MPC875ZT66

IC MPU MPC8XX 66MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Quantity 570 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC875
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A002A1 FREEthernet10Mbps (1), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unknown
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptographySpeed66MHz
Supplier Device Package256-PBGA (23×23)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC875ZT66 – IC MPU MPC8XX 66MHZ 256BGA

The MPC875ZT66 is a single‑core 32‑bit microprocessor IC built on the MPC8xx core architecture and specified for 66 MHz operation. Designed for embedded controller and communications applications, it combines an integrated communications processor module (CPM) with on‑chip memory management and caches to support networking and control system workloads.

With dedicated interfaces for Ethernet and USB, DRAM controller support, 3.3 V I/O, hardware cryptography and a 256‑ball PBGA package, the MPC875ZT66 targets embedded and consumer applications that require integrated communications peripherals and robust system integration.

Key Features

  • Core Single 32‑bit MPC8xx core operating at 66 MHz with Power Architecture™ lineage, including memory management units and instruction/data caches.
  • Memory On‑chip support for DRAM controllers and internal instruction and data caches for improved system throughput.
  • Communications Processor (CPM) and Security Integrated CPM for communications tasks and on‑chip security (cryptography) to accelerate secure data handling.
  • Ethernet Multiple Ethernet interfaces as specified: one 10 Mbps port and two 10/100 Mbps ports to support diverse network topologies.
  • USB Single USB 2.0 interface for peripheral connectivity and system expansion.
  • Additional Interfaces HDLC/SDLC support for standard serial link protocols commonly used in communications equipment.
  • Power and I/O 3.3 V I/O voltage for compatibility with common embedded peripherals.
  • Package and Mounting 256‑ball PBGA (23 × 23 mm) surface‑mount package for compact system integration.
  • Operating Range Qualified for consumer applications with an operating temperature range of 0 °C to 95 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Communications & Networking Equipment — Leverage the integrated CPM, multiple Ethernet ports and HDLC/SDLC interfaces for routers, gateways and network controllers.
  • Embedded Controllers — Single‑core 32‑bit processing with DRAM support and on‑chip caches for control tasks in embedded systems.
  • Consumer Network Devices — Designed for consumer‑grade networked products that require USB, Ethernet and onboard cryptography.
  • Industrial Control and Monitoring — Use Ethernet connectivity and robust operating temperature range for monitoring and control nodes in non‑automotive industrial environments.

Unique Advantages

  • Integrated Communications Subsystem: Built‑in CPM and multiple Ethernet interfaces reduce external peripheral requirements and simplify board design.
  • On‑chip Security: Hardware cryptography support enables secure data processing without relying solely on external accelerators.
  • Standard Voltage I/O: 3.3 V I/O compatibility eases integration with common peripheral devices and interfaces.
  • Compact PBGA Package: 256‑ball PBGA (23×23 mm) provides a dense footprint for space‑constrained embedded designs.
  • RoHS Compliant: Meets current environmental compliance expectations for consumer and embedded products.

Why Choose MPC875ZT66?

The MPC875ZT66 positions itself as a compact, integrated microprocessor solution for embedded and communications designs that require a dedicated communications processor, multiple network interfaces and on‑chip security. Its single 32‑bit MPC8xx core at 66 MHz, DRAM controller support and standard 3.3 V I/O make it suitable for consumer and embedded products that balance processing needs with system integration.

Engineers selecting the MPC875ZT66 benefit from reduced BOM complexity through integrated peripherals and a PBGA package that supports dense board layouts, while RoHS compliance and a consumer operating qualification align the device with mainstream embedded product requirements.

Request a quote or submit an inquiry to receive pricing and availability for the MPC875ZT66.

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