OMAP3530DCBB72

IC MPU OMAP-35XX 720MHZ 515FCBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 720MHz 515-POP-FCBGA (12x12)

Quantity 736 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesOMAP3530
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPSignal Processing; C64x+, Multimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package515-POP-FCBGA (12x12)
Display & Interface ControllersLCDECCN5A002A1 TIGradeCommercial
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 90°C (TJ)Package / Case515-VFBGA, FCBGARAM ControllersLPDDR
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed720MHz
Supplier Device Package515-POP-FCBGA (12×12)USBUSB 1.x (3), USB 2.0 (1)Voltage – I/O1.8V, 3.0V

Overview of OMAP3530DCBB72 – ARM Cortex-A8 720MHz Microprocessor

The OMAP3530DCBB72 is a single-core, 32-bit microprocessor based on the ARM® Cortex®-A8 core running at 720 MHz. Designed for embedded applications, it combines a high-performance application core with dedicated signal-processing and multimedia co-processor capabilities to address display-driven and multimedia-focused systems.

Key on-chip resources include LPDDR memory controller support, an LCD display interface, multiple USB ports, HDQ/1-Wire support and graphics acceleration, all packaged in a 515-POP-FCBGA (12×12) surface-mount package for compact system integration. The device is RoHS compliant and specified for commercial operation from 0 °C to 90 °C.

Key Features

  • Core Processor  ARM® Cortex®-A8 single core, 32-bit architecture running at 720 MHz for application processing.
  • Signal & Multimedia Co-processors  Includes C64x+ signal-processing capabilities and NEON™ SIMD for multimedia acceleration and data-parallel workloads.
  • Memory Support  On-chip support for LPDDR memory controllers to interface with low-power DDR memories.
  • Display and Graphics  Integrated LCD display interface plus graphics acceleration to support GUI and display-driven applications.
  • USB Connectivity  Multiple USB interfaces: three USB 1.x ports and one USB 2.0 port for peripheral connectivity and host/device options.
  • Additional Interfaces  HDQ/1-Wire interface support for simple sensor and low-pin-count peripheral connections.
  • Package & Mounting  515-POP-FCBGA (12×12) package case (515-VFBGA, FCBGA) with surface-mount mounting type for compact board designs.
  • Operating Range & Compliance  Commercial grade operation from 0 °C to 90 °C and RoHS compliant.

Typical Applications

  • Embedded Multimedia Systems  Use the ARM core with NEON SIMD and C64x+ DSP resources to accelerate media playback, decoding and multimedia processing.
  • Display-Driven Interfaces  Integrated LCD controller and graphics acceleration make the device suitable for user interfaces and HMI applications requiring responsive displays.
  • Peripheral-Rich Embedded Designs  Multiple USB ports and HDQ/1-Wire support enable complex I/O and peripheral connectivity for industrial and consumer embedded products.

Unique Advantages

  • Heterogeneous Processing: Combines an ARM® Cortex®-A8 application core with C64x+ and NEON™ SIMD co-processors to partition general-purpose and signal/multimedia workloads efficiently.
  • Integrated Display and Graphics: On-chip LCD interface and graphics acceleration reduce external component count for display-centric designs.
  • Flexible Connectivity: Multiple USB ports including USB 2.0 plus HDQ/1-Wire provide a range of peripheral and sensor interfacing options.
  • Compact Packaging: 515-POP-FCBGA (12×12) surface-mount package enables space-efficient board layouts for embedded systems.
  • Commercial Temperature Range: Rated for 0 °C to 90 °C operation to meet typical commercial embedded environment requirements.
  • RoHS Compliant: Environmentally compliant manufacturing reduces regulatory and disposal concerns.

Why Choose OMAP3530DCBB72?

The OMAP3530DCBB72 positions itself as a compact, integrated microprocessor solution for embedded designs that require a balance of application processing and signal/multimedia acceleration. With a 720 MHz ARM® Cortex®-A8 core augmented by C64x+ DSP resources and NEON™ SIMD, plus on-chip LPDDR support, LCD interface and multiple USB ports, it reduces system complexity while enabling responsive display and multimedia functionality.

Manufactured by Texas Instruments and supplied in a space-efficient 515-POP-FCBGA (12×12) surface-mount package, this device is suited for engineers building commercial embedded products that demand integrated multimedia features, flexible I/O and predictable operating temperature performance.

Request a quote or submit an inquiry to receive pricing and availability details for the OMAP3530DCBB72 and to discuss how it can fit into your next embedded design.

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