MPC875CVR133

The MPC875CVR133 is a single-chip microprocessor from NXP Semiconductors based on the MPC8xx core and Power Architecture technology. It integrates a 32-bit, single-issue CPU running at 133 MHz with system integration and communications peripherals, targeting embedded controller, communications and networking applications.

With integrated communications processing, security coprocessing, DRAM controller and multiport Ethernet/USB support, the MPC875CVR133 provides a compact, industrial-temperature qualified solution for embedded systems that require on-chip peripheral integration and cryptography capabilities.

Key Features

• Core & Architecture Single-issue 32‑bit MPC8xx core at 133 MHz; built on Power Architecture technology with thirty-two 32‑bit general-purpose registers.
• Caches & MMU 8 KB instruction cache and 8 KB data cache; memory management units and cache architecture described in the MPC875 family documentation.
• System Integration Integrated System Integration Unit (SIU) and Communications Processor Module (CPM) for protocol offload and peripheral control.
• Co‑processors Communications co‑processor (CPM) and security co‑processor (SEC) to handle communications tasks and cryptography functions.
• Memory Controller On‑chip DRAM controller for external memory interfacing.
• Interfaces Multiple Ethernet ports (one 10 Mbps and two 10/100 Mbps), one USB 2.0 port, and additional serial interfaces including HDLC/SDLC.
• Bus & Performance Notes Core operates at up to 133 MHz; maximum external bus frequency is 80 MHz (1:1 mode not supported at 133 MHz — 133 MHz supports 2:1 mode only, per device documentation).
• Security Features On‑chip cryptography support via the SEC coprocessor for embedded security functions.
• Package & Mounting 256‑ball PBGA package (23 × 23 mm), surface‑mount.
• Electrical & Environmental I/O voltage at 3.3 V; industrial operating temperature range of −40 °C to 100 °C; RoHS compliant.
• Qualification Industrial qualification as specified in the product information.
• Graphics No dedicated graphics acceleration.

Typical Applications

• Communications & Networking Equipment Use the integrated CPM, multiple Ethernet ports and HDLC/SDLC interfaces for protocol handling, packet processing and network control.
• Embedded Controllers The MPC8xx core, DRAM controller and peripheral integration suit controller applications that require deterministic processing and on‑chip interfaces.
• ATM and Telecom Systems Designed with enhanced ATM functionality in the MPC875 family, applicable where on‑chip communications support and timing are required.
• Secure Embedded Systems On‑chip SEC cryptography and communications offload enable secure data handling and authentication in industrial applications.

Unique Advantages

• Highly integrated solution: Combines a Power Architecture MPC8xx core, SIU and CPM on a single die to reduce external component count and simplify board design.
• Built‑in communications acceleration: CPM and dedicated serial/Ethernet interfaces offload protocol processing from the core, improving system determinism.
• On‑chip security coprocessing: SEC provides cryptography support for embedded secure communications without requiring external accelerators.
• Industrial temperature range: Qualified for −40 °C to 100 °C operation, enabling deployment in demanding environments.
• Compact PBGA package: 256‑ball PBGA (23×23 mm) surface‑mount package supports high‑density board layouts.
• Standards‑oriented interfaces: Native USB 2.0 and multiport Ethernet support common embedded connectivity needs.

Why Choose MPC875CVR133?

The MPC875CVR133 is positioned as an integrated microprocessor solution for embedded and communications designs that require a Power Architecture MPC8xx core combined with on‑chip communications and security functionality. Its mix of CPU, CPM, SEC and DRAM controller reduces external components and streamlines system architecture for industrial applications.

Engineers designing networking, telecommunications or secure embedded controllers will benefit from the device’s integrated interfaces, industrial temperature qualification and vendor documentation for system‑level implementation and power/layout guidelines.

Request a quote or submit a sales inquiry to purchase MPC875CVR133 and evaluate its integration and interface capabilities for your next embedded or communications project.