Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
OMAP3503ECUSAOMAP3503ECUSATexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
1,248
OMAP3515DCBBOMAP3515DCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
668
OMAP3515DCBBAOMAP3515DCBBATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
81
OMAP3515DCBCOMAP3515DCBCTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
172
OMAP3515DCBCAOMAP3515DCBCATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Industrial
683
OMAP3515DCUSOMAP3515DCUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
407
OMAP3515ECBBOMAP3515ECBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
649
OMAP3515ECBBAOMAP3515ECBBATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
1,093
OMAP3515ECUSOMAP3515ECUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
177
OMAP3515ECUS72OMAP3515ECUS72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
567
OMAP3515ECUSAOMAP3515ECUSATexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
339
OMAP3525DCBCAOMAP3525DCBCATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Industrial
761
OMAP3525DCUSOMAP3525DCUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
1,168
OMAP3525ECBBOMAP3525ECBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
812
OMAP3525ECBBAOMAP3525ECBBATexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Industrial
498
OMAP3525ECBCOMAP3525ECBCTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (14x14)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (14×14)
Grade:
Commercial
957
OMAP3525ECUSOMAP3525ECUSTexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Commercial
1,305
OMAP3525ECUSAOMAP3525ECUSATexas InstrumentsIC MPU OMAP-35XX 600MHZ 423FCBGAMicroprocessors423-FCBGA (16x16)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
423-LFBGA, FCBGA
Supplier Device Package:
423-FCBGA (16×16)
Grade:
Industrial
1,355
OMAP3530DCBBOMAP3530DCBBTexas InstrumentsIC MPU OMAP-35XX 600MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
503
OMAP3530DCBB72OMAP3530DCBB72Texas InstrumentsIC MPU OMAP-35XX 720MHZ 515FCBGAMicroprocessors515-POP-FCBGA (12x12)N/A0°C ~ 90°C (TJ)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
720MHz
Co-Processors/DSP:
Signal Processing; C64x+, Multimedia; NEONâ„¢ SIMD
RAM Controllers:
LPDDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB 1.x (3), USB 2.0 (1)
Voltage – I/O:
1.8V, 3.0V
Operating Temperature:
0°C ~ 90°C (TJ)
Mounting Type:
Surface Mount
Package / Case:
515-VFBGA, FCBGA
Supplier Device Package:
515-POP-FCBGA (12×12)
Grade:
Commercial
592

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