MPC875VR133

IC MPU MPC8XX 133MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)

Quantity 1,657 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC875
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A002A1 FREEthernet10Mbps (1), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptographySpeed133MHz
Supplier Device Package256-PBGA (23×23)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC875VR133 – IC MPU MPC8XX 133MHZ 256BGA

The MPC875VR133 is a single‑chip microprocessor based on the MPC8xx Power Architecture™ core running at 133 MHz. It combines a 32‑bit CPU, system integration functions and a communications processor module (CPM) to serve controller, communications and networking applications in consumer‑qualified embedded products.

Designed for integrated connectivity and security, the device targets embedded controller and communications system designs that require on‑chip DRAM support, multiple Ethernet interfaces and hardware cryptography capabilities, all in a compact 256‑pin PBGA package.

Key Features

  • 32‑bit MPC8xx Core (133 MHz)  The embedded MPC8xx core runs at 133 MHz and implements Power Architecture technology with MMUs and caches for deterministic embedded execution.
  • Instruction and Data Caches  On‑chip instruction and data caches provide low‑latency access to code and data (8 KB instruction cache, 8 KB data cache as specified in the hardware documentation).
  • Communications Processor Module (CPM)  Integrated CPM supports communications offload and serial protocols, with additional support for HDLC/SDLC interfaces.
  • Security Co‑processor  On‑chip SEC subsystem provides cryptography capabilities for secure data handling and communication.
  • Ethernet and USB Connectivity  Built‑in Ethernet ports (one 10 Mbps and two 10/100 Mbps) plus a single USB 2.0 interface enable flexible network and peripheral connectivity.
  • Memory Controller  Integrated DRAM controller simplifies system memory interfacing and reduces external glue logic.
  • Voltage and Mounting  3.3 V I/O and surface‑mount 256‑PBGA package (23 × 23 mm) for compact board designs; supplier package also listed as 256‑BBGA.
  • Operating Range and Qualification  Consumer qualification with an operating temperature range of 0°C to 95°C and RoHS compliance.
  • System Integration  Device architecture comprises the MPC8xx core, a system integration unit (SIU) and CPM to consolidate core processing and peripheral control on a single IC.
  • External Bus Timing  Hardware documentation specifies external bus maximum operation at 80 MHz (1:1 mode); 133 MHz core operation supports 2:1 external bus mode.

Typical Applications

  • Communications and Networking Equipment  On‑chip CPM, multiple Ethernet ports and USB 2.0 make the MPC875VR133 suited for embedded networking devices and controllers handling packet and serial communications.
  • Embedded Controllers  The integrated DRAM controller, MMU and caches enable responsive control tasks in embedded applications where compact integration is required.
  • Secure Consumer Devices  Built‑in cryptography (SEC) supports secure data handling for consumer‑oriented embedded products requiring hardware security functions.

Unique Advantages

  • Highly integrated architecture: Combines MPC8xx core, SIU and CPM on a single die to reduce component count and simplify system design.
  • Built‑in communications interfaces: Multiple Ethernet ports and USB 2.0 provide ready‑to‑use connectivity for networked embedded systems.
  • Hardware security acceleration: SEC cryptography support offloads security tasks from the CPU, helping maintain system performance under secure workloads.
  • Compact surface‑mount package: 256‑PBGA (23×23 mm) package enables dense board layouts while preserving I/O capability.
  • Documented hardware specifications: Detailed hardware specifications and electrical/timing data are provided in the product documentation to support system integration and thermal/power planning.
  • RoHS compliant: Meets RoHS environmental requirements for consumer products.

Why Choose MPC875VR133?

The MPC875VR133 positions a 133 MHz Power Architecture‑based MPC8xx core with integrated communications, memory and security peripherals into a single, consumer‑qualified package. Its combination of on‑chip CPM, Ethernet ports, USB 2.0, DRAM controller and cryptography support makes it well suited for embedded designs that need consolidated processing and connectivity without extensive external logic.

Designers targeting consumer embedded controllers and communication devices will find the MPC875VR133 offers a documented hardware foundation—covering power, thermal, DC/AC and timing characteristics—to assist reliable board implementation and system validation.

Request a quote or submit a pricing inquiry for the MPC875VR133 to receive availability and ordering details for your next embedded design.

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