OMAP3503ECBBALPD
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 515-POP-FCBGA (12x12) |
|---|---|
| Quantity | 503 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3503 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 515-POP-FCBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A992C | Grade | Industrial | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 105°C (TJ) | Package / Case | 515-VFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 600MHz | ||
| Supplier Device Package | 515-POP-FCBGA (12×12) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of OMAP3503ECBBALPD – IC MPU OMAP-35XX 600MHZ 515FCBGA
The OMAP3503ECBBALPD is a single-core ARM® Cortex®-A8 microprocessor IC running at 600 MHz, designed for embedded and industrial applications. It combines a 32-bit core with multimedia DSP and NEON™ SIMD capabilities, integrated memory and display controllers, and multiple USB interfaces to support compact, feature-rich designs.
Built and supplied by Texas Instruments, this industrial-grade device targets systems requiring robust operating range and a compact 515-POP-FCBGA (12×12) surface-mount package for space-constrained boards.
Key Features
- Core Processor ARM® Cortex®-A8 single-core, 32-bit architecture operating at 600 MHz for general-purpose embedded processing.
- Multimedia and DSP Acceleration Integrated multimedia DSP capabilities with NEON™ SIMD to accelerate media and signal-processing workloads.
- Memory Support LPDDR memory controller support for system memory interfacing in compact embedded platforms.
- Display Interface LCD display interface controller for driving embedded displays and user interfaces.
- USB Connectivity Multiple USB ports: three USB 1.x ports and one USB 2.0 port to support a range of peripheral connectivity options.
- Additional Interfaces HDQ/1-Wire interface support for simple sensor and low-pin-count peripheral communication.
- Package and Mounting 515-POP-FCBGA supplier device package (12×12) in a 515-VFBGA/FCBGA case, designed for surface-mount assembly.
- Industrial Temperature Range Rated for operation from −40°C to 105°C to meet industrial environmental requirements.
- Regulatory Compliance RoHS compliant.
Typical Applications
- Industrial Control Use in embedded controllers and human-machine interfaces where the industrial temperature range and LCD interface are required.
- Embedded Media Devices Devices that leverage NEON™ SIMD and multimedia DSP features for media playback or signal processing.
- Portable and Compact Systems Space-constrained embedded designs that benefit from the 515-POP-FCBGA (12×12) package and integrated peripherals.
- Connected Peripherals Systems requiring multiple USB ports for external devices alongside simple sensor connectivity via HDQ/1-Wire.
Unique Advantages
- Single-Core 600 MHz Cortex-A8 Performance: Delivers deterministic 32-bit processing suitable for a wide range of embedded workloads.
- Integrated Multimedia DSP and NEON™ SIMD: Offloads media and signal-processing tasks to dedicated co-processor capabilities, improving system efficiency.
- Broad Peripheral Integration: On-chip LCD controller, multiple USB ports, and HDQ/1-Wire reduce external component count and simplify board design.
- LPDDR Memory Support: Direct support for LPDDR enables compact, efficient memory subsystem designs.
- Industrial Temperature and RoHS Compliance: Rated −40°C to 105°C and RoHS compliant for industrial deployments and regulatory alignment.
- Compact POP-FCBGA Package: 515-POP-FCBGA (12×12) package supports surface-mount assembly for dense PCB layouts.
Why Choose OMAP3503ECBBALPD?
The OMAP3503ECBBALPD positions itself as a compact, industrial-grade microprocessor that balances 600 MHz ARM® Cortex®-A8 processing with integrated multimedia and peripheral support. Its combination of NEON™ SIMD, LPDDR memory controller, LCD interface, and multiple USB ports makes it well suited for embedded devices that need both processing capability and reduced BOM complexity.
Manufactured by Texas Instruments and offered in a compact 515-POP-FCBGA (12×12) surface-mount package with an extended −40°C to 105°C operating range, this device is a practical choice for engineers designing industrial and embedded systems requiring robust thermal performance and integrated connectivity.
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