MPC875ZT133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 494 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC875 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (1), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 133MHz | ||
| Supplier Device Package | 256-PBGA (23×23) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC875ZT133 – IC MPU MPC8XX 133MHZ 256BGA
The MPC875ZT133 is a single-chip embedded microprocessor built around the 32-bit MPC8xx core running at 133 MHz. It integrates a system integration unit (SIU) and a communications processor module (CPM) to address a range of controller, communications and networking system needs.
Designed for embedded and communications applications, the device provides on-chip memory management, instruction and data caches, a variety of serial and network interfaces, and hardware security support—delivered in a 256‑PBGA (23×23) surface-mount package with 3.3 V I/O and RoHS compliance.
Key Features
- Core Single 32-bit MPC8xx core operating at 133 MHz, with branch prediction and Power Architecture™ compatible register set.
- Caches and MMU Includes an 8 KB instruction cache and an 8 KB data cache plus memory management support for embedded operating systems and memory protection.
- Communications Processor Module (CPM) Integrated CPM provides communications-focused co-processor capabilities for protocol handling and offloaded I/O processing.
- Peripherals & Interfaces On-chip USB 2.0 (1 port) and HDLC/SDLC support for serial protocol framing and peripheral connectivity.
- Networking Multiple Ethernet controllers: one 10 Mbps port and two 10/100 Mbps ports for wired network connectivity and switching applications.
- Memory Controller Integrated DRAM controller supports system memory interfacing for embedded applications.
- Security On-chip cryptography/security support (SEC) to enable hardware-based security functions.
- Power & I/O 3.3 V I/O voltage for standard embedded system compatibility; detailed power and sequencing guidance provided in the hardware specification.
- Package & Mounting 256‑PBGA (23×23) surface-mount package for compact board designs.
- Operating Range & Compliance Rated for 0 °C to 95 °C operating temperature and RoHS compliant.
Typical Applications
- Communications & Networking Equipment Use the multi-port Ethernet and CPM to implement routers, bridges, and network controllers requiring protocol handling and packet processing.
- Embedded Controllers Ideal for embedded controller applications that need a compact, integrated microprocessor with DRAM interface and peripheral support.
- ATM and Packet Processing Systems Designed with enhanced ATM-related functionality and CPM support for systems handling ATM and packet-based traffic.
- Consumer Embedded Devices Qualified to consumer-level specification for use in consumer-grade embedded products that require USB and network connectivity.
Unique Advantages
- Integrated Communications Subsystem: The on-chip CPM and multiple Ethernet controllers reduce external components and simplify board-level design for networking applications.
- Balanced Processing and I/O: A 133 MHz MPC8xx core combined with on-chip caches and a DRAM controller delivers predictable embedded performance for control and data-plane tasks.
- Security-Ready: Built-in cryptography/security capabilities enable hardware-accelerated security functions without relying solely on external devices.
- Compact Packaging: 256‑PBGA (23×23) surface-mount package allows dense, space-constrained PCB layouts while supporting a broad peripheral set.
- Industry-Proven Architecture: Power Architecture–based MPC8xx core with MMU and cache features provides a familiar foundation for embedded software stacks and real-time systems.
Why Choose MPC875ZT133?
The MPC875ZT133 offers a tightly integrated combination of a 32-bit MPC8xx core, communications processor module, peripheral interfaces and memory controller in a single 256‑PBGA package. Its feature set is targeted at embedded and networking designs that require on-chip protocol handling, multiple Ethernet ports and USB connectivity alongside hardware security support.
This device is suited for designers seeking an integrated solution that reduces BOM complexity while providing deterministic embedded processing for communications and controller applications. With RoHS compliance and an operating range of 0 °C to 95 °C, the MPC875ZT133 provides a practical platform for consumer and networking products where these documented specifications meet system requirements.
Request a quote or submit a product inquiry to receive availability, pricing and lead-time information for MPC875ZT133. Our team can assist with technical details and volume purchasing options.

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