PCX7457VGH1000NC

The PCX7457VGH1000NC is a single‑core PowerPC G4 microprocessor operating at 1.0 GHz, designed for embedded networking and computing applications. It implements a 32‑bit RISC core with integrated cache hierarchy and a high‑bandwidth L3 interface for scalable memory performance.

Built for industrial environments, the device combines performance features such as superscalar execution and integrated L1/L2 caches with power‑management modes to balance throughput and efficiency in surface‑mount 483‑ball CBGA packaging.

Key Features

• Core PowerPC G4 single core, 32‑bit architecture with superscalar execution capable of fetching multiple instructions per cycle.
• Performance 1 GHz operating frequency with fINT max specified at 1 GHz and bus clock options supporting fBUS up to 133 MHz/166 MHz.
• Cache and Memory Integrated L1 (36 KB instruction, 32 KB data) and 512 KB L2 cache plus an internal L3 tag/controller supporting a glueless backside L3 cache via external SRAM (1, 2 or 4 MB configurations supported).
• Bus and Interface Options Selectable bus clock divisors (30 CPU bus dividers up to 28×) and selectable MPx/60x and L3 interface voltages (1.8 V or 2.5 V) for flexible system integration.
• Power and Power Management Typical power dissipation examples provided in the datasheet: ~12.6 W at 1 GHz (VDD = 1.3 V) and ~8.3 W at 1 GHz (VDD = 1.1 V). Includes Nap, Doze and Sleep modes for power saving.
• Memory Addressing and Virtual Memory 4 GB direct addressing range and virtual memory support described in the datasheet.
• Package and Mounting 483‑HiTCE‑CBGA supplier package (29 × 29 mm) with a 483‑BCBGA exposed pad package case; surface‑mount mounting type suitable for board‑level assembly.
• Environmental and Grade Industrial grade device with operating temperature range of −40 °C to +110 °C and RoHS compliant status.
• Additional System Features On‑chip features listed in the datasheet include a double‑precision floating‑point unit, SIMD multimedia unit, JTAG/COP interface, thermal/power management and performance monitoring facilities.

Typical Applications

• Networking and Communications Targeted at networking and computing systems applications, the device is suited for packet processing, routing control and protocol handling where a high‑performance RISC core and flexible memory interface are required.
• Industrial Control Industrial‑grade temperature range and robust package make it appropriate for control systems that require steady operation across −40 °C to +110 °C.
• Embedded Compute Modules Integrated caches, L3 support and configurable bus/interface voltages enable use in embedded compute and subsystem modules that demand scalable memory performance.

Unique Advantages

• Single‑chip processing with integrated cache On‑die L1 and 512 KB L2 cache reduce external memory dependency and improve deterministic performance for embedded workloads.
• Backside L3 support Dedicated L3 tag/controller and high‑bandwidth interface allow glueless connection to external SRAM for expanded cache or private memory.
• Flexible interface voltages Selectable MPx/60x and L3 interface voltage options (1.8 V, 2.5 V) simplify integration with different system power architectures.
• Industrial temperature rating Rated for −40 °C to +110 °C operation to support demanding environmental deployments.
• Power management modes Nap, Doze and Sleep modes provide designers with options to trade power for performance in energy‑conscious applications.
• Standards‑oriented packaging 483‑ball CBGA formats with exposed pad support high‑reliability assembly and thermal management on surface‑mount PCBs.

Why Choose PCX7457VGH1000NC?

The PCX7457VGH1000NC combines the PowerPC G4 RISC core with a robust cache hierarchy and a dedicated L3 interface, delivering a balanced platform for embedded networking and compute systems that require deterministic performance and flexible memory configurations. Its industrial temperature rating and CBGA packaging support reliable operation in harsh environments.

This module is suited to designers who need a compact, surface‑mount MPu with configurable bus and interface voltages, integrated power‑management modes, and on‑chip resources that reduce external BOM while enabling scalable system memory designs.

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