MPC875CVR66
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 732 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC875 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (1), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography | Speed | 66MHz | ||
| Supplier Device Package | 256-PBGA (23×23) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC875CVR66 – IC MPU MPC8XX 66MHZ 256BGA
The MPC875CVR66 is a single‑core, 32‑bit embedded microprocessor based on the MPC8xx family and Power Architecture technology. Clocked at 66 MHz and designed for industrial embedded systems, it integrates communication and security co‑processors alongside DRAM support and multiple networking interfaces to simplify system design and accelerate time to market.
Key Features
- Core & architecture Single 32‑bit MPC8xx core running at 66 MHz with Power Architecture technology and built‑in MMU and instruction/data caches for efficient code execution.
- Caches Includes instruction and data cache architecture as defined for the MPC875 series to improve performance on embedded workloads.
- Communications co‑processors Integrated Communications Processor Module (CPM) and Security (SEC) co‑processors for offloading protocol and cryptography tasks.
- Memory controller On‑chip DRAM controller to interface with external memory for system buffering and code storage.
- Networking interfaces Supports one 10 Mbps Ethernet port and two 10/100 Mbps Ethernet ports for layered networking and connectivity.
- USB One USB 2.0 interface for peripheral connectivity.
- Serial protocols Additional HDLC/SDLC support for serial link framing and protocol handling.
- Power supply 3.3 V I/O signaling compatible with common industrial logic levels.
- Package & mounting 256‑pin PBGA package (23×23 mm) in a surface‑mount form factor suitable for compact board designs.
- Industrial temperature Operating range from −40 °C to 100 °C for use in demanding environments.
- Security On‑chip cryptography support to assist secure communications and data protection.
- Compliance RoHS compliant to meet common environmental requirements.
Typical Applications
- Industrial networking equipment Multiple Ethernet ports and integrated CPM/SEC make this device suitable for embedded switches, gateways and protocol converters.
- Communications controllers Integrated serial protocol support (HDLC/SDLC) and DRAM controller enable robust line cards and telecom controller designs.
- Secure embedded appliances On‑chip security co‑processor and cryptography support help implement secure data paths and encryption tasks.
- Embedded control systems Single‑chip integration and wide operating temperature range support controllers in harsh industrial environments.
Unique Advantages
- Highly integrated communications and security co‑processors: Reduces external components and offloads protocol and cryptographic workloads from the main core.
- Multiple Ethernet ports: One 10 Mbps and two 10/100 Mbps interfaces provide flexible networking topologies without additional PHYs.
- Industrial temperature qualification: −40 °C to 100 °C operation supports deployment in temperature‑sensitive and outdoor applications.
- Compact PBGA package: 256‑pin (23×23 mm) PBGA enables dense system designs while retaining extensive I/O and interface capability.
- Standard 3.3 V I/O: Simplifies integration with common industrial logic and peripherals.
- RoHS compliant: Meets environmental requirements for contemporary product builds.
Why Choose MPC875CVR66?
The MPC875CVR66 positions itself as a robust, integrated microprocessor for industrial embedded and communications designs, delivering a balanced combination of processing, peripheral integration and security features. Its MPC8xx 32‑bit core, combined with CPM and SEC co‑processors and multiple Ethernet/USB interfaces, makes it suitable for applications where network connectivity, protocol handling and data protection are required within a compact footprint.
Designed by NXP Semiconductors for industrial qualification and long operating temperature ranges, the MPC875CVR66 provides an adaptable platform for developers seeking a proven architecture, integrated communications peripherals and on‑chip cryptography to simplify system BOM and accelerate development.
Request a quote or submit an inquiry to obtain pricing and availability for the MPC875CVR66.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
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