SVF532R3K1CMK4
| Part Description |
ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF5xxR 2 Core, 32-Bit 400MHz, 133MHz 364-LFBGA (17x17) |
|---|---|
| Quantity | 960 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SVF532 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 + Cortex®-M4 | Device Package | 364-LFBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DCU, GPU, LCD, VideoADC, VIU | ECCN | 5A002A1 FRE | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 364-LFBGA | RAM Controllers | LPDDR2, DDR3, DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | ||
| Speed | 400MHz, 133MHz | Supplier Device Package | 364-LFBGA (17×17) | USB | USB 2.0 OTG + PHY (1) | ||
| Voltage – I/O | 3.3V |
Overview of SVF532R3K1CMK4 – IC MPU VYBRID 133MHZ 364LFBGA
The SVF532R3K1CMK4 is an NXP Vybrid microprocessor IC featuring a dual-core ARM® architecture with Cortex®-A5 and Cortex®-M4 cores in a 32-bit implementation. It is supplied in a 364-LFBGA (17×17) package and is targeted at embedded and industrial applications requiring integrated processing, graphics/display interfaces, and robust connectivity.
Designed for industrial temperature operation from -40 °C to 85 °C and RoHS compliant, this device combines processing performance, multimedia support and security features suitable for a range of embedded systems.
Key Features
- Core — Dual-core ARM® Cortex®-A5 and Cortex®-M4 32-bit architecture providing combined application and real-time processing. The product specification lists a 400 MHz speed.
- Memory Interfaces — Integrated RAM controllers supporting LPDDR2, DDR3 and DRAM to enable flexible external memory options for system designers.
- Graphics & Display — Display interface controllers including DCU, GPU, LCD, VideoADC and VIU for driving HMIs and multimedia displays.
- Connectivity — Dual 10/100 Mbps Ethernet ports and a USB 2.0 OTG with PHY plus CAN interface for networked and fieldbus applications.
- Security & System — On-chip security features such as ARM TrustZone, hashing, RNG, RTC, Secure JTAG, SNVS, TZ ASC and TZ watchdog support secure boot and runtime protections.
- Multimedia Acceleration — Multimedia co-processor support including NEON™ MPE to accelerate signal processing and multimedia tasks.
- Package & Temperature — Supplied in a 364-LFBGA (17×17) surface-mount package with an industrial operating temperature range of -40 °C to 85 °C.
- Power I/O — 3.3 V I/O voltage specification for compatibility with common industrial I/O domains.
Typical Applications
- Industrial Control — Real-time control and monitoring systems that benefit from combined application and real-time cores plus industrial temperature rating.
- Human–Machine Interfaces (HMIs) — Graphical displays and touchscreen interfaces leveraging the DCU/GPU and display controller set.
- Embedded Networking & Gateways — Networked embedded devices and gateways using dual 10/100 Mbps Ethernet and USB OTG connectivity.
- Multimedia & Vision Subsystems — Multimedia processing and video capture/display applications that use the VideoADC, VIU and NEON™ acceleration.
- CAN-Based Field Devices — Field controllers and instrumentation that require CAN connectivity alongside application and real-time processing.
Unique Advantages
- Dual-core, heterogeneous processing: Combines Cortex®-A5 and Cortex®-M4 cores for separation of application-level and real-time tasks within a single device.
- Flexible memory support: LPDDR2, DDR3 and DRAM controller support enables designers to select memory configurations that match performance and cost targets.
- Integrated display and multimedia interfaces: DCU, GPU, LCD and video interfaces reduce external component count for HMI and multimedia designs.
- Comprehensive security features: ARM TrustZone, hashing, RNG, secure JTAG and SNVS provide building blocks for secure boot and runtime protection.
- Industrial readiness: Industrial temperature rating and surface-mount 364-LFBGA package support deployment in temperature-demanding embedded environments.
- Broad connectivity: Dual Ethernet, USB OTG with PHY and CAN provide multiple wired interface options for networked products.
Why Choose SVF532R3K1CMK4?
The SVF532R3K1CMK4 positions itself as a compact, integrated microprocessor solution for embedded and industrial designs that require mixed application and real-time processing, multimedia/display capability, and a robust set of security and connectivity features. Its support for common external memory types and industrial temperature operation make it suitable for a wide range of deployed systems.
This part is appropriate for designers seeking a single-chip approach to combine HMI, networking and control functions while retaining security and multimedia accelerators. The device’s package, I/O voltage and feature set provide a solid foundation for scalable embedded product development and long-term deployment in industrial environments.
Request a quote or submit an inquiry for SVF532R3K1CMK4 to discuss pricing, availability and how this device can fit into your design requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016