MPC870VR66
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 1,050 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC870 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 256-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 66MHz | Supplier Device Package | 256-PBGA (23×23) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC870VR66 – IC MPU MPC8XX 66MHZ 256BGA
The MPC870VR66 is an embedded microprocessor from NXP Semiconductors featuring a single MPC8xx 32-bit core running at 66 MHz. It combines a Power Architecture™–based CPU core with integrated system and communications functionality for controller, communications and networking applications.
Designed for embedded and consumer applications, the MPC870VR66 delivers on-chip peripheral integration and connectivity—reducing board-level complexity while providing documented hardware specifications for system implementation.
Key Features
- Core & Architecture – Single MPC8xx 32-bit core operating at 66 MHz; core built on Power Architecture™ technology with memory management unit (MMU), and separate instruction and data caches.
- Caches – On-chip instruction and data caches as described in the MPC875/MPC870 hardware specification (8 Kbyte instruction cache and 8 Kbyte data cache in the series documentation).
- Communications Processor Module (CPM) – Integrated CPM for communications-focused offload and peripheral handling as described in the series hardware documentation.
- Connectivity – Dual 10/100 Mbps Ethernet interfaces, one USB 2.0 port, and additional I2C interface for system and peripheral connectivity.
- Memory & Controllers – DRAM controller support for system memory integration.
- Power & I/O – 3.3 V I/O signaling to match common embedded system voltage domains.
- Package & Mounting – 256-pin PBGA package (23 × 23 mm) with surface-mount mounting for compact board layouts.
- Operating Range – Consumer-grade operating temperature range from 0 °C to 95 °C.
- Compliance – RoHS compliant.
- Qualification – Consumer qualification level as specified in product data.
Typical Applications
- Networked Embedded Controllers – Use the integrated dual 10/100 Mbps Ethernet and CPM to implement network-attached control nodes and communication gateways.
- Consumer Networking Equipment – Suitable for consumer-grade routers, access points and media devices that require Ethernet and USB connectivity.
- Industrial and Appliance Control – 32-bit core, DRAM controller and multiple interfaces support control, HMI and peripheral management in embedded appliances.
Unique Advantages
- Integrated Communications Peripherals: Dual Ethernet, USB 2.0 and I2C reduce external component count and simplify board design for connected applications.
- Power Architecture™ Core with MMU and Caches: On-chip MMU and separate instruction/data caches improve software performance and system responsiveness where deterministic operation is needed.
- Compact, Surface-Mount PBGA Package: 256-PBGA (23×23 mm) package enables high-density layouts while maintaining signal integrity for high-speed interfaces.
- Consumer-Grade Temperature and RoHS Compliance: 0 °C to 95 °C operating range and RoHS compliance align the device with common consumer product requirements.
- Single-Chip Integration: Consolidates CPU, system integration unit and CPM functionality to reduce BOM and simplify firmware/hardware integration.
Why Choose MPC870VR66?
The MPC870VR66 positions itself as a versatile, communications-capable embedded MPU for designs that require a Power Architecture™–based 32‑bit core with integrated networking peripherals. Its combination of on-chip CPM, dual Ethernet, USB 2.0 and DRAM controller allows designers to implement connected embedded systems with fewer external components.
Backed by NXP Semiconductors’ hardware specifications and documentation for the MPC875/MPC870 family, the MPC870VR66 is appropriate for teams seeking a documented, integrated processor solution for consumer and embedded networking applications requiring a 66 MHz MPC8xx core and standard embedded interfaces.
Request a quote or submit a procurement inquiry for the MPC870VR66 to receive pricing and availability information tailored to your project needs.

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