MPC870ZT133

The MPC870ZT133 is a single-core, 32-bit microprocessor based on the MPC8xx core and delivered in a 256-PBGA (23×23) surface-mount package. Designed for embedded controller and communications applications, it integrates processing, system integration logic and a communications processor module to deliver a compact, network-capable solution.

At a 133 MHz core frequency with Power Architecture™ technology heritage, this device targets embedded and networking use cases that demand integrated Ethernet, USB and peripheral interfaces while operating from a 3.3 V I/O domain and within a 0 °C to 95 °C ambient range.

Key Features

• Core  Single-issue, 32-bit MPC8xx core running at 133 MHz with Power Architecture technology.
• Caches and Bus Modes  On-chip 8 KB instruction cache and 8 KB data cache; external bus operation supports up to 80 MHz (the 133 MHz core supports 2:1 mode).
• Communications Processor Module (CPM)  Integrated CPM for communications and protocol offload tasks as part of the MPC8xx architecture.
• Ethernet  Two 10/100 Mbps Ethernet interfaces for dual-network connectivity or separate control/data paths.
• USB  Single USB 2.0 interface for host/device connectivity.
• Memory and Controllers  DRAM controller on-chip to support external memory for system designs.
• Peripherals and Interfaces  Additional interfaces include I2C for sensor and peripheral control.
• Power and Packaging  3.3 V I/O, RoHS compliant, supplied in a 256-PBGA (23×23) surface-mount package.
• Operating Range  Rated for 0 °C to 95 °C ambient temperature environments; consumer qualification.

Typical Applications

• Embedded Communications  Dual 10/100 Ethernet and CPM integration make the MPC870ZT133 suitable for protocol processing, gateway and controller designs in embedded networking equipment.
• Industrial Controllers  3.3 V I/O, DRAM controller support and the operating temperature range enable use in industrial control and supervisory systems.
• Consumer Networked Devices  Consumer-qualified device for networked consumer electronics requiring Ethernet and USB connectivity.
• Protocol Offload and I/O Concentration  Use the integrated CPM and peripheral interfaces to offload communications tasks and consolidate I/O in compact designs.

Unique Advantages

• Highly integrated communications  On-chip CPM plus dual 10/100 Ethernet and USB 2.0 reduce external components for network-enabled embedded designs.
• Power Architecture™ core  The MPC8xx core provides a familiar 32-bit Power Architecture implementation with on-chip instruction and data caches for predictable performance.
• Compact PBGA package  256-PBGA (23×23) surface-mount package enables high-density board layouts for space-constrained applications.
• Designed for system memory  Integrated DRAM controller simplifies memory subsystem design for embedded platforms.
• Production-ready thermal range  Rated for 0 °C to 95 °C to support consumer and many industrial ambient conditions.
• RoHS compliant  Meets RoHS environmental requirements for lead-free assembly and manufacturing.

Why Choose MPC870ZT133?

The MPC870ZT133 positions a 133 MHz MPC8xx core with integrated communications peripherals and system logic in a single 256-PBGA package, offering a balanced combination of processing, I/O and network connectivity for embedded and communications-focused designs. Its integrated CPM, dual Ethernet interfaces and USB 2.0 provide tangible system-level consolidation that can reduce BOM and board complexity.

This device is suited to engineers building consumer and embedded networking equipment, industrial controllers and protocol offload solutions that require a compact, documented processor platform backed by NXP Semiconductors’ technical documentation for the MPC8xx family.

Request a quote or submit a procurement inquiry to initiate pricing and availability for the MPC870ZT133.