PCX755BVZFU300LE

The PCX755BVZFU300LE is a PowerPC®-based, 32-bit single-core microprocessor operating at 300 MHz, designed for embedded and industrial applications. Packaged in a 360-ball PBGA (25×25) with exposed pad and specified for an industrial temperature range, it delivers deterministic processing for control, communications and instrumentation systems.

Built on the PC755/745 family architecture, the device offers a balance of performance and power management features suitable for space-constrained, surface-mount designs that require robust thermal and environmental margins.

Key Features

• Core & Architecture PowerPC 32-bit single-core processor operating at 300 MHz, delivering predictable, RISC-based execution for embedded workloads.
• Execution & Cache Series-level architecture includes superscalar execution with multiple independent execution units and 32 KB instruction plus 32 KB data caches to accelerate code and data access.
• Memory & Bus 64-bit data and 32-bit address bus interface with selectable bus clock options (series feature) and support for dedicated L2 cache interface on PC755 variants.
• Power Management Supported power-saving states such as Nap, Doze and Sleep modes (series feature) to reduce power consumption in idle conditions.
• Debug & Test On-chip debug support and JTAG/COP interface (series feature) for development and production testing.
• Voltage Domains Series-level voltage options include I/O at 2.5 V / 3.3 V and internal core voltage at 2.0 V.
• Package & Mounting 360-PBGA (25×25) flip-chip package with exposed pad intended for surface-mount assembly, optimized for compact embedded PCBs.
• Industrial Temperature Range Specified for operation from −40 °C to +110 °C, making it suitable for demanding environmental conditions.
• Compliance RoHS compliant for material and process environmental requirements.

Typical Applications

• Industrial control systems — Deterministic 32-bit processing and industrial temperature rating fit PLCs, motion controllers and factory automation tasks.
• Networking & communications — Single-core PowerPC architecture and bus flexibility support protocol handling, packet processing and control-plane functions.
• Instrumentation & test equipment — On-chip debug, robust execution units and compact PBGA package support embedded test controllers and measurement front ends.
• Embedded appliances — Compact surface-mount package and power modes enable integration into space-constrained embedded appliances and OEM devices.

Unique Advantages

• Industrial-grade thermal range — Rated from −40 °C to +110 °C to maintain operation in harsh environments and extended-temperature deployments.
• Power-aware operation — Multiple low-power modes (Nap, Doze, Sleep) reduce energy use during idle periods, improving system-level efficiency.
• Compact, assembly-friendly package — 360-PBGA (25×25) with exposed pad provides a high-pin-count solution in a compact footprint for modern embedded boards.
• Debug and test support — JTAG/COP and on-chip debug capabilities simplify development, bring-up and manufacturing test flows.
• Clear interface voltages — Defined I/O and core voltage domains help streamline power-supply design for mixed-voltage systems.
• RoHS compliance — Meets environmental material standards for modern product designs.

Why Choose PCX755BVZFU300LE?

The PCX755BVZFU300LE combines a 300 MHz PowerPC core with series-proven architecture elements—cache, multiple execution units and power-management modes—packaged in a compact 360-ball PBGA for embedded and industrial designs. Its industrial temperature rating and surface-mount package make it a practical choice for applications that require steady 32-bit processing in challenging environments.

This part is well suited to engineers and procurement teams building control, communications or instrumentation products who need a reliable, RoHS-compliant PowerPC solution with on-chip debug and design-oriented voltage domains.

Request a quote or submit an inquiry to receive pricing and availability for the PCX755BVZFU300LE and to discuss integration support for your next embedded design.