STM32MP151FAA1

IC MPU STM32MP1 800MHZ 448LFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 209MHz, 800MHz 448-LFBGA (18x18)

Quantity 1,781 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP151
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package448-LFBGA (18x18)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps, GbE
GradeConsumerGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-20°C ~ 105°C (TJ)Package / Case448-LFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 800MHzSupplier Device Package448-LFBGA (18×18)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP151FAA1 – IC MPU STM32MP1 800MHZ 448LFBGA

The STM32MP151FAA1 is an STM32MP1-series microprocessor IC from STMicroelectronics intended for embedded applications. It features an ARM® Cortex®-A7 application core (1 core, 32-bit) and lists a speed of 209 MHz; the part name also references 800MHz and the 448-LFBGA package.

Designed for embedded systems requiring integrated application processing and real-time co-processing, the device combines an ARM® Cortex®-M4 coprocessor, multiple memory controller options and a broad set of display and connectivity interfaces to support compact, feature-rich designs.

Key Features

  • Core and Co-processor: ARM® Cortex®-A7 application core (1 core, 32-bit) with an ARM® Cortex®-M4 co-processor for real-time tasks.
  • Processor Speed: Listed core speed is 209 MHz as provided in the product specifications.
  • Memory Controllers: Supports DDR3, DDR3L, LPDDR2 and LPDDR3 memory controllers to match a range of system memory configurations.
  • Display Interfaces: Integrated controllers for HDMI-CEC and LCD to support visual user interfaces and display connectivity.
  • Connectivity: Ethernet support for 10/100 Mbps and Gigabit Ethernet, plus CAN for vehicle or industrial networks.
  • USB: Multiple USB 2.0 interfaces, including USB 2.0 (2) and USB 2.0 OTG+PHY (3), for peripheral and host connectivity.
  • Security: ARM TrustZone (ARM TZ) security feature for hardware-assisted security partitioning.
  • Graphics Acceleration: Graphics acceleration present to offload UI rendering tasks from the main core.
  • Package and Mounting: 448-LFBGA package (18×18 mm) in a surface-mount form factor for dense board integration.
  • Operating Temperature: Rated for an operating range of -20 °C to 105 °C.
  • Compliance: RoHS compliant.
  • Grade: Consumer-grade component.

Typical Applications

  • Embedded Systems: Core and co-processor combination suits general embedded applications that require both application processing and real-time control.
  • Human-Machine Interfaces (HMI): HDMI-CEC and LCD display controllers plus graphics acceleration enable user interface and display-driven products.
  • Networked Devices: Built-in Ethernet (10/100 Mbps and GbE) and multiple USB ports support gateway and connected-device implementations.
  • Control and Telemetry: CAN support and the ARM® Cortex®-M4 co-processor are applicable for control network and telemetry tasks within consumer systems.

Unique Advantages

  • Integrated Application and Real-Time Processing: Combines an ARM® Cortex®-A7 application core with an ARM® Cortex®-M4 co-processor to separate user-facing workloads from deterministic control tasks.
  • Flexible Memory Support: Multiple supported memory types (DDR3, DDR3L, LPDDR2, LPDDR3) let designers choose memory optimized for cost, power or performance.
  • Broad Interface Set: Native support for Ethernet, USB, CAN, and display interfaces reduces external component count and simplifies system-level integration.
  • Hardware Security: ARM TrustZone support enables hardware-based partitioning for secure application deployment.
  • Compact, High-Density Package: 448-LFBGA (18×18) surface-mount package enables dense PCB layouts for space-constrained designs.
  • Temperature Range: Rated for -20 °C to 105 °C to accommodate a wide set of consumer embedded environments.

Why Choose STM32MP151FAA1?

The STM32MP151FAA1 positions itself as a compact, integrated MPU solution for embedded applications that need both application-level processing and real-time control. With an ARM® Cortex®-A7 core, an ARM® Cortex®-M4 co-processor, diverse memory controller options and a wide set of I/O interfaces, it reduces system complexity while supporting display, networking and control functions directly in silicon.

This device is suitable for designers targeting consumer embedded products that require a balance of processing capability, interface integration and a compact BGA package. Its feature set supports scalable designs and helps streamline BOM and board-level integration.

Request a quote or submit a purchase inquiry today to include the STM32MP151FAA1 in your next embedded design.

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