OMAP3503ECUSA

IC MPU OMAP-35XX 600MHZ 423FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 600MHz 423-FCBGA (16x16)

Quantity 407 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3503
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package423-FCBGA (16x16)
Display & Interface ControllersLCDECCN5A992CGradeIndustrial
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level4 (72 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case423-LFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed600MHz
Supplier Device Package423-FCBGA (16×16)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3503ECUSA – IC MPU OMAP-35XX 600MHZ 423FCBGA

The OMAP3503ECUSA is an ARM® Cortex®-A8 microprocessor IC from the OMAP3503 series by Texas Instruments. It provides a single 32-bit core running at 600 MHz in a 423-FCBGA (16×16) surface-mount package for embedded designs.

Targeted at embedded and industrial applications, the device integrates LPDDR memory controller support, an LCD display interface controller, NEON™ SIMD multimedia co-processing, multiple USB ports and HDQ/1-Wire connectivity. The OMAP3503ECUSA is rated for industrial operation from −40°C to 105°C and is RoHS compliant.

Key Features

  • Core One ARM® Cortex®-A8 32-bit core operating at 600 MHz for embedded processing tasks.
  • Multimedia & DSP Multimedia co-processor support with NEON™ SIMD for signal processing and multimedia workloads.
  • Memory LPDDR memory controller support for low-power DRAM configurations.
  • Display Integrated LCD display interface controller for direct connection to display panels.
  • USB Connectivity Three USB 1.x ports and one USB 2.0 port for flexible peripheral and host connectivity.
  • Additional Interfaces HDQ/1-Wire interface for low-pin serial sensor and device connectivity.
  • Package & Mounting 423-FCBGA (16×16) supplier device package in a surface-mount form factor suitable for high-density PCB designs.
  • Industrial Grade & Temperature Range Rated for operation from −40°C to 105°C to support industrial environments.
  • Environmental Compliance RoHS compliant as indicated in supplier data.

Typical Applications

  • Industrial Embedded Systems Industrial temperature rating and single-core ARM® Cortex®-A8 processing make it suitable for controllers and instrumentation operating across −40°C to 105°C.
  • Human-Machine Interfaces (HMIs) LCD interface and multiple USB ports enable display-equipped operator panels and interactive embedded interfaces.
  • Multimedia-Enabled Embedded Devices NEON™ SIMD and multimedia co-processing support on-device audio and signal processing tasks.
  • Connectivity-Focused Equipment Multiple USB ports and HDQ/1-Wire provide options for sensors, peripherals and low-pin device connections.

Unique Advantages

  • Industrial temperature capability: Operation from −40°C to 105°C supports deployment in harsh or wide-range environments.
  • Balanced processing and integration: 600 MHz ARM® Cortex®-A8 core with multimedia co-processing delivers capable embedded processing while integrating key system interfaces.
  • Reduced BOM for display systems: Integrated LCD controller and LPDDR support simplify board-level memory and display designs.
  • Flexible peripheral connectivity: Three USB 1.x ports and one USB 2.0 port plus HDQ/1-Wire allow diverse peripheral and sensor integration.
  • Compact, surface-mount package: 423-FCBGA (16×16) supports compact, high-density PCB layouts common in embedded products.
  • RoHS compliant: Conforms to RoHS requirements as noted in supplier information.

Why Choose OMAP3503ECUSA?

The OMAP3503ECUSA delivers a focused embedded processing solution by combining a 600 MHz ARM® Cortex®-A8 core with multimedia co-processing and a suite of integrated interfaces. Its LPDDR memory support, LCD controller and multiple USB ports reduce external component needs and streamline system design for display-equipped and connectivity-oriented embedded applications.

Built for industrial environments, the device’s −40°C to 105°C operating range and 423-FCBGA (16×16) surface-mount package offer designers a robust, compact option for long-term deployments. RoHS compliance and Texas Instruments' OMAP3503 series pedigree support consistent sourcing and regulatory alignment.

Request a quote or submit an inquiry today for pricing, availability and technical details for the OMAP3503ECUSA.

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