SVF532R3K1CMK4

IC MPU VYBRID 133MHZ 364LFBGA
Part Description

ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF5xxR 2 Core, 32-Bit 400MHz, 133MHz 364-LFBGA (17x17)

Quantity 960 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSVF532
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A5 + Cortex®-M4Device Package364-LFBGA (17x17)
Display & Interface ControllersDCU, GPU, LCD, VideoADC, VIUECCN5A002A1 FREEthernet10/100Mbps (2)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 32-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case364-LFBGARAM ControllersLPDDR2, DDR3, DRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Speed400MHz, 133MHzSupplier Device Package364-LFBGA (17×17)USBUSB 2.0 OTG + PHY (1)
Voltage – I/O3.3V

Overview of SVF532R3K1CMK4 – IC MPU VYBRID 133MHZ 364LFBGA

The SVF532R3K1CMK4 is an NXP Vybrid microprocessor IC featuring a dual-core ARM® architecture with Cortex®-A5 and Cortex®-M4 cores in a 32-bit implementation. It is supplied in a 364-LFBGA (17×17) package and is targeted at embedded and industrial applications requiring integrated processing, graphics/display interfaces, and robust connectivity.

Designed for industrial temperature operation from -40 °C to 85 °C and RoHS compliant, this device combines processing performance, multimedia support and security features suitable for a range of embedded systems.

Key Features

  • Core — Dual-core ARM® Cortex®-A5 and Cortex®-M4 32-bit architecture providing combined application and real-time processing. The product specification lists a 400 MHz speed.
  • Memory Interfaces — Integrated RAM controllers supporting LPDDR2, DDR3 and DRAM to enable flexible external memory options for system designers.
  • Graphics & Display — Display interface controllers including DCU, GPU, LCD, VideoADC and VIU for driving HMIs and multimedia displays.
  • Connectivity — Dual 10/100 Mbps Ethernet ports and a USB 2.0 OTG with PHY plus CAN interface for networked and fieldbus applications.
  • Security & System — On-chip security features such as ARM TrustZone, hashing, RNG, RTC, Secure JTAG, SNVS, TZ ASC and TZ watchdog support secure boot and runtime protections.
  • Multimedia Acceleration — Multimedia co-processor support including NEON™ MPE to accelerate signal processing and multimedia tasks.
  • Package & Temperature — Supplied in a 364-LFBGA (17×17) surface-mount package with an industrial operating temperature range of -40 °C to 85 °C.
  • Power I/O — 3.3 V I/O voltage specification for compatibility with common industrial I/O domains.

Typical Applications

  • Industrial Control — Real-time control and monitoring systems that benefit from combined application and real-time cores plus industrial temperature rating.
  • Human–Machine Interfaces (HMIs) — Graphical displays and touchscreen interfaces leveraging the DCU/GPU and display controller set.
  • Embedded Networking & Gateways — Networked embedded devices and gateways using dual 10/100 Mbps Ethernet and USB OTG connectivity.
  • Multimedia & Vision Subsystems — Multimedia processing and video capture/display applications that use the VideoADC, VIU and NEON™ acceleration.
  • CAN-Based Field Devices — Field controllers and instrumentation that require CAN connectivity alongside application and real-time processing.

Unique Advantages

  • Dual-core, heterogeneous processing: Combines Cortex®-A5 and Cortex®-M4 cores for separation of application-level and real-time tasks within a single device.
  • Flexible memory support: LPDDR2, DDR3 and DRAM controller support enables designers to select memory configurations that match performance and cost targets.
  • Integrated display and multimedia interfaces: DCU, GPU, LCD and video interfaces reduce external component count for HMI and multimedia designs.
  • Comprehensive security features: ARM TrustZone, hashing, RNG, secure JTAG and SNVS provide building blocks for secure boot and runtime protection.
  • Industrial readiness: Industrial temperature rating and surface-mount 364-LFBGA package support deployment in temperature-demanding embedded environments.
  • Broad connectivity: Dual Ethernet, USB OTG with PHY and CAN provide multiple wired interface options for networked products.

Why Choose SVF532R3K1CMK4?

The SVF532R3K1CMK4 positions itself as a compact, integrated microprocessor solution for embedded and industrial designs that require mixed application and real-time processing, multimedia/display capability, and a robust set of security and connectivity features. Its support for common external memory types and industrial temperature operation make it suitable for a wide range of deployed systems.

This part is appropriate for designers seeking a single-chip approach to combine HMI, networking and control functions while retaining security and multimedia accelerators. The device’s package, I/O voltage and feature set provide a solid foundation for scalable embedded product development and long-term deployment in industrial environments.

Request a quote or submit an inquiry for SVF532R3K1CMK4 to discuss pricing, availability and how this device can fit into your design requirements.

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