PCX745BVZFU300LE

The PCX745BVZFU300LE is a single-core, 32-bit PowerPC microprocessor IC operating at 300 MHz and supplied in a 255‑PBGA (21×21) surface-mount package. It is offered as an industrial‑grade device with an operating temperature range of ‑40 °C to 110 °C and RoHS compliance.

Designed for embedded applications, this PowerPC 7xx family device delivers a combination of deterministic performance, on-chip debug capability and power management features suited to industrial and low‑power system designs.

Key Features

• Core and Performance Single 32‑bit PowerPC core at 300 MHz with a superscalar pipeline capable of multiple instruction issue for improved instruction throughput.
• Memory and Cache 32‑KB instruction cache and 32‑KB data cache with a 64‑bit data and 32‑bit address bus interface; supports up to 4 GByte of physical memory.
• Execution Units Six independent execution units including integer and floating‑point resources for parallel instruction execution and mixed workloads.
• Power and Power Management Power management features include Nap, Doze and Sleep modes plus dynamic power management to optimize energy use in low‑power systems.
• System Interfaces & Debug JTAG/COP on‑chip debug support and selectable bus clocking (CPU bus dividers) with a bus frequency capability up to 100 MHz.
• Packaging and Mounting 255‑PBGA (21×21) flip‑chip plastic BGA with exposed pad, designed for surface‑mount assembly.
• Environmental & Screening Industrial grade screening with an operating temperature range of ‑40 °C to 110 °C and RoHS compliance.

Typical Applications

• Embedded Control — Real‑time control and management tasks in embedded systems where deterministic single‑core processing is required.
• Industrial Automation — Controllers and I/O processing in equipment operating across industrial temperature ranges.
• Low‑Power Systems — Battery‑conscious or thermally constrained designs that benefit from integrated Nap, Doze and Sleep modes.

Unique Advantages

• Balanced Performance and Efficiency: 300 MHz PowerPC core with superscalar capability and six execution units provides computational throughput while supporting power‑saving modes.
• On‑Chip Debug and System Integration: JTAG/COP debug support simplifies bring‑up and debugging in embedded designs.
• Industrial Robustness: Rated for ‑40 °C to 110 °C operation and manufactured with industrial screening, making it suitable for demanding environments.
• Compact, Surface‑Mount Package: 255‑PBGA (21×21) flip‑chip package offers a compact footprint for space‑constrained PCBs.
• Standards and Compliance: RoHS compliant and designed with system clocking and bus interface flexibility (bus up to 100 MHz) for straightforward integration.

Why Choose PCX745BVZFU300LE?

The PCX745BVZFU300LE positions itself as a practical choice for embedded and industrial applications that require a reliable, single‑core PowerPC implementation with deterministic performance and integrated power management. Its combination of cache architecture, execution resources and debug support enables efficient software development and system integration.

With industrial temperature screening, a compact 255‑PBGA package and RoHS compliance, this device is well suited for designs that demand durability and long‑term deployment in controlled‑environment and industrial use cases.

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