P1015NXN5FFB
| Part Description |
Microprocessor IC * 561-TEPBGA I (23x23) |
|---|---|
| Quantity | 207 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | P1015 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Security; SEC 4.4 | Core Processor | PowerPC e500v2 | Device Package | 561-TEPBGA I (23x23) | ||
|---|---|---|---|---|---|---|---|
| Ethernet | 10/100/1000Mbps (3) | Grade | Industrial | Graphics Acceleration | No | ||
| Mounting Method | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40 °C – 125 °C | ||
| Package / Case | Tray | Qualification | Industrial | RAM Controllers | DDR3 | ||
| Speed | 667 MHz | USB | USB 2.0 + PHY (2) |
Overview of P1015NXN5FFB – Microprocessor, PowerPC e500v2, 667 MHz
The P1015NXN5FFB is a single-core microprocessor IC based on the Power Architecture® e500v2 core running at 667 MHz, supplied in a 561-TEPBGA I (23x23) surface-mount package. Designed for networking, telecom, defense and industrial markets, it combines performance, low-power 45 nm technology and integrated peripherals to address multi-service gateways, Ethernet switch controllers, wireless LAN access points and other embedded control applications.
Key on-chip capabilities include a DDR3 memory controller, hardware security acceleration and multiple high-speed interfaces (including three gigabit Ethernet ports and USB 2.0 with PHY), all rated for industrial operation from −40 °C to 125 °C.
Key Features
- Core Power Architecture e500v2 single 32-bit core operating at 667 MHz for embedded control and packet-processing tasks.
- Memory and Cache Integrated DDR3 memory controller and a 256 KB L2 cache (configurable) to support efficient data buffering and low-latency access.
- Security and Acceleration On-chip security features include cryptography engines, a random number generator and SEC 4.4 co-processor support for accelerated security processing.
- Networking Interfaces Three 10/100/1000 Mbps Ethernet interfaces provide multi-port connectivity for switch and gateway applications.
- USB and Peripherals Dual USB 2.0 ports with PHY plus additional peripherals such as DUART, SD/MMC, SPI and timers for flexible system integration.
- System Integration Integrated DMA controllers, PCIe lanes and SerDes support reduce external component count and simplify board design.
- Package and Temperature 561-TEPBGA I (23x23) surface-mount package supplied in tray; industrial qualification with operating range −40 °C to 125 °C.
Typical Applications
- Multi-service Gateways Use the P1015NXN5FFB to consolidate routing, security and management functions with integrated Ethernet and security acceleration.
- Ethernet Switch Controllers Three gigabit Ethernet ports and DMA support make it suitable for embedded switch control and traffic handling.
- Wireless LAN Access Points DDR3 memory support and abundant I/O enable control-plane processing and connectivity for access-point designs.
- Industrial Control Industrial-grade qualification and extended temperature range support robust operation in factory and field environments.
Unique Advantages
- Integrated Security Acceleration: Cryptography engines, RNG and SEC 4.4 co-processor support provide hardware-accelerated security building blocks for encrypted communications and device authentication.
- Rich, On-chip Connectivity: Three gigabit Ethernet ports, dual USB 2.0 with PHY and additional serial interfaces reduce external bridging components and simplify BOM.
- Memory and Cache Flexibility: DDR3 controller and a 256 KB configurable L2 cache enable optimized memory bandwidth and cache partitioning for real-time and networking workloads.
- Industrial-ready Thermal Range: Qualified for −40 °C to 125 °C operation, suitable for demanding embedded and industrial deployments.
- Pin and Software Compatibility (P1 Family): Series-level compatibility allows design scaling within the P1 family while maintaining a common software architecture.
- Compact BGA Package: 561-TEPBGA I (23x23) surface-mount package supports dense board layouts for space-constrained systems.
Why Choose P1015NXN5FFB?
The P1015NXN5FFB positions itself as a compact, integrated processor option for embedded networking and industrial control designs that require a balance of processing performance, hardware security and extensive on-chip I/O. Its Power Architecture e500v2 core, DDR3 support and multiple high-speed interfaces let engineers consolidate system functions while managing power and board space.
With industrial-grade qualification, hardware security features and series-level compatibility across the P1 family, the P1015NXN5FFB supports scalable designs and long-term deployment in networking, telecom, defense and industrial applications.
Request a quote or submit an inquiry to evaluate P1015NXN5FFB for your next embedded or networking design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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