MPC875ZT133

IC MPU MPC8XX 133MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)

Quantity 494 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC875
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A002A1 FREEthernet10Mbps (1), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptographySpeed133MHz
Supplier Device Package256-PBGA (23×23)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC875ZT133 – IC MPU MPC8XX 133MHZ 256BGA

The MPC875ZT133 is a single-chip embedded microprocessor built around the 32-bit MPC8xx core running at 133 MHz. It integrates a system integration unit (SIU) and a communications processor module (CPM) to address a range of controller, communications and networking system needs.

Designed for embedded and communications applications, the device provides on-chip memory management, instruction and data caches, a variety of serial and network interfaces, and hardware security support—delivered in a 256‑PBGA (23×23) surface-mount package with 3.3 V I/O and RoHS compliance.

Key Features

  • Core Single 32-bit MPC8xx core operating at 133 MHz, with branch prediction and Power Architecture™ compatible register set.
  • Caches and MMU Includes an 8 KB instruction cache and an 8 KB data cache plus memory management support for embedded operating systems and memory protection.
  • Communications Processor Module (CPM) Integrated CPM provides communications-focused co-processor capabilities for protocol handling and offloaded I/O processing.
  • Peripherals & Interfaces On-chip USB 2.0 (1 port) and HDLC/SDLC support for serial protocol framing and peripheral connectivity.
  • Networking Multiple Ethernet controllers: one 10 Mbps port and two 10/100 Mbps ports for wired network connectivity and switching applications.
  • Memory Controller Integrated DRAM controller supports system memory interfacing for embedded applications.
  • Security On-chip cryptography/security support (SEC) to enable hardware-based security functions.
  • Power & I/O 3.3 V I/O voltage for standard embedded system compatibility; detailed power and sequencing guidance provided in the hardware specification.
  • Package & Mounting 256‑PBGA (23×23) surface-mount package for compact board designs.
  • Operating Range & Compliance Rated for 0 °C to 95 °C operating temperature and RoHS compliant.

Typical Applications

  • Communications & Networking Equipment Use the multi-port Ethernet and CPM to implement routers, bridges, and network controllers requiring protocol handling and packet processing.
  • Embedded Controllers Ideal for embedded controller applications that need a compact, integrated microprocessor with DRAM interface and peripheral support.
  • ATM and Packet Processing Systems Designed with enhanced ATM-related functionality and CPM support for systems handling ATM and packet-based traffic.
  • Consumer Embedded Devices Qualified to consumer-level specification for use in consumer-grade embedded products that require USB and network connectivity.

Unique Advantages

  • Integrated Communications Subsystem: The on-chip CPM and multiple Ethernet controllers reduce external components and simplify board-level design for networking applications.
  • Balanced Processing and I/O: A 133 MHz MPC8xx core combined with on-chip caches and a DRAM controller delivers predictable embedded performance for control and data-plane tasks.
  • Security-Ready: Built-in cryptography/security capabilities enable hardware-accelerated security functions without relying solely on external devices.
  • Compact Packaging: 256‑PBGA (23×23) surface-mount package allows dense, space-constrained PCB layouts while supporting a broad peripheral set.
  • Industry-Proven Architecture: Power Architecture–based MPC8xx core with MMU and cache features provides a familiar foundation for embedded software stacks and real-time systems.

Why Choose MPC875ZT133?

The MPC875ZT133 offers a tightly integrated combination of a 32-bit MPC8xx core, communications processor module, peripheral interfaces and memory controller in a single 256‑PBGA package. Its feature set is targeted at embedded and networking designs that require on-chip protocol handling, multiple Ethernet ports and USB connectivity alongside hardware security support.

This device is suited for designers seeking an integrated solution that reduces BOM complexity while providing deterministic embedded processing for communications and controller applications. With RoHS compliance and an operating range of 0 °C to 95 °C, the MPC875ZT133 provides a practical platform for consumer and networking products where these documented specifications meet system requirements.

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