PCX8240VTPU200EZD3
| Part Description |
PowerPC 603e Microprocessor IC - 1 Core, 32-Bit 200MHz 352-TBGA (35x35) |
|---|---|
| Quantity | 911 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | PowerPC 8xx |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 352-TBGA (35x35) | ECCN | 3A001A3 | ||
|---|---|---|---|---|---|---|---|
| Grade | Industrial | Graphics Acceleration | No | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 110°C (TJ) | Package / Case | 352-LBGA | ||
| RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | RoHS Compliance | RoHS non-compliant | ||
| Speed | 200MHz | Supplier Device Package | 352-TBGA (35×35) | Voltage – I/O | 3.3V |
Overview of PCX8240VTPU200EZD3 – IC MPU 200MHZ 352TBGA
The PCX8240VTPU200EZD3 is a PowerPC 603e-based integrated microprocessor delivering a 32-bit superscalar core at 200 MHz in a 352-TBGA (35×35) surface-mount package. Designed for embedded and industrial applications, it combines a high-performance processor core with integrated peripheral logic and memory support to simplify system design.
Key value propositions include integrated system-level interfaces (including PCI and memory controller), support for common DRAM types, 3.3 V I/O operation, and an industrial temperature range for robust operation in demanding environments.
Key Features
- Core — PowerPC 603e Superscalar 32-bit processor core clocked at 200 MHz, with integer and optional floating-point units and standard system register and branch units.
- Memory and Cache Integrated high-bandwidth memory controller with support for DRAM and SDRAM; on-chip 16 KB instruction and 16 KB data L1 caches (lockable on a per-way basis as specified in the family datasheet).
- Peripheral Integration Integrated peripheral logic includes a PCI bridge and additional controllers (DMA, interrupt controller, two-wire interface) to reduce external components and simplify board design.
- PCI Support 32-bit PCI interface with operation up to 66 MHz and PCI 2.1-compatible signaling as described for the PC8240 family.
- I/O and Interfaces 3.3 V I/O voltage and additional interfaces including I2C (two‑wire interface) for peripheral connectivity.
- Power and Management Dynamic power management features referenced in the PC8240 family for balancing performance and power consumption.
- Package and Mounting 352-TBGA (35×35) surface-mount package suitable for high-density embedded PCB designs.
- Industrial Temperature Range Rated for operation from −40 °C to 110 °C for industrial applications.
- RoHS Compliant Conforms to RoHS environmental requirements.
Typical Applications
- Embedded Systems Use as a central processor for embedded designs that benefit from integrated peripheral logic and memory support.
- Industrial Control Suitable for control platforms requiring operation across an extended temperature range and reliable 3.3 V I/O interfacing.
- PCI-Based Systems Acts as a PCI host or agent controller where on-chip PCI bridging and 32-bit PCI operation simplify system integration.
- Memory-Intensive Applications Platforms that require direct DRAM/SDRAM support and high-bandwidth memory access can leverage the integrated memory controller.
Unique Advantages
- Highly Integrated Processor Combines a PowerPC 603e core with peripheral logic and memory controller to reduce BOM and board complexity.
- PCI and Peripheral Support On-chip PCI bridge and additional controllers reduce external interface components and speed development of PCI-capable systems.
- Industrial-Grade Reliability Specified for −40 °C to 110 °C operation to meet demanding environmental requirements.
- Compact High-Density Package 352-TBGA (35×35) surface-mount package enables compact, high-density PCB layouts.
- Memory Versatility Supports a wide range of DRAM/SDRAM configurations to scale from modest to large memory footprints.
- Environmentally Compliant RoHS compliance addresses regulatory and sustainability considerations.
Why Choose PCX8240VTPU200EZD3?
The PCX8240VTPU200EZD3 positions itself as a performance-oriented, highly integrated solution for embedded and industrial designs that require a PowerPC 603e core paired with system-level peripheral logic. Its combination of a 200 MHz core, on-chip memory controller, PCI support, and industrial temperature rating makes it suitable for robust, long-life applications where integration and reliability are priorities.
Designed for engineers and procurement teams seeking a compact, surface-mount microprocessor with established family-level feature sets, this part offers scalability through flexible memory support and a reduced component count for streamlined system design and assembly.
Request a quote or submit an RFQ for PCX8240VTPU200EZD3 to receive pricing and availability information.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D