MPC870VR66

IC MPU MPC8XX 66MHZ 256BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Quantity 1,050 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC870
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package256-PBGA (23x23)
ECCN3A991A2Ethernet10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case256-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package256-PBGA (23×23)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC870VR66 – IC MPU MPC8XX 66MHZ 256BGA

The MPC870VR66 is an embedded microprocessor from NXP Semiconductors featuring a single MPC8xx 32-bit core running at 66 MHz. It combines a Power Architecture™–based CPU core with integrated system and communications functionality for controller, communications and networking applications.

Designed for embedded and consumer applications, the MPC870VR66 delivers on-chip peripheral integration and connectivity—reducing board-level complexity while providing documented hardware specifications for system implementation.

Key Features

  • Core & Architecture – Single MPC8xx 32-bit core operating at 66 MHz; core built on Power Architecture™ technology with memory management unit (MMU), and separate instruction and data caches.
  • Caches – On-chip instruction and data caches as described in the MPC875/MPC870 hardware specification (8 Kbyte instruction cache and 8 Kbyte data cache in the series documentation).
  • Communications Processor Module (CPM) – Integrated CPM for communications-focused offload and peripheral handling as described in the series hardware documentation.
  • Connectivity – Dual 10/100 Mbps Ethernet interfaces, one USB 2.0 port, and additional I2C interface for system and peripheral connectivity.
  • Memory & Controllers – DRAM controller support for system memory integration.
  • Power & I/O – 3.3 V I/O signaling to match common embedded system voltage domains.
  • Package & Mounting – 256-pin PBGA package (23 × 23 mm) with surface-mount mounting for compact board layouts.
  • Operating Range – Consumer-grade operating temperature range from 0 °C to 95 °C.
  • Compliance – RoHS compliant.
  • Qualification – Consumer qualification level as specified in product data.

Typical Applications

  • Networked Embedded Controllers – Use the integrated dual 10/100 Mbps Ethernet and CPM to implement network-attached control nodes and communication gateways.
  • Consumer Networking Equipment – Suitable for consumer-grade routers, access points and media devices that require Ethernet and USB connectivity.
  • Industrial and Appliance Control – 32-bit core, DRAM controller and multiple interfaces support control, HMI and peripheral management in embedded appliances.

Unique Advantages

  • Integrated Communications Peripherals: Dual Ethernet, USB 2.0 and I2C reduce external component count and simplify board design for connected applications.
  • Power Architecture™ Core with MMU and Caches: On-chip MMU and separate instruction/data caches improve software performance and system responsiveness where deterministic operation is needed.
  • Compact, Surface-Mount PBGA Package: 256-PBGA (23×23 mm) package enables high-density layouts while maintaining signal integrity for high-speed interfaces.
  • Consumer-Grade Temperature and RoHS Compliance: 0 °C to 95 °C operating range and RoHS compliance align the device with common consumer product requirements.
  • Single-Chip Integration: Consolidates CPU, system integration unit and CPM functionality to reduce BOM and simplify firmware/hardware integration.

Why Choose MPC870VR66?

The MPC870VR66 positions itself as a versatile, communications-capable embedded MPU for designs that require a Power Architecture™–based 32‑bit core with integrated networking peripherals. Its combination of on-chip CPM, dual Ethernet, USB 2.0 and DRAM controller allows designers to implement connected embedded systems with fewer external components.

Backed by NXP Semiconductors’ hardware specifications and documentation for the MPC875/MPC870 family, the MPC870VR66 is appropriate for teams seeking a documented, integrated processor solution for consumer and embedded networking applications requiring a 66 MHz MPC8xx core and standard embedded interfaces.

Request a quote or submit a procurement inquiry for the MPC870VR66 to receive pricing and availability information tailored to your project needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up