SVF532R3K2CMK4
| Part Description |
ARM® Cortex®-A5 + Cortex®-M4 Microprocessor IC Vybrid, VF5xxR 2 Core, 32-Bit 400MHz, 133MHz 364-LFBGA (17x17) |
|---|---|
| Quantity | 519 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SVF532 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 + Cortex®-M4 | Device Package | 364-LFBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | DCU, GPU, LCD, VideoADC, VIU | ECCN | 5A002A1 FRE | Ethernet | 10/100Mbps (2) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 364-LFBGA | RAM Controllers | LPDDR2, DDR3, DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG | ||
| Speed | 400MHz, 133MHz | Supplier Device Package | 364-LFBGA (17×17) | USB | USB 2.0 OTG + PHY (1) | ||
| Voltage – I/O | 3.3V |
Overview of SVF532R3K2CMK4 – IC MPU VYBRID 133MHZ 364LFBGA
The SVF532R3K2CMK4 is an NXP Vybrid microprocessor IC featuring a dual-core ARM® Cortex®-A5 + Cortex®-M4 architecture. Product data lists core speeds of 400 MHz and 133 MHz and a 32-bit, two-core design suitable for embedded applications.
Designed for industrial embedded systems, this device combines integrated graphics and display interfaces, multiple network and serial interfaces, and a comprehensive security feature set to support performance-oriented and secure designs.
Key Features
- Core & Performance Dual ARM® Cortex®-A5 + Cortex®-M4 cores in a 32-bit, 2-core configuration with listed core speeds of 400 MHz and 133 MHz for partitioned application and real-time processing.
- Memory Support Integrated memory controller support for LPDDR2, DDR3 and DRAM to accommodate a range of system memory choices and performance needs.
- Graphics & Display Graphics acceleration with DCU, GPU, LCD, VideoADC and VIU display controllers for driving user interfaces and video pipelines.
- Connectivity & I/O Dual 10/100 Mbps Ethernet ports, USB 2.0 OTG with PHY (1), and CAN interface provide wired networking and peripheral connectivity for embedded systems.
- Security & System Management Hardware security features include ARM TrustZone (ARM TZ), hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC and TZ WDOG for secure boot, runtime protection and system integrity.
- Package & Mounting Supplied in a 364-LFBGA package (17 × 17 mm) with surface-mount mounting for compact board designs.
- Industrial Qualification & Temperature Qualified for industrial use with an operating temperature range of -40 °C to 85 °C.
- Power I/O I/O voltage listed at 3.3 V for interfacing with common industrial peripherals and I/O standards.
Typical Applications
- Industrial Control Use the dual-core architecture and industrial temperature rating to separate control-plane real-time tasks from higher-level application processing in factory automation equipment.
- Human-Machine Interfaces (HMI) Integrated GPU and display controllers enable responsive graphical user interfaces and local visualization in operator panels and touchscreen systems.
- Networking & Communication Appliances Dual 10/100 Mbps Ethernet ports, USB 2.0 OTG and CAN support connectivity and peripheral expansion for embedded routers, gateways and communication modules.
- Multimedia-Enabled Embedded Devices Graphics acceleration and video interfaces support embedded multimedia workflows where display and video capture/processing are required.
Unique Advantages
- Dual-core partitioning: Enables separation of application-level processing and deterministic control tasks, improving system architecture flexibility.
- Broad memory compatibility: LPDDR2, DDR3 and DRAM controller support allows designers to match memory performance and cost to application needs.
- Rich I/O integration: On-chip Ethernet, USB OTG, CAN and multiple display interfaces reduce external components and simplify BOM.
- Comprehensive security: Multiple hardware security features including TrustZone, secure JTAG and RNG help protect firmware and runtime operation.
- Industrial readiness: Industrial qualification and a -40 °C to 85 °C operating range support deployment in harsh environments.
- Compact package: 364-LFBGA (17 × 17 mm) package balances density and thermal characteristics for space-constrained embedded boards.
Why Choose SVF532R3K2CMK4?
The SVF532R3K2CMK4 positions itself as a versatile, industrial-grade Vybrid microprocessor that combines multi-core processing, comprehensive interfaces and hardware security features in a compact LFBGA package. Its listed core speeds, memory controller flexibility and integrated display and network peripherals make it suitable for embedded designs that require both application-level performance and real-time control capabilities.
Backed by NXP Semiconductors, this device is appropriate for engineers seeking a scalable, robust platform for industrial HMI, control and connectivity-focused products where integration and temperature resilience reduce system complexity and support long-term deployment.
Request a quote today to evaluate SVF532R3K2CMK4 for your next embedded design or submit a procurement inquiry to begin the quoting process.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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