MPC870VR133

IC MPU MPC8XX 133MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)

Quantity 766 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC870
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed133MHzSupplier Device Package256-PBGA (23×23)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC870VR133 – IC MPU MPC8XX 133MHZ 256BGA

The MPC870VR133 is a single-chip embedded microprocessor from NXP Semiconductors based on the MPC8xx core. It integrates a 32-bit MPC8xx core running at 133 MHz with a system integration unit and a communications processor module (CPM), delivering a compact solution for controller, communications and networking applications.

Designed for embedded systems, the device combines processing performance with integrated communications peripherals and standard 3.3 V I/O, enabling efficient board-level integration where 10/100 Mbps Ethernet, USB 2.0 and serial control interfaces are required.

Key Features

  • Core and Architecture  32-bit MPC8xx core at 133 MHz; single-issue core with integrated memory management and branch prediction.
  • On-chip Caches  8 KB instruction cache and 8 KB data cache (two-way set-associative), improving instruction and data throughput.
  • Communications Processor Module (CPM)  Integrated CPM for communications and serial control offload and protocol handling.
  • Ethernet  Dual 10/100 Mbps Ethernet interfaces for networked embedded systems.
  • USB  Integrated USB 2.0 interface (1) for host/device connectivity.
  • Memory and Bus  DRAM controller support and an external bus with maximum external bus frequency details described in the device hardware specification.
  • System Interfaces  Additional interfaces include I2C for system control and peripheral coordination.
  • Power and I/O  Standard 3.3 V I/O signaling for common embedded board designs.
  • Package and Mounting  256-PBGA (23x23) surface-mount package for dense, reliable board integration.
  • Operating Range & Qualification  Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.

Typical Applications

  • Communications and Networking Systems  Embedded processing and integrated Ethernet interfaces make the part suitable for communications and networking equipment.
  • Controller Applications  Single-chip integration of CPU, CPM and DRAM controller supports a variety of controller use cases.
  • Embedded Systems with Peripheral Connectivity  Systems requiring USB 2.0, I2C and multiple Ethernet ports benefit from the device’s integrated peripherals.

Unique Advantages

  • Highly integrated single-chip solution: Combines MPC8xx core, system integration unit and CPM to reduce board-level component count and simplify designs.
  • Integrated communications interfaces: Dual 10/100 Mbps Ethernet and USB 2.0 provide native connectivity for networked and peripheral-rich designs.
  • On-chip caches for improved performance: Dedicated 8 KB instruction and 8 KB data caches help improve instruction throughput and data access latencies.
  • Standard 3.3 V I/O: Matches common embedded system voltage domains for straightforward interfacing.
  • Compact, surface-mount package: 256-PBGA (23x23) form factor supports high-density PCB layouts while maintaining thermal and mechanical integrity.
  • RoHS compliant and consumer-qualified: Meets RoHS requirements and is targeted for consumer-grade embedded applications within the specified temperature range.

Why Choose MPC870VR133?

The MPC870VR133 positions itself as a practical choice for embedded designs that require a balanced combination of processing performance and integrated communications peripherals. With a 133 MHz MPC8xx core, on-chip caches, CPM and multiple network interfaces, it simplifies system architecture for communications, networking and controller applications.

Its 256-PBGA package, 3.3 V I/O compatibility and RoHS compliance make the MPC870VR133 suitable for compact, production-level embedded products that need integrated Ethernet and USB connectivity while operating across a consumer-grade temperature range.

Request a quote or submit an inquiry to purchase the MPC870VR133 or to obtain further technical information and availability.

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