MPC875CZT133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 1,805 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC875 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (1), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 133MHz | ||
| Supplier Device Package | 256-PBGA (23×23) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC875CZT133 – IC MPU MPC8XX 133MHz 256-PBGA
The MPC875CZT133 is a single-chip microprocessor solution featuring an embedded MPC8xx 32-bit core operating at 133 MHz, packaged in a 256‑pin PBGA (23 × 23). Designed for embedded controller and communications/networking applications, the device integrates system and communications peripherals to simplify board-level design.
With integrated communications and security co-processing, multi-port Ethernet and USB connectivity, industrial qualification and a wide operating temperature range, the MPC875CZT133 targets robust embedded systems that require networked I/O, secure processing and reliable operation in demanding environments.
Key Features
- Core Single MPC8xx 32‑bit core running at 133 MHz for embedded processing workloads.
- Memory and Bus Integrated DRAM controller and system integration unit for memory and bus management.
- Communications Co-Processing Built‑in Communications Processor Module (CPM) and communications DSP functionality to support protocol handling and offload.
- Security Co-Processor Integrated security co-processor (SEC) and cryptography features for secure communications and data protection.
- Network Interfaces Multiple Ethernet interfaces: one 10 Mbps port and two 10/100 Mbps ports for flexible network topologies and connectivity.
- USB One USB 2.0 interface for peripheral or host connectivity.
- Additional Interfaces HDLC/SDLC support for serial line protocol implementations.
- Voltage and Mounting 3.3 V I/O signaling; surface‑mount package for standard PCB assembly flows.
- Package 256‑pin PBGA (23 × 23) package providing high I/O density in a compact footprint.
- Industrial Qualification & Temperature Range Industrial qualification with an operating temperature range of −40 °C to 100 °C for deployment in harsh environments.
Typical Applications
- Networking & Communications Equipment Use the integrated CPM, multiple Ethernet ports and USB 2.0 interface to implement routers, gateways and protocol converters.
- Embedded Controllers Suitable for embedded control systems that require a 32‑bit core with integrated memory controller and peripheral integration.
- Secure Communications Cryptography and security co‑processing enable secure data paths for encrypted communications and protected device access.
- Industrial Automation Industrial qualification and a −40 °C to 100 °C operating range make the device appropriate for factory automation and remote control units.
Unique Advantages
- Highly integrated single‑chip solution: Combines an MPC8xx core, system integration unit and communications processor module to reduce BOM and simplify board design.
- Multi‑interface connectivity: Multiple Ethernet ports plus a USB 2.0 interface and HDLC/SDLC support provide flexible options for networking and peripheral I/O.
- On‑chip security acceleration: Dedicated security co-processor and cryptography features accelerate secure communications and data protection tasks.
- Industrial temperature capability: −40 °C to 100 °C operating range and industrial qualification support deployment in demanding environmental conditions.
- Compact, high‑density packaging: 256‑pin PBGA (23 × 23) offers a small footprint while delivering abundant I/O for complex embedded designs.
- 3.3 V I/O compatibility: Standard 3.3 V I/O simplifies integration with common peripheral components and interfaces.
Why Choose MPC875CZT133?
The MPC875CZT133 positions itself as a compact, integrated microprocessor platform for engineers building embedded networking and control solutions. Its MPC8xx 32‑bit core at 133 MHz, combined with communications and security co-processing, offers a balanced mix of processing, protocol offload and secure functionality in a single package.
This device is ideal for designs that require onboard networking, secure communications and industrial‑grade reliability—delivering a scalable, well‑documented platform backed by NXP Semiconductors and accompanying technical documentation for system integration and validation.
Request a quote or submit a purchase inquiry today to evaluate the MPC875CZT133 for your next embedded communications or industrial control design.

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