OMAP3503DZCBCS

IC MPU OMAP-35XX 600MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 515-POP-FCBGA (14x14)

Quantity 1,156 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3503
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (14x14)
Display & Interface ControllersLCDECCN5A002A1 TIGraphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-45°C ~ 85°C (TA)
Package / Case515-VFBGA, FCBGARAM ControllersLPDDRREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed600MHzSupplier Device Package515-POP-FCBGA (14×14)
USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3503DZCBCS – IC MPU OMAP-35XX 600MHZ 515FCBGA

The OMAP3503DZCBCS is an embedded microprocessor featuring an ARM® Cortex®-A8 core running at 600 MHz in a 515-POP-FCBGA (14×14) package. It targets embedded designs that require a compact, single-core 32-bit MPU with integrated memory interfaces and a broad set of peripheral controllers.

Built on the OMAP-35xx family architecture, this device combines ARM Cortex-A8 processing with NEON™ SIMD coprocessing, LPDDR memory support, and multiple I/O interfaces for imaging, display and system integration in industrial and embedded applications. The device is RoHS compliant and rated for an operating temperature range of –45 °C to 85 °C.

Key Features

  • Core  ARM® Cortex®-A8 32-bit single core operating at 600 MHz, providing deterministic single-core processing for embedded workloads.
  • Multimedia Coprocessor  NEON™ SIMD multimedia coprocessor for parallel integer and floating-point computations to accelerate multimedia and signal-processing tasks.
  • Memory Subsystem  LPDDR RAM controller and SDRAM controller support with memory scheduler and rotation engine for efficient external memory access and buffering.
  • Display and Imaging  Integrated display interface controllers including LCD support and display subsystem features; series-level features include camera ISP, BT.601/BT.656 video interfaces and support for up to 24-bit RGB signaling.
  • USB and Peripheral Interfaces  Multiple USB ports (three USB 1.x and one USB 2.0) plus HDQ/1-Wire interface for diverse peripheral connectivity and simple sensor/serial integration.
  • Package and Assembly  515-POP-FCBGA (14×14) package in a surface-mount form factor suitable for compact board-level integration.
  • Environmental and Reliability  RoHS compliant with an extended operating temperature range of –45 °C to 85 °C for deployment in demanding embedded environments.

Typical Applications

  • Imaging and Camera Systems  Use the processor’s camera ISP, preview engine and video interfaces for handling CCD/CMOS imagers and real-time image processing tasks.
  • Display and HMI  Drive LCD panels and display pipelines using the integrated display controllers and support for parallel RGB outputs in user-interface devices.
  • Embedded Industrial Systems  Suitable for controllers and embedded platforms requiring single-core ARM processing, LPDDR memory support, and wide operating temperature range.
  • Peripheral-Rich Devices  Devices needing multiple USB ports and simple 1-Wire/HDQ connectivity benefit from the built-in peripheral interfaces for sensor and I/O expansion.

Unique Advantages

  • Deterministic Single-Core Performance: A 600 MHz ARM® Cortex®-A8 core provides predictable CPU performance for embedded application tasks and control loops.
  • Integrated Multimedia Acceleration: NEON™ SIMD coprocessor accelerates compute-heavy multimedia and DSP-style workloads without requiring external accelerators.
  • Broad Peripheral Integration: On-chip USB ports, HDQ/1-Wire and display/controller interfaces reduce external components and simplify board design.
  • Memory Interface Flexibility: LPDDR and SDRAM controller support with memory scheduling features helps optimize external memory performance and system throughput.
  • Extended Temperature Range: Specified for –45 °C to 85 °C, making the device suitable for a range of industrial and embedded deployment environments.
  • Compact Surface-Mount Package: The 515-POP-FCBGA (14×14) package enables dense, space-constrained designs while maintaining robust connectivity.

Why Choose OMAP3503DZCBCS?

The OMAP3503DZCBCS positions itself as a compact, single-core embedded MPU that combines ARM® Cortex®-A8 processing with NEON™ SIMD, LPDDR memory support and multiple integrated peripheral controllers. Its combination of imaging and display interfaces alongside USB connectivity makes it well suited for embedded systems that need onboard multimedia handling and flexible I/O in a small package.

Engineers designing industrial and embedded products will find this device appropriate for designs requiring a documented Texas Instruments product, extended temperature tolerance, and a set of integrated interfaces to reduce board-level complexity and BOM count.

Request a quote or submit a quote to obtain pricing and availability for the OMAP3503DZCBCS. Documentation and the full product datasheet are available from the manufacturer to support evaluation and integration.

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