Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
NX3V1T384GM,115NX3V1T384GM,115NXP SemiconductorsIC SW SPST-NCX1 450MOHM 6XSONAnalog Switches, Multiplexers, Demultiplexers6-XSON, SOT886 (1.45x1)N/A-40°C ~ 125°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
450mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
26ns, 10ns
-3db Bandwidth:
25MHz
Charge Injection:
12pC
Channel Capacitance (CS(off), CD(off)):
70pF
Current – Leakage (IS(off)) (Max):
10nA
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-XFDFN
Supplier Device Package:
6-XSON, SOT886 (1.45×1)
277
NX3V1T66GM,115NX3V1T66GM,115NXP SemiconductorsIC SW SPST-NOX1 450MOHM 6XSONAnalog Switches, Multiplexers, Demultiplexers6-XSON, SOT886 (1.45x1)N/A-40°C ~ 125°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
450mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
28ns, 20ns
-3db Bandwidth:
25MHz
Charge Injection:
12pC
Channel Capacitance (CS(off), CD(off)):
70pF
Current – Leakage (IS(off)) (Max):
10nA
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-XFDFN
Supplier Device Package:
6-XSON, SOT886 (1.45×1)
911
NX3V1T66GM,132NX3V1T66GM,132NXP SemiconductorsIC SW SPST-NOX1 450MOHM 6XSONAnalog Switches, Multiplexers, Demultiplexers6-XSON, SOT886 (1.45x1)N/A-40°C ~ 125°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
450mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
28ns, 20ns
-3db Bandwidth:
25MHz
Charge Injection:
12pC
Channel Capacitance (CS(off), CD(off)):
70pF
Current – Leakage (IS(off)) (Max):
10nA
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
6-XFDFN
Supplier Device Package:
6-XSON, SOT886 (1.45×1)
388
NX3V1T66GW,125NX3V1T66GW,125NXP SemiconductorsIC SW SPST-NOX1 450MOHM 5TSSOPAnalog Switches, Multiplexers, Demultiplexers5-TSSOPN/A-40°C ~ 125°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
1
On-State Resistance (Max):
450mOhm
Voltage – Supply, Single (V+):
1.4V ~ 4.3V
Switch Time (Ton, Toff) (Max):
28ns, 20ns
-3db Bandwidth:
25MHz
Charge Injection:
12pC
Channel Capacitance (CS(off), CD(off)):
70pF
Current – Leakage (IS(off)) (Max):
10nA
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Package / Case:
5-TSSOP, SC-70-5, SOT-353
Supplier Device Package:
5-TSSOP
1,182
N/AN/AOMAP2530CZAC330Texas InstrumentsIC MPU 330MHZ 80TQFPMicroprocessors-N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
330MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB OTG (1)
Voltage – I/O:
1.2V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Secure JTAG
Grade:
Commercial
23
N/AN/AOMAP2530CZAC400Texas InstrumentsIC MPU 400MHZ 80TQFPMicroprocessors-N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB OTG (1)
Voltage – I/O:
1.2V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Secure JTAG
Grade:
Commercial
302
N/AN/AOMAP2530CZAC450Texas InstrumentsIC MPU 450MHZ 80TQFPMicroprocessors-N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
450MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB OTG (1)
Voltage – I/O:
1.2V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Secure JTAG
Grade:
Commercial
675
OMAP3503DCBBOMAP3503DCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
430
OMAP3503DCBCOMAP3503DCBCTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
57
OMAP3503DCUSOMAP3503DCUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
65
OMAP3503DCUS72OMAP3503DCUS72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
346
OMAP3503DCUSAOMAP3503DCUSATexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
859
OMAP3503DZCBCSOMAP3503DZCBCSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A-45°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-45°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
436
OMAP3503ECBBOMAP3503ECBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
901
OMAP3503ECBBAOMAP3503ECBBATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
335
OMAP3503ECBBALPDOMAP3503ECBBALPDTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
361
OMAP3503ECBCOMAP3503ECBCTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
726
OMAP3503ECBCAOMAP3503ECBCATexas InstrumentsOMAP3503 SITARA PROCESSOR: ARM CMicroprocessors515-POP-FCBGA (14x14)N/A0 °C – 90 °C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
RAM Controllers:
LPDDR
USB:
USB 1.x (3), USB 2.0 (1)
Graphics Acceleration:
No
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
Display & Interface Controllers:
LCD
1,077
OMAP3503ECUSOMAP3503ECUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
990
OMAP3503ECUS72OMAP3503ECUS72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
87

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