OMAP3525DCBCA

IC MPU OMAP-35XX 600MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 515-POP-FCBGA (14x14)

Quantity 27 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3525
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (14x14)
Display & Interface ControllersLCDECCN5A992CGradeIndustrial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed600MHz
Supplier Device Package515-POP-FCBGA (14×14)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3525DCBCA – IC MPU OMAP-35XX 600MHZ 515FCBGA

The OMAP3525DCBCA is an ARM® Cortex®-A8 based microprocessor IC in the OMAP3525 series, featuring a single 32‑bit core running at 600 MHz. Designed for embedded and industrial applications, it combines processor performance with integrated multimedia and connectivity elements to address LCD-based user interfaces, signal-processing tasks, and USB‑connected peripherals.

As an industrial-grade device with a broad operating temperature range and a compact POP‑FCBGA package, this MPU is targeted at systems that require sustained operation across harsh environments while retaining multimedia and peripheral integration.

Key Features

  • Core — ARM® Cortex®-A8 single core, 32‑bit architecture running at 600 MHz for general-purpose processing.
  • DSP and SIMD Acceleration — Integrated C64x+ DSP and NEON™ SIMD multimedia capabilities for signal processing and multimedia workloads.
  • Memory Interface — LPDDR memory controller support to interface with low-power DDR memories.
  • Graphics & Display — Graphics acceleration and an LCD display controller for driving display-based user interfaces.
  • Connectivity — Multiple USB ports (three USB 1.x and one USB 2.0) plus HDQ/1‑Wire for peripheral and sensor interfacing.
  • Package & Mounting — 515‑POP‑FCBGA (14×14) and 515‑VFBGA FCBGA package options; surface-mount mounting type for compact board designs.
  • Industrial Grade & Temperature Range — Grade: Industrial; operating temperature from −40 °C to 105 °C for extended-environment deployments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Embedded Human-Machine Interfaces — Integrated LCD controller and graphics acceleration enable responsive display-driven interfaces.
  • Industrial Signal Processing — C64x+ DSP and NEON™ SIMD support computation for on-device signal and multimedia processing.
  • USB Peripheral Systems — Multiple USB ports support connection to a variety of USB devices and peripherals in embedded systems.

Unique Advantages

  • Balanced Processing and Multimedia — Combines a Cortex‑A8 core with DSP and SIMD engines to handle general-purpose code alongside multimedia and signal workloads.
  • Integrated Display Support — On‑chip LCD controller and graphics acceleration reduce the need for external display hardware.
  • Robust Environmental Range — Industrial grade device rated from −40 °C to 105 °C for reliable operation in challenging conditions.
  • Flexible Connectivity — Multiple USB ports and HDQ/1‑Wire interface options simplify peripheral and sensor integration.
  • Compact Surface-Mount Packaging — 515‑POP‑FCBGA (14×14) surface-mount package supports compact, space-constrained designs.
  • Standards-Compliant Supply — RoHS compliance supports regulatory and manufacturing requirements.

Why Choose OMAP3525DCBCA?

The OMAP3525DCBCA positions itself as an industrial-grade embedded MPU that merges a 600 MHz ARM® Cortex®-A8 core with dedicated DSP and SIMD multimedia engines, integrated display control, and versatile USB connectivity. Its combination of processing, media acceleration, and compact POP‑FCBGA packaging makes it suitable for designers building LCD-based interfaces, signal-processing modules, and USB-connected embedded systems that require wide operating temperature support.

As part of the OMAP3525 series from Texas Instruments, this device offers a focused integration of compute and multimedia features for customers seeking a single-chip approach to reduce external BOM while meeting industrial environmental requirements.

Request a quote or submit an inquiry to receive pricing and availability for the OMAP3525DCBCA and to discuss how it fits your embedded design requirements.

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