OMAP3503DCBC

The OMAP3503DCBC is an ARM® Cortex®-A8 microprocessor IC configured as a single 32-bit core running at 600 MHz, targeted for embedded applications. It integrates multimedia-oriented DSP capabilities and system interfaces to support compact, connected commercial designs requiring balanced compute and peripheral integration.

Key Features

• Core – Single ARM® Cortex®-A8 core at 600 MHz providing 32-bit processing for control and application tasks.
• Multimedia DSP – Includes multimedia co-processor support with NEON™ SIMD for accelerated signal and media processing.
• Memory – LPDDR memory controller support for low-power mobile-class memory interfaces.
• Display – Integrated LCD display interface controller to drive on-board display panels for user interfaces.
• USB Connectivity – Multiple USB ports: three USB 1.x and one USB 2.0 to support a range of peripheral connectivity and data transfer needs.
• Additional Interfaces – HDQ/1-Wire interface provided for simple serial sensor or peripheral connections.
• Package & Mounting – 515-POP-FCBGA (14×14) supplier device package, FCBGA package case; designed for surface-mount assembly.
• Grade & Temperature – Commercial grade device rated for an operating temperature range of 0 °C to 90 °C.
• Environmental – RoHS compliant to support lead-free assembly processes.

Typical Applications

• Embedded Systems – Core processing and peripheral integration make it suitable for compact embedded controllers and application-focused modules.
• Human–Machine Interfaces (HMI) – On-chip LCD controller and multimedia support enable interactive display-driven user interfaces.
• Connected Devices – Multiple USB ports and HDQ/1-Wire support peripheral connectivity and sensor interfacing in commercial products.

Unique Advantages

• Balanced Processing Performance: 600 MHz ARM® Cortex®-A8 core provides deterministic single-core compute for control and application workloads.
• Multimedia Acceleration: NEON™ SIMD multimedia co-processor support improves throughput for signal and media processing tasks.
• Integrated Memory Support: LPDDR controller support simplifies memory subsystem design for low-power mobile-class memory.
• Versatile Connectivity: Three USB 1.x ports plus one USB 2.0 port and HDQ/1-Wire interface reduce the need for external bridge components.
• Compact Surface-Mount Packaging: 515-POP-FCBGA (14×14) package enables compact board layouts and high-density assemblies.
• Commercial Temperature & RoHS Compliance: Rated 0 °C to 90 °C and RoHS compliant for standard commercial product deployments and lead-free manufacturing.

Why Choose OMAP3503DCBC?

The OMAP3503DCBC positions itself as an integrated microprocessor solution combining a 600 MHz ARM® Cortex®-A8 core with multimedia co-processor capabilities and broad peripheral support. Its LPDDR memory interface, multiple USB ports, LCD controller and HDQ/1-Wire connectivity provide a compact building block for commercial embedded products that require display, sensor and peripheral integration.

Manufactured by Texas Instruments and available in a 515-POP-FCBGA surface-mount package, the OMAP3503DCBC suits designers seeking a compact, RoHS-compliant commercial-grade MPU with a clear set of interfaces and operating conditions for reliable deployment.

Request a quote or submit a purchase inquiry to receive pricing and availability for the OMAP3503DCBC. Our team can provide a formal quote and assist with technical and procurement questions.