PCX755BVZFU350LE

The PCX755BVZFU350LE is a 32-bit PowerPC microprocessor from Microchip Technology, delivered in a 360-ball PBGA (25×25) package and rated at 350 MHz. Designed for embedded systems and industrial applications, this single-core MPU combines PowerPC architecture performance with on-chip features useful for low-power and compact designs.

Key Features

• Core & Architecture PowerPC single-core, 32-bit implementation providing RISC-based instruction processing suitable for embedded workloads.
• Clock & Throughput 350 MHz core frequency; datasheet-series performance metrics include superscalar execution (up to 3 instructions per clock) and multi-instruction dispatch capabilities.
• Power Management Nap, Doze and Sleep modes for power savings and thermal/power management features documented in the series datasheet.
• Memory & Cache 32 KB instruction cache and 32 KB data cache; PC755-series devices include an enhanced dedicated L2 cache interface with on‑chip L2 tags (series-level detail).
• Bus & Interfaces 64-bit data bus with 32-bit address interface; selectable bus clock with CPU bus dividers and a documented maximum bus frequency in the series.
• Execution & MMU Six independent execution units and on-chip instruction/data MMU structures as described for the PC755/745 family.
• Packaging & Mounting 360-PBGA (25×25) surface-mount package with exposed pad; compact footprint for space-constrained embedded boards.
• Industrial Temperature Rating Operating temperature range of −40 °C to 110 °C, suitable for industrial environments.
• Voltage Domains Series-level I/O and core voltage references include I/O at 2.5 V / 3.3 V and internal voltage at 2.0 V as specified in the datasheet.
• Debug & Test On-chip debug support and JTAG-compliant test interface documented for the PC755/745 family.
• Environmental Compliance RoHS compliant.

Typical Applications

• Embedded Control — Single-core PowerPC performance for general embedded controllers, real-time control tasks and system management functions.
• Industrial Automation — Industrial-grade temperature range and robust packaging for factory automation and machine control electronics.
• Networking & Communications — Bus and memory interfaces suitable for control-plane processing in networking appliances and communications modules.
• Instrumentation & Test Equipment — Deterministic execution characteristics and on-chip debug support for instrumentation controllers and test platforms.

Unique Advantages

• PowerPC Architecture in a Compact PBGA: Provides 32-bit PowerPC processing at 350 MHz in a 360-PBGA (25×25) package for compact embedded designs.
• Integrated L2 Interface and Tags (Series Feature): The PC755 series includes an enhanced L2 cache interface with on-chip L2 tags, simplifying external cache implementations.
• Low-Power Modes: Support for Nap, Doze and Sleep modes enables lower power operation when full performance is not required.
• Industrial Temperature Capability: −40 °C to 110 °C rating supports deployment in demanding environmental conditions.
• On-Chip Debug and JTAG Compliance: Facilitates development, validation and production test through standardized debug and test interfaces.
• RoHS Compliant: Meets environmental regulatory expectations for lead-free assembly.

Why Choose PCX755BVZFU350LE?

The PCX755BVZFU350LE positions itself as a practical choice for embedded and industrial designs that require a 350 MHz PowerPC core, deterministic 32-bit processing, and a compact 360-ball PBGA package. Its combination of on-chip cache, bus interface options, power management modes and industrial temperature rating makes it suitable for control, communications and instrumentation applications.

Manufactured by Microchip Technology and drawn from the PC755/745 product family specifications, this device delivers a balance of performance, integration and thermal range for long-lived embedded projects where board space and power management are priorities.

Request a quote or submit a purchase inquiry to evaluate the PCX755BVZFU350LE for your next embedded or industrial design project.