MPC870VR133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 766 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC870 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 133MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC870VR133 – IC MPU MPC8XX 133MHZ 256BGA
The MPC870VR133 is a single-chip embedded microprocessor from NXP Semiconductors based on the MPC8xx core. It integrates a 32-bit MPC8xx core running at 133 MHz with a system integration unit and a communications processor module (CPM), delivering a compact solution for controller, communications and networking applications.
Designed for embedded systems, the device combines processing performance with integrated communications peripherals and standard 3.3 V I/O, enabling efficient board-level integration where 10/100 Mbps Ethernet, USB 2.0 and serial control interfaces are required.
Key Features
- Core and Architecture 32-bit MPC8xx core at 133 MHz; single-issue core with integrated memory management and branch prediction.
- On-chip Caches 8 KB instruction cache and 8 KB data cache (two-way set-associative), improving instruction and data throughput.
- Communications Processor Module (CPM) Integrated CPM for communications and serial control offload and protocol handling.
- Ethernet Dual 10/100 Mbps Ethernet interfaces for networked embedded systems.
- USB Integrated USB 2.0 interface (1) for host/device connectivity.
- Memory and Bus DRAM controller support and an external bus with maximum external bus frequency details described in the device hardware specification.
- System Interfaces Additional interfaces include I2C for system control and peripheral coordination.
- Power and I/O Standard 3.3 V I/O signaling for common embedded board designs.
- Package and Mounting 256-PBGA (23x23) surface-mount package for dense, reliable board integration.
- Operating Range & Qualification Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.
Typical Applications
- Communications and Networking Systems Embedded processing and integrated Ethernet interfaces make the part suitable for communications and networking equipment.
- Controller Applications Single-chip integration of CPU, CPM and DRAM controller supports a variety of controller use cases.
- Embedded Systems with Peripheral Connectivity Systems requiring USB 2.0, I2C and multiple Ethernet ports benefit from the device’s integrated peripherals.
Unique Advantages
- Highly integrated single-chip solution: Combines MPC8xx core, system integration unit and CPM to reduce board-level component count and simplify designs.
- Integrated communications interfaces: Dual 10/100 Mbps Ethernet and USB 2.0 provide native connectivity for networked and peripheral-rich designs.
- On-chip caches for improved performance: Dedicated 8 KB instruction and 8 KB data caches help improve instruction throughput and data access latencies.
- Standard 3.3 V I/O: Matches common embedded system voltage domains for straightforward interfacing.
- Compact, surface-mount package: 256-PBGA (23x23) form factor supports high-density PCB layouts while maintaining thermal and mechanical integrity.
- RoHS compliant and consumer-qualified: Meets RoHS requirements and is targeted for consumer-grade embedded applications within the specified temperature range.
Why Choose MPC870VR133?
The MPC870VR133 positions itself as a practical choice for embedded designs that require a balanced combination of processing performance and integrated communications peripherals. With a 133 MHz MPC8xx core, on-chip caches, CPM and multiple network interfaces, it simplifies system architecture for communications, networking and controller applications.
Its 256-PBGA package, 3.3 V I/O compatibility and RoHS compliance make the MPC870VR133 suitable for compact, production-level embedded products that need integrated Ethernet and USB connectivity while operating across a consumer-grade temperature range.
Request a quote or submit an inquiry to purchase the MPC870VR133 or to obtain further technical information and availability.

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