MPC870CVR133

IC MPU MPC8XX 133MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)

Quantity 1,320 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC870
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed133MHzSupplier Device Package256-PBGA (23×23)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC870CVR133 – IC MPU MPC8XX 133MHZ 256BGA

The MPC870CVR133 is a single-core 32-bit microprocessor built on the MPC8xx core architecture, running at 133 MHz. Designed for embedded controller, communications and networking applications, it combines a Power Architecture™‑based CPU with on-chip integration of communications peripherals and system interfaces.

With integrated CPM co‑processor resources, dual 10/100 Mbps Ethernet, USB 2.0 support, DRAM controller capability and industrial temperature qualification, the MPC870CVR133 targets designs that require deterministic processing, on‑chip connectivity and wide operating temperature range.

Key Features

  • Core & Architecture Single 32‑bit MPC8xx core operating at 133 MHz; single‑issue core with Power Architecture™ technology and 32 general‑purpose registers.
  • Memory & Cache Integrated memory management and on‑chip caches including an 8 KB instruction cache and an 8 KB data cache (two‑way, set‑associative) for improved instruction and data throughput.
  • Communications & Co‑processor Communications Processor Module (CPM) co‑processor for offloading communications tasks; supports communications and networking functions.
  • Ethernet & USB Two 10/100 Mbps Ethernet controllers and one USB 2.0 interface to enable wired LAN and host/device connectivity in compact embedded systems.
  • Memory Controller DRAM controller support suitable for system memory interfacing required by embedded applications.
  • System Interfaces Additional interfaces include I2C for peripheral control and system management.
  • Power & I/O Voltage 3.3 V I/O signaling for standard embedded board designs.
  • Package & Mounting Supplied in a 256‑ball PBGA (23 × 23 mm) surface mount package for high‑density board designs.
  • Operating Range & Qualification Industrial qualification with operating temperature range of −40 °C to 100 °C for deployed and harsh‑environment applications.
  • Standards & Compliance RoHS compliant, supporting regulatory and environmental requirements for modern designs.

Typical Applications

  • Networking Equipment Ideal for routers, switches and network appliances that require integrated Ethernet, CPM offload and deterministic packet processing.
  • Industrial Controllers Suited for process controllers and automation gateways needing industrial temperature operation, I/O interfacing and DRAM support.
  • Embedded Communications Systems Use in communications endpoints and protocol converters where USB 2.0 and I2C peripheral management are required alongside Ethernet connectivity.
  • System Integration Platforms Fits compact embedded platforms that benefit from a highly integrated MPU, on‑chip peripherals and a 256‑PBGA footprint.

Unique Advantages

  • Integrated Communications Subsystem: CPM co‑processor and dual 10/100 Ethernet controllers reduce external silicon and simplify board design for networking applications.
  • Deterministic 32‑bit Processing: A single 32‑bit MPC8xx core at 133 MHz with on‑chip MMU and caches delivers predictable execution for control and communications tasks.
  • Wide Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in harsh environments and outdoor enclosures.
  • Compact Package: 256‑PBGA (23×23 mm) surface mount package enables high‑density assemblies while preserving required I/O and peripheral access.
  • Standard 3.3 V I/O: Simplifies interoperability with common peripheral devices and board power domains.
  • Regulatory Compliance: RoHS compliance supports environmental requirements for commercial and industrial products.

Why Choose MPC870CVR133?

The MPC870CVR133 combines a Power Architecture‑based MPC8xx core with a Communications Processor Module, dual Ethernet, USB 2.0 and DRAM controller capability in a single 256‑PBGA package. Its configuration is tailored for embedded and communications systems that need on‑chip integration to lower BOM and simplify board design while maintaining deterministic processing.

With industrial qualification and a wide operating temperature range, the MPC870CVR133 is suitable for developers building ruggedized controllers, networking appliances and compact embedded platforms where long‑term availability, ecosystem documentation and integration support are important design considerations.

If you would like pricing, availability or a formal quote for MPC870CVR133, submit a request and our team will respond with current lead times and purchasing options.

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