MPC875CZT133

IC MPU MPC8XX 133MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23)

Quantity 1,805 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC875
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN5A002A1 FREEthernet10Mbps (1), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptographySpeed133MHz
Supplier Device Package256-PBGA (23×23)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC875CZT133 – IC MPU MPC8XX 133MHz 256-PBGA

The MPC875CZT133 is a single-chip microprocessor solution featuring an embedded MPC8xx 32-bit core operating at 133 MHz, packaged in a 256‑pin PBGA (23 × 23). Designed for embedded controller and communications/networking applications, the device integrates system and communications peripherals to simplify board-level design.

With integrated communications and security co-processing, multi-port Ethernet and USB connectivity, industrial qualification and a wide operating temperature range, the MPC875CZT133 targets robust embedded systems that require networked I/O, secure processing and reliable operation in demanding environments.

Key Features

  • Core Single MPC8xx 32‑bit core running at 133 MHz for embedded processing workloads.
  • Memory and Bus Integrated DRAM controller and system integration unit for memory and bus management.
  • Communications Co-Processing Built‑in Communications Processor Module (CPM) and communications DSP functionality to support protocol handling and offload.
  • Security Co-Processor Integrated security co-processor (SEC) and cryptography features for secure communications and data protection.
  • Network Interfaces Multiple Ethernet interfaces: one 10 Mbps port and two 10/100 Mbps ports for flexible network topologies and connectivity.
  • USB One USB 2.0 interface for peripheral or host connectivity.
  • Additional Interfaces HDLC/SDLC support for serial line protocol implementations.
  • Voltage and Mounting 3.3 V I/O signaling; surface‑mount package for standard PCB assembly flows.
  • Package 256‑pin PBGA (23 × 23) package providing high I/O density in a compact footprint.
  • Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.

Typical Applications

  • Networking & Communications Equipment Use the integrated CPM, multiple Ethernet ports and USB 2.0 interface to implement routers, gateways and protocol converters.
  • Embedded Controllers Suitable for embedded control systems that require a 32‑bit core with integrated memory controller and peripheral integration.
  • Secure Communications Cryptography and security co‑processing enable secure data paths for encrypted communications and protected device access.
  • Industrial Automation Industrial qualification and a −40 °C to 100 °C operating range make the device appropriate for factory automation and remote control units.

Unique Advantages

  • Highly integrated single‑chip solution: Combines an MPC8xx core, system integration unit and communications processor module to reduce BOM and simplify board design.
  • Multi‑interface connectivity: Multiple Ethernet ports plus a USB 2.0 interface and HDLC/SDLC support provide flexible options for networking and peripheral I/O.
  • On‑chip security acceleration: Dedicated security co-processor and cryptography features accelerate secure communications and data protection tasks.
  • Industrial temperature capability: −40 °C to 100 °C operating range and industrial qualification support deployment in demanding environmental conditions.
  • Compact, high‑density packaging: 256‑pin PBGA (23 × 23) offers a small footprint while delivering abundant I/O for complex embedded designs.
  • 3.3 V I/O compatibility: Standard 3.3 V I/O simplifies integration with common peripheral components and interfaces.

Why Choose MPC875CZT133?

The MPC875CZT133 positions itself as a compact, integrated microprocessor platform for engineers building embedded networking and control solutions. Its MPC8xx 32‑bit core at 133 MHz, combined with communications and security co-processing, offers a balanced mix of processing, protocol offload and secure functionality in a single package.

This device is ideal for designs that require onboard networking, secure communications and industrial‑grade reliability—delivering a scalable, well‑documented platform backed by NXP Semiconductors and accompanying technical documentation for system integration and validation.

Request a quote or submit a purchase inquiry today to evaluate the MPC875CZT133 for your next embedded communications or industrial control design.

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