MPC870CVR66
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 918 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC870 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 66MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC870CVR66 – IC MPU MPC8XX 66MHz 256PBGA
The MPC870CVR66 is a 32-bit microprocessor IC based on the MPC8xx core and Power Architecture technology, delivering a 66 MHz operating frequency in a single-core configuration. Designed for embedded and communications applications, it combines core processing, memory management and a communications processor module to support networking and controller system integration.
With integrated interfaces including dual 10/100 Mbps Ethernet ports, USB 2.0, I2C and DRAM controller support, the MPC870CVR66 targets industrial embedded systems that require robust connectivity, deterministic control and wide operating temperature capability.
Key Features
- Core and Architecture MPC8xx single 32-bit core built on Power Architecture technology with integrated MMU and instruction/data caches as specified for the MPC875/MPC870 series.
- Performance 66 MHz core frequency suitable for embedded control and communications tasks; supports 1:1 and 2:1 external bus modes at this core frequency per series specifications.
- Communications Processor Module (CPM) Includes CPM functionality for communications and protocol offload, improving system integration for networking applications.
- Ethernet and USB Dual 10/100 Mbps Ethernet ports and a USB 2.0 interface provide wired networking and host/device connectivity options.
- Memory and Bus Support On-chip DRAM controller support and system integration unit features optimize memory interfacing for embedded designs.
- Peripheral Interfaces Additional interfaces such as I2C expand connectivity for sensors and system peripherals.
- Power and I/O 3.3 V I/O supply for compatibility with common embedded peripheral voltage domains.
- Package and Mounting 256-pin PBGA package (23 × 23 mm) in a surface-mount form factor for compact board layouts.
- Industrial Qualification and Temperature Range Industrial qualification with an operating temperature range of −40 °C to 100 °C for use in industrial environments.
- RoHS Compliant Conforms to RoHS requirements for reduced hazardous substances.
Typical Applications
- Communications Equipment Use as a network controller or protocol offload processor leveraging the CPM and dual 10/100 Mbps Ethernet interfaces.
- Industrial Controllers Embedded control systems that require wide temperature operation and deterministic processing for automation and real-time tasks.
- Embedded Networking Appliances Compact networking devices and appliances benefiting from integrated USB, I2C and DRAM controller support.
Unique Advantages
- Integrated Communications Support: CPM plus dual Ethernet and USB 2.0 interfaces reduce external component count for networking-focused designs.
- Power Architecture Core: MPC8xx core with MMU and caches provides a stable, well-defined processing foundation for embedded software.
- Industrial Temperature Range: −40 °C to 100 °C operation enables deployment in demanding industrial environments.
- Compact PBGA Package: 256-PBGA (23×23 mm) delivers a high-pin-count, surface-mount footprint for dense board layouts.
- 3.3 V I/O Compatibility: Standard 3.3 V I/O eases integration with common peripheral devices and interfaces.
Why Choose MPC870CVR66?
The MPC870CVR66 positions itself as a versatile embedded microprocessor for designs that require integrated communications, real-time control and robust thermal tolerance. Its MPC8xx core architecture, combined with CPM functionality, dual Ethernet ports and USB, makes it well suited for networking appliances, industrial controllers and embedded communication systems.
For engineers seeking a compact, industrial-grade solution with established series-level technical characteristics—such as MMU and on-chip caches, DRAM controller support, and flexible bus modes—the MPC870CVR66 provides a balanced mix of integration and predictable performance backed by series documentation and specifications.
Request a quote or submit an inquiry to get pricing and lead-time information for the MPC870CVR66 and to discuss availability for your next embedded design.

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Headquarters: Eindhoven, North Brabant, Netherlands
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