PCX7447AVGH1000NB

IC MPU POWERPC 1.0GHZ 360CBGA
Part Description

PowerPC Microprocessor IC - 1 Core, 32-Bit 1.0GHz 360-HiTCE-CBGA (25x25)

Quantity 261 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesPowerPC 7xx
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPCDevice Package360-HiTCE-CBGA (25x25)ECCN3A001A3
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 110°C (TJ)Package / Case360-BCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed1.0GHz
Supplier Device Package360-HiTCE-CBGA (25×25)Voltage – I/O1.1V, 1.3V

Overview of PCX7447AVGH1000NB – IC MPU POWERPC 1.0GHZ 360CBGA

The PCX7447AVGH1000NB is a PowerPC microprocessor IC offering a single 32-bit core running at 1.0 GHz in a 360-HiTCE-CBGA (25×25) surface-mount package. The device is supplied in an industrial-grade configuration with an operating temperature range of −40 °C to 110 °C and is RoHS compliant.

Designed for embedded computing and signal-processing tasks, the PCX7447A family delivers on-chip cache, SIMD/vector acceleration and power-management features to balance performance and efficiency for industrial and embedded system designs.

Key Features

  • Core & Architecture  PowerPC 32-bit core operating at 1 GHz, implementing PowerPC RISC architecture for embedded processing tasks.
  • SIMD and Floating-Point  Series-level support for a 128-bit AltiVec implementation and a double-precision floating-point unit for vector and numeric workloads.
  • On-Chip Cache  Integrated L1 caches (32 KB instruction + 32 KB data) and 512 KB of on-chip L2 cache to reduce external memory bandwidth and improve deterministic performance.
  • Memory & Bus  Series documentation describes a 64-bit data bus and 36-bit address bus interface, with a 4 GB direct addressing range and support for virtual memory addressing.
  • Power & Power-Saving Modes  Series-level power-management features include Nap, Doze and Sleep modes. Datasheet figures list typical power of 8.0 W at 1.0 GHz (VDD = 1.1 V) under full operating conditions.
  • Performance Features  Superscalar core design with multiple execution units and on-chip performance monitoring and dynamic frequency switching (DFS) for adaptive performance scaling.
  • System & Debug  Includes JTAG/COP debug interface and thermal/power management facilities as documented for the series.
  • Package & Mounting  360-BCBGA / 360-HiTCE-CBGA (25×25) ball grid array; surface-mount package suitable for compact, high-density board layouts.
  • Industrial Grade & Reliability  Rated for −40 °C to 110 °C, intended for industrial temperature applications; RoHS compliant.
  • Graphics Acceleration  No integrated graphics acceleration; optimized for compute and signal-processing workloads rather than display tasks.

Typical Applications

  • Embedded Computing & Signal Processing  High-performance embedded tasks and digital signal processing where on-chip vector/FPU resources and large caches reduce latency and external memory dependence.
  • Industrial Control & Instrumentation  Industrial-grade temperature range and surface-mount CBGA packaging suit control systems and instrumentation requiring robust operation across wide temperatures.
  • Communications & Networking Equipment  Memory subsystem and bus protocol support at the series level make the device suitable for embedded processing roles in networking and communications modules.

Unique Advantages

  • Balanced performance and efficiency: On-chip L1 and 512 KB L2 cache combined with SIMD and FPU resources deliver compute density while minimizing external memory traffic.
  • Industrial temperature capability: Qualified for −40 °C to 110 °C operation, enabling deployment in demanding environmental conditions.
  • Power-management flexibility: Nap, Doze and Sleep modes plus dynamic frequency switching allow designers to tune power consumption to workload requirements; typical 1.0 GHz power is documented at 8.0 W (VDD = 1.1 V) for full operating conditions.
  • Compact CBGA footprint: 360-ball HiTCE-CBGA (25×25) package enables high-density PCB integration for space-constrained embedded systems.
  • Series-level system features: Debug (JTAG/COP), performance monitoring and thermal/power management features simplify system bring-up and operational monitoring.
  • Standards-aligned supply: RoHS compliance supports regulatory requirements for lead-free manufacturing.

Why Choose PCX7447AVGH1000NB?

The PCX7447AVGH1000NB combines a single 32-bit PowerPC core at 1.0 GHz with on-chip cache, SIMD/vector acceleration and series-proven power-management capabilities to deliver a compact, industrial-grade processing node for embedded and signal-processing designs. Its CBGA package and wide operating temperature range make it well suited to space- and environment-constrained applications.

Engineers specifying this device benefit from integrated caches, debug interfaces and dynamic performance controls documented for the PC7447A family, which together reduce system-level complexity and provide a clear upgrade path within the series for similar embedded processing requirements.

Request a quote or submit an inquiry to receive availability and pricing information for the PCX7447AVGH1000NB.

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