MPC870ZT66
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 772 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC870 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 66MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC870ZT66 – IC MPU MPC8XX 66MHZ 256BGA
The MPC870ZT66 is a single‑core, 32‑bit microprocessor in the MPC8xx family, operating at 66 MHz and delivered in a 256‑pin PBGA (23×23) package. Engineered for embedded and communications applications, it pairs a Power Architecture™‑based core with integrated communications peripherals to simplify system design.
With integrated DRAM controller, Communications Processor Module (CPM) functionality and multiple high‑speed interfaces, the MPC870ZT66 targets networking and embedded controller markets where integration, predictable performance, and board‑level consolidation are important.
Key Features
- Core — MPC8xx single 32‑bit core at 66 MHz implementing Power Architecture™ technology; includes MMU and on‑chip caches as described for the MPC875/MPC870 family.
- Memory Support — Integrated DRAM controller to streamline system memory interfacing and reduce external component count.
- Communications Processor Module (CPM) — On‑chip CPM for handling communications and protocol processing tasks, reducing host CPU load.
- Ethernet — Dual 10/100 Mbps Ethernet ports for flexible LAN connectivity and networking applications.
- USB — Single USB 2.0 interface for high‑speed peripheral connectivity or host/device functions.
- Peripheral Interfaces — I2C and other system interfaces for sensor, control and peripheral management.
- Power and IO — 3.3 V I/O signaling for compatibility with common embedded peripherals and interfaces.
- Package and Mounting — 256‑PBGA (23×23) surface‑mount package suitable for compact, high‑density board layouts.
- Operating Range — Rated for 0 °C to 95 °C operation, suitable for many consumer and embedded environments.
- Compliance — RoHS‑compliant component to support lead‑free design requirements.
Typical Applications
- Networking Equipment — Use the dual 10/100 Mbps Ethernet ports and CPM to implement routers, switches, or access devices requiring integrated packet processing.
- Embedded Communications Controllers — Ideal for protocol handling and interface aggregation where the CPM offloads communications tasks from the main core.
- Consumer and Home Appliances — Consumer‑grade qualification and integrated interfaces make it suitable for connected appliances and smart devices requiring network and USB connectivity.
- Industrial Control Systems — On‑chip DRAM controller and I2C support enable compact control platforms with sensor and peripheral integration.
Unique Advantages
- Integrated Communications Engine: The onboard CPM and communications co‑processor capabilities reduce external controller requirements and simplify firmware partitioning.
- Dual Ethernet Connectivity: Two 10/100 Mbps Ethernet ports provide native LAN interfacing for networking functions without additional PHY management complexity.
- Compact, High‑Density Package: 256‑PBGA (23×23) packaging enables space‑constrained board designs while maintaining extensive I/O integration.
- Consumer Market Qualification: Product qualification for consumer applications supports deployments in consumer electronics and connected home products.
- Standard 3.3 V I/O: 3.3 V signaling ensures compatibility with a wide range of embedded peripherals and simplifies power‑rail design.
- RoHS Compliance: RoHS‑compliant status supports lead‑free assembly and regulatory requirements for many product lines.
Why Choose MPC870ZT66?
The MPC870ZT66 combines a Power Architecture™‑based 32‑bit core with integrated communications peripherals, dual Ethernet, USB 2.0 and a DRAM controller to deliver a highly integrated building block for embedded networking and controller designs. Its feature set reduces external components, simplifies board layout, and provides predictable performance at 66 MHz for a broad range of consumer and embedded systems.
Manufactured by NXP Semiconductors and supplied in a 256‑PBGA surface‑mount package, the MPC870ZT66 is aimed at designers who need consolidated I/O, communications offload, and compatibility with common 3.3 V systems while maintaining RoHS compliance and consumer product qualification.
Request a quote or submit a purchase inquiry to receive pricing and availability details for the MPC870ZT66. Representatives can provide lead‑time information and support for volume or prototype requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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