STM32MP151FAC1

IC MPU STM32MP1 800MHZ 361TFBGA
Part Description

ARM® Cortex®-A7 Microprocessor IC STM32MP1 1 Core, 32-Bit 209MHz, 800MHz 361-TFBGA (12x12)

Quantity 66 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSTM32MP151
ManufacturerSTMicroelectronics
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A7Device Package361-TFBGA (12x12)
Display & Interface ControllersHDMI-CEC, LCDECCN5A992CEthernet10/100Mbps, GbE
GradeConsumerGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-20°C ~ 105°C (TJ)Package / Case361-TFBGA
RAM ControllersDDR3, DDR3L, LPDDR2, LPDDR3REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesARM TZSpeed209MHz, 800MHzSupplier Device Package361-TFBGA (12×12)
USBUSB 2.0 (2), USB 2.0 OTG+ PHY (3)Voltage – I/O2.5V, 3.3V

Overview of STM32MP151FAC1 – IC MPU STM32MP1 800MHZ 361TFBGA

The STM32MP151FAC1 is a microprocessor IC from STMicroelectronics in the STM32MP151 series, built around an ARM® Cortex®‑A7 core. It provides a 32‑bit single‑core application processor and an ARM® Cortex®‑M4 co‑processor to address embedded, consumer‑grade designs.

Designed for embedded consumer applications, the device integrates graphics acceleration, display controllers, multiple memory interfaces and a range of connectivity options to support user interfaces, multimedia and networked peripherals.

Key Features

  • Core and Co‑processor — ARM® Cortex®‑A7 single core, 32‑bit with a listed core speed of 209 MHz; includes an ARM® Cortex®‑M4 co‑processor for offloaded real‑time tasks.
  • Memory Interfaces — Integrated controllers for DDR3, DDR3L, LPDDR2 and LPDDR3 memories to support flexible memory configurations.
  • Display and Graphics — Includes LCD and HDMI‑CEC display interface controllers and graphics acceleration to support visual user interfaces and multimedia rendering.
  • Connectivity — Ethernet options include 10/100 Mbps and Gigabit Ethernet; USB capabilities listed as USB 2.0 (2) and USB 2.0 OTG + PHY (3); additional interfaces include CAN.
  • Security — Supports ARM TrustZone (ARM TZ) security features for hardware‑based isolation.
  • Package and Mounting — 361‑TFBGA (12×12) package, surface‑mount mounting for compact board designs.
  • Operating Range and Grade — Consumer grade device rated for an operating temperature range of −20 °C to 105 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Consumer Embedded Devices — Process application workloads and manage peripherals in consumer‑grade embedded systems that require multimedia and connectivity.
  • Human‑Machine Interfaces (HMIs) — Use integrated display controllers and graphics acceleration for touchscreen and visual interface control.
  • Networked Multimedia Gateways — Leverage Ethernet and USB interfaces to build media gateways and home networking appliances.
  • Peripheral Controllers and Gateways — Combine the Cortex‑A7 application core with the Cortex‑M4 co‑processor for mixed control and application tasks, including CAN‑connected modules.

Unique Advantages

  • Dual‑processor Model: Combines an ARM® Cortex®‑A7 application core with an ARM® Cortex®‑M4 co‑processor to separate application and real‑time control workloads.
  • Flexible Memory Support: Multiple DDR and LPDDR memory controller support enables designers to choose memory types that match performance and cost targets.
  • Integrated Display and Graphics: Built‑in LCD and HDMI‑CEC controllers plus graphics acceleration reduce external component needs for visual interfaces.
  • Broad Connectivity: On‑chip Ethernet (10/100 Mbps and GbE), USB 2.0 interfaces, and CAN support a wide range of networked and peripheral applications.
  • Security Foundation: ARM TrustZone provides hardware security primitives to enable partitioning of secure and non‑secure functions.
  • Compact, Surface‑Mount Package: The 361‑TFBGA (12×12) package allows high integration in space‑constrained consumer boards while supporting a wide operating temperature span.

Why Choose STM32MP151FAC1?

The STM32MP151FAC1 positions itself as an integrated microprocessor solution for consumer embedded designs that need a balance of application processing, real‑time control, graphics and diverse connectivity. Its combination of an ARM® Cortex®‑A7 application core and an ARM® Cortex®‑M4 co‑processor, together with multiple memory controller options and display/graphics support, helps streamline system architecture and reduce external components.

As a component from STMicroelectronics in a 361‑TFBGA package, the STM32MP151FAC1 is suited to designs where compact board footprint, display capability, network interfaces and a consumer operating temperature range are required.

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