OMAP3503ECBC

The OMAP3503ECBC is a commercial-grade microprocessor IC from Texas Instruments based on an ARM® Cortex®-A8 core. It delivers a single 32-bit processing core running at 600 MHz and integrates memory and peripheral controllers suitable for embedded designs.

With integrated LPDDR memory support, multiple USB ports and an LCD display interface, this device targets embedded and commercial embedded product designs that require a compact, surface-mount MPU solution in a 515-POP-FCBGA (14×14) package.

Key Features

• Core  ARM® Cortex®-A8 single 32-bit core running at 600 MHz for deterministic application processing.
• Multimedia & DSP  Includes multimedia co-processor capabilities and NEON™ SIMD support for signal-processing and media tasks.
• Memory  LPDDR memory controller integrated for low-power DRAM interfacing.
• Display  LCD display interface controller for embedded user-interface implementations.
• USB Connectivity  Multiple USB ports: USB 1.x (3 ports) and USB 2.0 (1 port) to support a range of peripheral connectivity options.
• Additional Interfaces  Includes HDQ/1-Wire support for single-wire peripheral communications.
• Package & Mounting  515-POP-FCBGA supplier device package (14×14) / 515-VFBGA FCBGA, designed for surface-mount assembly.
• Operating Range  Commercial temperature grade with an operating temperature range of 0 °C to 90 °C.
• Compliance  RoHS compliant.
• Graphics  No dedicated graphics acceleration.

Typical Applications

• Embedded Systems  Use where a 600 MHz ARM® Cortex®-A8 core with LPDDR support and LCD interface is required for compact embedded designs.
• Multimedia Modules  Deploy in modules that leverage the multimedia co-processor and NEON™ SIMD for media and signal-processing tasks.
• Peripheral-Connected Devices  Suitable for devices that require multiple USB 1.x and a USB 2.0 port plus HDQ/1-Wire peripheral connectivity.
• Commercial Products  Targeted at commercial-grade products operating within 0 °C to 90 °C and requiring a surface-mount 515-POP-FCBGA package.

Unique Advantages

• Integrated Memory Interface: Built-in LPDDR controller reduces external component count and simplifies memory design.
• Versatile I/O Mix: Multiple USB ports and HDQ/1-Wire support provide flexible peripheral connectivity for diverse embedded functions.
• Signal-Processing Capability: Multimedia co-processor and NEON™ SIMD enable efficient handling of media and DSP workloads.
• Compact Surface-Mount Package: 515-POP-FCBGA (14×14) package supports space-constrained board designs with surface-mount assembly.
• Commercial Temperature Rating: Rated 0 °C to 90 °C for commercial embedded product deployments.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose OMAP3503ECBC?

The OMAP3503ECBC positions itself as a compact, commercially graded MPU option from Texas Instruments that combines a 600 MHz ARM® Cortex®-A8 core with integrated LPDDR support, multimedia co-processing and a practical I/O set including USB and LCD interfaces. Its surface-mount 515-POP-FCBGA packaging and operating temperature range make it suitable for a range of embedded applications where board area and integration are important.

This part is well suited for customers developing commercial embedded systems that require a verified single-core ARM® architecture, integrated memory interface and multiple peripheral options backed by Texas Instruments product resources and documentation.

Request a quote or submit an RFQ to receive pricing and availability information for the OMAP3503ECBC. Our team can assist with lead-time details and volume pricing.