OMAP3503ECBBALPD

IC MPU OMAP-35XX 600MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 515-POP-FCBGA (12x12)

Quantity 503 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3503
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (12x12)
Display & Interface ControllersLCDECCN5A992CGradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed600MHz
Supplier Device Package515-POP-FCBGA (12×12)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3503ECBBALPD – IC MPU OMAP-35XX 600MHZ 515FCBGA

The OMAP3503ECBBALPD is a single-core ARM® Cortex®-A8 microprocessor IC running at 600 MHz, designed for embedded and industrial applications. It combines a 32-bit core with multimedia DSP and NEON™ SIMD capabilities, integrated memory and display controllers, and multiple USB interfaces to support compact, feature-rich designs.

Built and supplied by Texas Instruments, this industrial-grade device targets systems requiring robust operating range and a compact 515-POP-FCBGA (12×12) surface-mount package for space-constrained boards.

Key Features

  • Core Processor  ARM® Cortex®-A8 single-core, 32-bit architecture operating at 600 MHz for general-purpose embedded processing.
  • Multimedia and DSP Acceleration  Integrated multimedia DSP capabilities with NEON™ SIMD to accelerate media and signal-processing workloads.
  • Memory Support  LPDDR memory controller support for system memory interfacing in compact embedded platforms.
  • Display Interface  LCD display interface controller for driving embedded displays and user interfaces.
  • USB Connectivity  Multiple USB ports: three USB 1.x ports and one USB 2.0 port to support a range of peripheral connectivity options.
  • Additional Interfaces  HDQ/1-Wire interface support for simple sensor and low-pin-count peripheral communication.
  • Package and Mounting  515-POP-FCBGA supplier device package (12×12) in a 515-VFBGA/FCBGA case, designed for surface-mount assembly.
  • Industrial Temperature Range  Rated for operation from −40°C to 105°C to meet industrial environmental requirements.
  • Regulatory Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use in embedded controllers and human-machine interfaces where the industrial temperature range and LCD interface are required.
  • Embedded Media Devices  Devices that leverage NEON™ SIMD and multimedia DSP features for media playback or signal processing.
  • Portable and Compact Systems  Space-constrained embedded designs that benefit from the 515-POP-FCBGA (12×12) package and integrated peripherals.
  • Connected Peripherals  Systems requiring multiple USB ports for external devices alongside simple sensor connectivity via HDQ/1-Wire.

Unique Advantages

  • Single-Core 600 MHz Cortex-A8 Performance: Delivers deterministic 32-bit processing suitable for a wide range of embedded workloads.
  • Integrated Multimedia DSP and NEON™ SIMD: Offloads media and signal-processing tasks to dedicated co-processor capabilities, improving system efficiency.
  • Broad Peripheral Integration: On-chip LCD controller, multiple USB ports, and HDQ/1-Wire reduce external component count and simplify board design.
  • LPDDR Memory Support: Direct support for LPDDR enables compact, efficient memory subsystem designs.
  • Industrial Temperature and RoHS Compliance: Rated −40°C to 105°C and RoHS compliant for industrial deployments and regulatory alignment.
  • Compact POP-FCBGA Package: 515-POP-FCBGA (12×12) package supports surface-mount assembly for dense PCB layouts.

Why Choose OMAP3503ECBBALPD?

The OMAP3503ECBBALPD positions itself as a compact, industrial-grade microprocessor that balances 600 MHz ARM® Cortex®-A8 processing with integrated multimedia and peripheral support. Its combination of NEON™ SIMD, LPDDR memory controller, LCD interface, and multiple USB ports makes it well suited for embedded devices that need both processing capability and reduced BOM complexity.

Manufactured by Texas Instruments and offered in a compact 515-POP-FCBGA (12×12) surface-mount package with an extended −40°C to 105°C operating range, this device is a practical choice for engineers designing industrial and embedded systems requiring robust thermal performance and integrated connectivity.

Request a quote or submit an inquiry to receive pricing and availability for the OMAP3503ECBBALPD and support your next embedded design project.

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