OMAP3515ECBBA

IC MPU OMAP-35XX 600MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 515-POP-FCBGA (12x12)

Quantity 430 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3515
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (12x12)
Display & Interface ControllersLCDECCN5A992CGradeIndustrial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed600MHz
Supplier Device Package515-POP-FCBGA (12×12)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3515ECBBA – IC MPU OMAP-35XX 600MHZ 515FCBGA

The OMAP3515ECBBA is a single-core ARM® Cortex®-A8 microprocessor operating at 600 MHz, designed for embedded and industrial applications. It combines a 32-bit application core with multimedia DSP capabilities, LPDDR memory support, display and USB interfaces to address compact, performance-oriented embedded designs.

With industrial-grade temperature range and a high-density 515-POP-FCBGA (12×12) package, this device is targeted at systems requiring integrated display, multimedia and connectivity features in a surface-mount form factor.

Key Features

  • Core  Single ARM® Cortex®-A8 32-bit core running at 600 MHz for deterministic embedded processing.
  • Multimedia & DSP  Includes multimedia co-processor support and NEON™ SIMD to accelerate signal processing and media-oriented workloads.
  • Memory  LPDDR memory controller for low-power external memory support suitable for embedded systems.
  • Display  Built-in LCD display interface controller and graphics acceleration to support integrated human‑machine interfaces.
  • USB Connectivity  Multiple USB ports: USB 1.x (3 ports) and USB 2.0 (1 port) for a range of peripheral and host connectivity options.
  • Additional Interfaces  Includes HDQ/1‑Wire support for simple sensor or serial device interfacing.
  • Package & Mounting  Supplied in a 515‑POP‑FCBGA (12×12) surface-mount package, enabling compact PCB layouts.
  • Industrial Temperature Range  Rated for operation from −40 °C to 105 °C, suitable for harsh and wide-temperature environments.
  • Supplier & Series  Part of the OMAP3515 series from Texas Instruments, in a 515‑VFBGA/FCBGA package case.

Typical Applications

  • Industrial Control  Use the industrial temperature rating and single-core Cortex‑A8 processing for operator panels and embedded controllers requiring reliable operation across temperature extremes.
  • Human‑Machine Interfaces (HMIs)  The integrated LCD controller and graphics acceleration support compact display-driven interfaces in factory and field equipment.
  • Multimedia‑enabled Embedded Devices  NEON SIMD and multimedia DSP capabilities enable audio and media processing tasks in dedicated embedded appliances.
  • Connected Devices  Multiple USB ports and a HDQ/1‑Wire interface make the device suitable for peripherals and sensor connectivity in embedded systems.

Unique Advantages

  • Single high-performance Cortex‑A8 core: Provides a clear, deterministic processing platform for embedded applications that require a 32‑bit application processor at 600 MHz.
  • Integrated multimedia acceleration: NEON™ SIMD and multimedia co-processor support reduce external processing requirements for media and signal tasks.
  • Display-ready integration: LCD controller plus graphics acceleration simplifies implementation of on-device displays and HMIs.
  • Comprehensive connectivity: Multiple USB ports and HDQ/1‑Wire provide flexible peripheral and sensor interfacing with minimal external circuitry.
  • Industrial temperature capability: −40 °C to 105 °C rating supports deployment in harsh environments without additional thermal mitigation.
  • Compact surface-mount package: 515‑POP‑FCBGA (12×12) package enables dense, space-efficient board designs.

Why Choose OMAP3515ECBBA?

The OMAP3515ECBBA delivers a focused combination of ARM® Cortex®‑A8 processing, multimedia acceleration and integrated display and connectivity interfaces in a compact, surface-mount package. Its industrial temperature rating and LPDDR memory support make it well suited for embedded systems that require robust operation, display capability and peripheral connectivity.

Manufactured by Texas Instruments as part of the OMAP3515 series, this device is aimed at engineers designing industrial HMIs, multimedia-enabled embedded products and connected devices that need a balanced mix of processing, display and I/O integration.

Request a quote or submit an inquiry to receive pricing and availability for the OMAP3515ECBBA. Our team can provide volume pricing, lead-time details, and support for procurement and integration planning.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1930


    Headquarters: Dallas, Texas, USA


    Employees: 34,000+


    Revenue: $17.52 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up