OMAP3503DCUS
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 423-FCBGA (16x16) |
|---|---|
| Quantity | 551 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3503 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 423-FCBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A002A1 TI | Grade | Commercial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 4 (72 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 90°C (TJ) | Package / Case | 423-LFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 600MHz | ||
| Supplier Device Package | 423-FCBGA (16×16) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of OMAP3503DCUS – IC MPU OMAP-35XX 600MHZ 423FCBGA
The OMAP3503DCUS is a single-core ARM® Cortex®-A8 microprocessor IC running at 600 MHz, packaged in a 423‑FCBGA (16×16) surface-mount package. Designed for embedded applications, it combines a 32-bit Cortex‑A8 core with multimedia co‑processing and standard peripheral controllers to support compact, commercial-grade designs.
Its integration of LPDDR memory control, LCD display interface, multiple USB ports, and HDQ/1‑Wire connectivity provides a consolidated processing and I/O foundation for a range of embedded systems operating across a commercial temperature range.
Key Features
- Core ARM® Cortex®-A8 32‑bit single core running at 600 MHz for deterministic application processing in embedded systems.
- Co‑processors Multimedia co‑processor with NEON™ SIMD support to accelerate media and signal processing workloads.
- Memory Integrated LPDDR memory controller to interface with low‑power DDR memory types common in compact embedded platforms.
- Display LCD display interface controller for direct connection to display panels in human‑machine interface designs.
- Connectivity USB support including three USB 1.x ports and one USB 2.0 port for peripheral and host connectivity.
- Additional Interfaces HDQ/1‑Wire interface for simple sensor and serial device communications.
- Package & Mounting 423‑FCBGA supplier device package (16×16) in a 423‑LFBGA/FCBGA footprint; surface mount for board‑level integration.
- Operating Range Commercial operating temperature range from 0°C to 90°C for use in standard commercial environments.
- Compliance RoHS compliant to support regulatory and environmental requirements.
- Graphics Graphics acceleration: No (explicitly not provided in this part).
Typical Applications
- Embedded Control Systems Use the single 600 MHz Cortex‑A8 core to run control firmware and application logic in compact embedded platforms.
- Human‑Machine Interfaces Drive LCD panels and handle user interface tasks where LPDDR memory and the Cortex‑A8 core deliver responsive operation.
- Commercial Electronics Integrate into commercial devices that require USB connectivity, HDQ/1‑Wire peripheral interfacing, and a commercial temperature rating.
Unique Advantages
- Single‑chip application processing: The ARM® Cortex®-A8 core at 600 MHz provides a consolidated processing element for control and application tasks, reducing BOM complexity.
- Multimedia acceleration via NEON™: NEON™ SIMD support enables more efficient media and signal processing without adding external accelerators.
- Integrated memory interface: Built‑in LPDDR controller simplifies memory subsystem design for low‑power, compact boards.
- Broad I/O mix: Multiple USB ports along with LCD and HDQ/1‑Wire interfaces allow flexible connectivity to peripherals and displays.
- Commercial temperature and RoHS compliance: Rated for 0°C to 90°C operation and RoHS compliant to meet common commercial deployment and regulatory needs.
- Surface‑mount FCBGA packaging: 423‑FCBGA (16×16) package supports high‑density board layouts and standard SMT assembly processes.
Why Choose OMAP3503DCUS?
The OMAP3503DCUS positions itself as an integrated microprocessor solution for commercial embedded designs that require a 32‑bit ARM® Cortex®-A8 core running at 600 MHz, combined with multimedia co‑processing and a practical set of peripheral interfaces. Its LPDDR memory controller, LCD interface, and multiple USB ports deliver the connectivity and memory support typical of compact embedded systems.
This part is suited to designers targeting commercial‑grade products where consolidation of processing and I/O reduces board complexity and accelerates time to market. RoHS compliance and a surface‑mount 423‑FCBGA package support standard manufacturing flows and environmental requirements.
If you would like pricing or availability, request a quote or submit an inquiry to receive a formal quote and support for integrating the OMAP3503DCUS into your design.

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