main processing unit for industrial control systems where an industrial temperature range and integrated communications are required.
  • Networking Equipment  Suitable for embedded routers, switches or network appliances that benefit from dual 10/100 Mbps Ethernet and CPM offload.
  • Communications Gateways  Ideal for protocol conversion and edge gateway devices that need USB, I2C and DRAM interfacing alongside communications processing.
  • Embedded Systems  Compact PBGA package and integrated peripherals make it a fit for space‑constrained embedded designs requiring reliable connectivity.

Unique Advantages

  • Integrated Communications Subsystem: CPM integration reduces external component count for protocol handling and network tasks.
  • Dual Ethernet Ports: Two 10/100 Mbps Ethernet controllers enable flexible network topologies and segregated data paths without extra PHYs on board.
  • Balanced On‑Chip Peripherals: USB 2.0, I2C and DRAM controller support a wide range of peripheral and memory configurations from a single device.
  • Industrial Temperature Qualification: Rated for −40°C to 100°C operation, supporting deployment in harsh or industrial environments.
  • Compact PBGA Package: 256‑pin PBGA (23x23) surface‑mount package enables dense board layouts while providing significant I/O connectivity.
  • RoHS Compliant: Meets lead‑free requirements for regulatory and manufacturing consistency.

Why Choose MPC870CZT133?

The MPC870CZT133 positions itself as a communication‑centric embedded microprocessor combining a 133 MHz MPC8xx core with a Communications Processor Module, dual Ethernet, USB and DRAM controller functionality in a single 256‑pin PBGA device. This integration simplifies bill‑of‑materials and PCB design for networked embedded systems and industrial controllers.

Engineers designing industrial and communications products will find the device well suited for applications requiring compact integration, reliable operation across −40°C to 100°C, and a feature set tailored to networking and protocol handling. The MPC870CZT133 offers a durable platform for scalable embedded solutions with vendor datasheet support for hardware, power and timing details.

Request a quote or submit a purchase inquiry today to evaluate the MPC870CZT133 for your next embedded or communications design.

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