PCX7447AVGH1167NB

IC MPU POWERPC 1.167GHZ 360CBGA
Part Description

PowerPC Microprocessor IC - 1 Core, 32-Bit 1.167GHZ 360-HiTCE-CBGA (25x25)

Quantity 99 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesPowerPC 7xx
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPCDevice Package360-HiTCE-CBGA (25x25)ECCN3A001A3
GradeIndustrialGraphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 110°C (TJ)Package / Case360-BCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed1.167GHZ
Supplier Device Package360-HiTCE-CBGA (25×25)Voltage – I/O1.1V, 1.3V

Overview of PCX7447AVGH1167NB – IC MPU POWERPC 1.167GHZ 360CBGA

The PCX7447AVGH1167NB is a single‑core, 32‑bit PowerPC microprocessor offered by Microchip Technology in a 360‑HiTCE‑CBGA (25×25) surface‑mount package. It is specified for industrial use and operates across a broad temperature range, making it suitable for demanding embedded environments.

Derived from the PC7447A PowerPC series, the device combines high-frequency operation (1.167 GHz) with series‑level architectural features for embedded computing and signal‑processing tasks. The part is RoHS compliant and designed for surface‑mount integration into compact system designs.

Key Features

  • Core Single PowerPC 32‑bit core running at 1.167 GHz as specified for this part number.
  • Architecture (series‑level) Series documentation describes a superscalar core with a 128‑bit AltiVec SIMD multimedia unit and a double‑precision floating‑point unit for compute‑intensive embedded workloads.
  • Memory Subsystem Series features include integrated L1 caches (32 KB instruction and 32 KB data) and on‑chip 512 KB L2 cache to reduce external memory bandwidth requirements.
  • Bus and Addressing (series‑level) The series supports a 64‑bit data and 36‑bit address bus interface with a 4 GB direct addressing range.
  • Power and Power Management (series‑level) Series documentation references multiple power modes (Nap, Doze, Sleep) and dynamic frequency switching to manage power versus performance tradeoffs.
  • Package and Mounting 360‑HiTCE‑CBGA (25×25) / 360‑BCBGA package, surface‑mount for compact board designs.
  • Operating Temperature Industrial temperature grade with operating range from −40 °C to +110 °C.
  • Regulatory RoHS compliant.
  • Graphics Acceleration No graphics acceleration included.

Typical Applications

  • Embedded computing — High‑performance single‑core PowerPC processing for embedded control and system management tasks.
  • Signal processing — Series SIMD and floating‑point capabilities support compute‑intensive signal processing workloads.
  • Industrial equipment — Industrial temperature rating and robust package make it appropriate for industrial control and instrumentation.
  • Compact board‑level designs — CBGA package and surface‑mount format enable dense, space‑constrained system integrations.

Unique Advantages

  • Verified PowerPC architecture: Single 32‑bit PowerPC core at 1.167 GHz provides predictable RISC performance for legacy and new embedded designs.
  • On‑chip cache reduces system load: Integrated L1 and 512 KB L2 cache (series documentation) cut external memory traffic and improve deterministic performance.
  • Industrial temperature range: −40 °C to +110 °C rating supports deployment in industrial and harsh environments.
  • Compact CBGA package: 360‑HiTCE‑CBGA (25×25) package enables high‑density PCB implementations while maintaining thermal and electrical integrity.
  • Power management features (series‑level): Multiple power modes and dynamic frequency switching allow designers to balance performance and power consumption.
  • RoHS compliant: Meets environmental compliance requirements for modern manufacturing flows.

Why Choose PCX7447AVGH1167NB?

The PCX7447AVGH1167NB positions itself as a robust, single‑core PowerPC solution for embedded and industrial applications that require a balance of performance, integration, and thermal resilience. With a 1.167 GHz operating point, industrial temperature grading, and a high‑density CBGA package, it is suited for system designs where compute capability and compact form factor matter.

Designers targeting embedded computing, signal processing, and industrial control can leverage the series‑level architecture and on‑chip cache to simplify system memory architectures and improve runtime determinism. RoHS compliance and surface‑mount packaging further support modern production and assembly requirements.

Request a quote or submit an RFQ for PCX7447AVGH1167NB to obtain pricing, availability, and ordering information for your next embedded system design.

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