OMAP3530DCBB72
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 720MHz 515-POP-FCBGA (12x12) |
|---|---|
| Quantity | 736 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3530 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C64x+, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 515-POP-FCBGA (12x12) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A002A1 TI | Grade | Commercial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 90°C (TJ) | Package / Case | 515-VFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 720MHz | ||
| Supplier Device Package | 515-POP-FCBGA (12×12) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of OMAP3530DCBB72 – ARM Cortex-A8 720MHz Microprocessor
The OMAP3530DCBB72 is a single-core, 32-bit microprocessor based on the ARM® Cortex®-A8 core running at 720 MHz. Designed for embedded applications, it combines a high-performance application core with dedicated signal-processing and multimedia co-processor capabilities to address display-driven and multimedia-focused systems.
Key on-chip resources include LPDDR memory controller support, an LCD display interface, multiple USB ports, HDQ/1-Wire support and graphics acceleration, all packaged in a 515-POP-FCBGA (12×12) surface-mount package for compact system integration. The device is RoHS compliant and specified for commercial operation from 0 °C to 90 °C.
Key Features
- Core Processor ARM® Cortex®-A8 single core, 32-bit architecture running at 720 MHz for application processing.
- Signal & Multimedia Co-processors Includes C64x+ signal-processing capabilities and NEON™ SIMD for multimedia acceleration and data-parallel workloads.
- Memory Support On-chip support for LPDDR memory controllers to interface with low-power DDR memories.
- Display and Graphics Integrated LCD display interface plus graphics acceleration to support GUI and display-driven applications.
- USB Connectivity Multiple USB interfaces: three USB 1.x ports and one USB 2.0 port for peripheral connectivity and host/device options.
- Additional Interfaces HDQ/1-Wire interface support for simple sensor and low-pin-count peripheral connections.
- Package & Mounting 515-POP-FCBGA (12×12) package case (515-VFBGA, FCBGA) with surface-mount mounting type for compact board designs.
- Operating Range & Compliance Commercial grade operation from 0 °C to 90 °C and RoHS compliant.
Typical Applications
- Embedded Multimedia Systems Use the ARM core with NEON SIMD and C64x+ DSP resources to accelerate media playback, decoding and multimedia processing.
- Display-Driven Interfaces Integrated LCD controller and graphics acceleration make the device suitable for user interfaces and HMI applications requiring responsive displays.
- Peripheral-Rich Embedded Designs Multiple USB ports and HDQ/1-Wire support enable complex I/O and peripheral connectivity for industrial and consumer embedded products.
Unique Advantages
- Heterogeneous Processing: Combines an ARM® Cortex®-A8 application core with C64x+ and NEON™ SIMD co-processors to partition general-purpose and signal/multimedia workloads efficiently.
- Integrated Display and Graphics: On-chip LCD interface and graphics acceleration reduce external component count for display-centric designs.
- Flexible Connectivity: Multiple USB ports including USB 2.0 plus HDQ/1-Wire provide a range of peripheral and sensor interfacing options.
- Compact Packaging: 515-POP-FCBGA (12×12) surface-mount package enables space-efficient board layouts for embedded systems.
- Commercial Temperature Range: Rated for 0 °C to 90 °C operation to meet typical commercial embedded environment requirements.
- RoHS Compliant: Environmentally compliant manufacturing reduces regulatory and disposal concerns.
Why Choose OMAP3530DCBB72?
The OMAP3530DCBB72 positions itself as a compact, integrated microprocessor solution for embedded designs that require a balance of application processing and signal/multimedia acceleration. With a 720 MHz ARM® Cortex®-A8 core augmented by C64x+ DSP resources and NEON™ SIMD, plus on-chip LPDDR support, LCD interface and multiple USB ports, it reduces system complexity while enabling responsive display and multimedia functionality.
Manufactured by Texas Instruments and supplied in a space-efficient 515-POP-FCBGA (12×12) surface-mount package, this device is suited for engineers building commercial embedded products that demand integrated multimedia features, flexible I/O and predictable operating temperature performance.
Request a quote or submit an inquiry to receive pricing and availability details for the OMAP3530DCBB72 and to discuss how it can fit into your next embedded design.

Date Founded: 1930
Headquarters: Dallas, Texas, USA
Employees: 34,000+
Revenue: $17.52 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016