P1020NSE2FFB
| Part Description |
PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 800MHz 689-TEPBGA II (31x31) |
|---|---|
| Quantity | 44 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | P1020 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e500v2 | Device Package | 689-TEPBGA II (31x31) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 2 Core, 32-Bit | Operating Temperature | 0°C – 125°C | Package / Case | Tray | ||
| Speed | 800MHz | Voltage | 2.5V, 3.3V |
Overview of P1020NSE2FFB – IC MPU QORIQ P1 800MHz PBGA689
The P1020NSE2FFB is a dual-core PowerPC e500v2 microprocessor from NXP Semiconductors’ QorIQ P1 series. It integrates two 32-bit e500v2 cores running at 800 MHz with system logic designed for networking, wireless infrastructure, and telecommunications applications.
This device delivers a combination of multiprocessing performance, on-chip memory and I/O integration, and a comprehensive security engine—making it suitable for embedded communication systems, gateways, and high-performance network appliances that require industrial-grade operation.
Key Features
- Core & Performance Dual PowerPC e500v2 cores, 32-bit, operating at 800 MHz, with on-chip L2 cache as described in the product brief.
- Memory Subsystem Integrated memory controller supporting DDR2 and DDR3 SDRAM configurations for flexible system memory options.
- Integrated Security Engine (SEC 3.3) On-chip security coprocessor (SEC 3.3) with algorithm support including 3DES, AES, KASUMI, MD5, RNG, SHA, and SNOW 3G.
- High-Speed Ethernet Three enhanced three-speed Ethernet controllers (10/100/1000 Mbps) with support noted in the product brief for SGMII and IEEE 1588 precision time protocol.
- USB and Expansion Two USB 2.0 interfaces with integrated PHY; two PCI Express controllers and additional high-speed I/O options are included in the device block descriptions.
- Peripherals & I/O On-chip DMA, independent SD/MMC host controller (eSDHC), TDM interface, I2C, DUART, and an enhanced local bus controller as detailed in the product brief.
- System Monitoring & Boot Integrated system performance monitor and multiple device boot location options documented in the product brief.
- Package & Mounting 689-TEPBGA II package (31 × 31 mm) / 689-BBGA exposed pad, surface-mount package suitable for industrial designs.
- Operating Range Industrial operating temperature range from 0 °C to 125 °C.
- Qualification Listed as Industrial qualification in the product specifications.
Typical Applications
- Networking Equipment — Used in routers, switches, and network appliances where multiple Gigabit Ethernet ports, IEEE 1588 support, and integrated packet-handling are required.
- Wireless Infrastructure — Suited for wireless baseband/control systems that need dual-core processing, DDR memory support, and high-speed I/O.
- Telecommunications Systems — Applicable to telecom applications that benefit from TDM interfaces, robust security acceleration, and industrial temperature operation.
- Storage & RAID Controllers — Can be applied in RAID controller and storage gateway designs as outlined in the product brief’s application examples.
- SMB Gateways and WLAN Access Points — Integration of USB, eS-DHC, Ethernet, and security engines supports compact gateway and access-point designs.
Unique Advantages
- Highly integrated communications platform: Dual cores, DDR2/DDR3 memory controller, three Gigabit Ethernet controllers, USB 2.0, PCIe, and peripheral interfaces reduce external component count and simplify system design.
- On-chip hardware security acceleration: SEC 3.3 with broad cryptographic algorithm support offloads security workloads from the CPU cores for efficient secure data processing.
- Designed for synchronized networks: Enhanced Ethernet controllers with IEEE 1588 support enable precise network time synchronization for communication systems.
- Industrial temperature qualification: Rated for 0 °C to 125 °C, aligning with industrial deployment environments documented in the specifications.
- Flexible memory and boot options: Support for DDR2/DDR3 and multiple boot locations enables adaptable memory architectures and system configurations.
- Comprehensive I/O set: Built-in DMA, SD/MMC host, TDM, I2C, DUART, and PCIe support enable a wide range of peripheral and expansion scenarios without extensive external controllers.
Why Choose P1020NSE2FFB?
The P1020NSE2FFB positions itself as a purpose-built embedded processor for networking, wireless infrastructure, and telecommunications designs that require dual-core PowerPC performance combined with broad on-chip integration. Its integrated memory controller, multi-port Gigabit Ethernet, hardware security engine, and extensive peripheral set reduce system complexity and component count.
With industrial temperature operation and packaging suited for surface-mount assembly, this device fits applications demanding dependable operation and flexible system architectures. As part of the QorIQ P1 family, it aligns with the platform features and development environment outlined in the product brief for streamlined engineering and deployment.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the P1020NSE2FFB.

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