PCX7447AVGH1000NB
| Part Description |
PowerPC Microprocessor IC - 1 Core, 32-Bit 1.0GHz 360-HiTCE-CBGA (25x25) |
|---|---|
| Quantity | 261 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | PowerPC 7xx |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC | Device Package | 360-HiTCE-CBGA (25x25) | ECCN | 3A001A3 | ||
|---|---|---|---|---|---|---|---|
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 110°C (TJ) | Package / Case | 360-BCBGA | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | Speed | 1.0GHz | ||
| Supplier Device Package | 360-HiTCE-CBGA (25×25) | Voltage – I/O | 1.1V, 1.3V |
Overview of PCX7447AVGH1000NB – IC MPU POWERPC 1.0GHZ 360CBGA
The PCX7447AVGH1000NB is a PowerPC microprocessor IC offering a single 32-bit core running at 1.0 GHz in a 360-HiTCE-CBGA (25×25) surface-mount package. The device is supplied in an industrial-grade configuration with an operating temperature range of −40 °C to 110 °C and is RoHS compliant.
Designed for embedded computing and signal-processing tasks, the PCX7447A family delivers on-chip cache, SIMD/vector acceleration and power-management features to balance performance and efficiency for industrial and embedded system designs.
Key Features
- Core & Architecture PowerPC 32-bit core operating at 1 GHz, implementing PowerPC RISC architecture for embedded processing tasks.
- SIMD and Floating-Point Series-level support for a 128-bit AltiVec implementation and a double-precision floating-point unit for vector and numeric workloads.
- On-Chip Cache Integrated L1 caches (32 KB instruction + 32 KB data) and 512 KB of on-chip L2 cache to reduce external memory bandwidth and improve deterministic performance.
- Memory & Bus Series documentation describes a 64-bit data bus and 36-bit address bus interface, with a 4 GB direct addressing range and support for virtual memory addressing.
- Power & Power-Saving Modes Series-level power-management features include Nap, Doze and Sleep modes. Datasheet figures list typical power of 8.0 W at 1.0 GHz (VDD = 1.1 V) under full operating conditions.
- Performance Features Superscalar core design with multiple execution units and on-chip performance monitoring and dynamic frequency switching (DFS) for adaptive performance scaling.
- System & Debug Includes JTAG/COP debug interface and thermal/power management facilities as documented for the series.
- Package & Mounting 360-BCBGA / 360-HiTCE-CBGA (25×25) ball grid array; surface-mount package suitable for compact, high-density board layouts.
- Industrial Grade & Reliability Rated for −40 °C to 110 °C, intended for industrial temperature applications; RoHS compliant.
- Graphics Acceleration No integrated graphics acceleration; optimized for compute and signal-processing workloads rather than display tasks.
Typical Applications
- Embedded Computing & Signal Processing High-performance embedded tasks and digital signal processing where on-chip vector/FPU resources and large caches reduce latency and external memory dependence.
- Industrial Control & Instrumentation Industrial-grade temperature range and surface-mount CBGA packaging suit control systems and instrumentation requiring robust operation across wide temperatures.
- Communications & Networking Equipment Memory subsystem and bus protocol support at the series level make the device suitable for embedded processing roles in networking and communications modules.
Unique Advantages
- Balanced performance and efficiency: On-chip L1 and 512 KB L2 cache combined with SIMD and FPU resources deliver compute density while minimizing external memory traffic.
- Industrial temperature capability: Qualified for −40 °C to 110 °C operation, enabling deployment in demanding environmental conditions.
- Power-management flexibility: Nap, Doze and Sleep modes plus dynamic frequency switching allow designers to tune power consumption to workload requirements; typical 1.0 GHz power is documented at 8.0 W (VDD = 1.1 V) for full operating conditions.
- Compact CBGA footprint: 360-ball HiTCE-CBGA (25×25) package enables high-density PCB integration for space-constrained embedded systems.
- Series-level system features: Debug (JTAG/COP), performance monitoring and thermal/power management features simplify system bring-up and operational monitoring.
- Standards-aligned supply: RoHS compliance supports regulatory requirements for lead-free manufacturing.
Why Choose PCX7447AVGH1000NB?
The PCX7447AVGH1000NB combines a single 32-bit PowerPC core at 1.0 GHz with on-chip cache, SIMD/vector acceleration and series-proven power-management capabilities to deliver a compact, industrial-grade processing node for embedded and signal-processing designs. Its CBGA package and wide operating temperature range make it well suited to space- and environment-constrained applications.
Engineers specifying this device benefit from integrated caches, debug interfaces and dynamic performance controls documented for the PC7447A family, which together reduce system-level complexity and provide a clear upgrade path within the series for similar embedded processing requirements.
Request a quote or submit an inquiry to receive availability and pricing information for the PCX7447AVGH1000NB.

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