MPC880CVR133

IC MPU MPC8XX 133MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25)

Quantity 633 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC880
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN3A991A2Ethernet10Mbps (2), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed133MHzSupplier Device Package357-PBGA (25×25)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC880CVR133 – IC MPU MPC8XX 133 MHz 357-PBGA

The MPC880CVR133 is a single‑core, 32‑bit microprocessor built on the MPC8xx core architecture and manufactured by NXP Semiconductors. Operating at 133 MHz, this device integrates a system integration unit (SIU), a communications processor module (CPM), and on‑chip MMUs and caches to serve embedded controller and communications/networking applications.

With integrated Ethernet controllers, USB 2.0 support, DRAM controller interfaces, and industrial temperature qualification, the MPC880CVR133 targets embedded communications systems and industrial controllers that require a compact, surface‑mount single‑chip solution in a 357‑PBGA (25×25) package.

Key Features

  • Core & Architecture  Single‑issue MPC8xx 32‑bit core with memory management units (MMUs) and instruction/data caches for deterministic embedded operation.
  • Performance  133 MHz core frequency with external bus maximum frequency of 80 MHz (core 133 MHz supports 2:1 mode as documented in the family hardware specification).
  • Caches  On‑chip instruction and data caches (8 KB each as described in the MPC885/MPC880 documentation) to improve code and data throughput.
  • Communications & Interfaces  Multiple Ethernet controllers (10 Mbps and 10/100 Mbps ports as specified), one USB 2.0 interface, and HDLC/SDLC support for serial link and legacy protocol handling.
  • Communications Processor Module (CPM)  Integrated CPM and communications co‑processor functionality for offloading protocol handling and accelerating communications tasks.
  • Memory & Bus  DRAM controller support and a 32‑bit internal bus to connect the core, SIU and CPM for system integration.
  • Power & I/O  3.3 V I/O voltage for common embedded system compatibility.
  • Package & Mounting  357‑ball PBGA (25×25) surface‑mount package for compact board integration.
  • Operating Range & Qualification  Industrial‑grade qualification with operating temperature range from −40 °C to 100 °C and RoHS compliance for regulatory alignment.

Typical Applications

  • Embedded Communications Equipment  Device integrates multiple Ethernet controllers and a CPM, making it suitable for routers, gateways, and protocol converters where on‑chip communications processing reduces system complexity.
  • Industrial Control Systems  Industrial temperature qualification and robust I/O voltage make the MPC880CVR133 appropriate for embedded controllers in factory automation and process control.
  • Networked Appliances  Integrated USB 2.0 and DRAM controller support enable networked appliances and small servers that require local peripheral connectivity and shared memory.
  • Legacy Protocol Interfaces  Built‑in HDLC/SDLC and CPM support help integrate existing serial and link‑level protocols into modern embedded designs.

Unique Advantages

  • Highly integrated communications peripherals: Built‑in Ethernet ports, USB 2.0, and CPM reduce external component count and simplify board design for networked products.
  • Single‑chip system integration: SIU, CPM, and MPC8xx core on one device consolidate functionality that would otherwise require multiple ICs, lowering BOM and board area.
  • Industrial temperature capability: Rated from −40 °C to 100 °C to support deployment in harsh and temperature‑variable environments.
  • Compact PBGA packaging: 357‑PBGA (25×25) offers a small form factor for space‑constrained embedded systems while enabling surface‑mount assembly.
  • Vendor documentation and hardware specification: Supported by the MPC885/MPC880 PowerQUICC hardware specification, which provides detailed electrical, thermal and layout guidance for system designers.

Why Choose MPC880CVR133?

The MPC880CVR133 combines a Power Architecture™ MPC8xx core with an integrated communications processor module and multiple networking interfaces in a single, industrial‑qualified package. Its 133 MHz core, on‑chip MMUs and caches, and dedicated communications peripherals make it well suited for embedded communications, industrial controllers, and networked devices where integration, deterministic performance, and temperature resilience are required.

Produced by NXP Semiconductors and accompanied by detailed hardware specifications, the MPC880CVR133 is a practical choice for engineers seeking a compact, integrated microprocessor solution for communications‑centric embedded designs.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC880CVR133.

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