OMAP3530DCBC
| Part Description |
ARM® Cortex®-A8 Microprocessor IC OMAP-35xx 1 Core, 32-Bit 720MHz 515-POP-FCBGA (14x14) |
|---|---|
| Quantity | 770 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | OMAP3530 |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Signal Processing; C64x+, Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 515-POP-FCBGA (14x14) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | 5A002A1 TI | Grade | Commercial | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 90°C (TJ) | Package / Case | 515-VFBGA, FCBGA | RAM Controllers | LPDDR | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 720MHz | ||
| Supplier Device Package | 515-POP-FCBGA (14×14) | USB | USB 1.x (3), USB 2.0 (1) | Voltage – I/O | 1.8V, 3.0V |
Overview of OMAP3530DCBC – IC MPU OMAP-35XX 720MHZ 515FCBGA
The OMAP3530DCBC is an ARM® Cortex®-A8 based microprocessor IC from the OMAP3530 series, delivering a 32-bit single-core CPU clocked at 720 MHz in a 515-POP-FCBGA (14×14) package. Designed for embedded applications, it integrates signal-processing and multimedia co-processors alongside display and connectivity interfaces to support compact, display-driven systems.
Key value comes from its integration of DSP and NEON™ SIMD engines, LPDDR memory controller, on-chip graphics acceleration and multiple USB interfaces, enabling streamlined designs for commercial embedded products operating across a 0 °C to 90 °C range.
Key Features
- Core — ARM® Cortex®-A8 single-core, 32-bit processor running at 720 MHz for general-purpose application processing.
- Co-Processors — Integrated signal processing and C64x+ DSP engines plus NEON™ SIMD for multimedia and compute-accelerated workloads.
- Memory Support — LPDDR memory controller for connection to low-power DDR memory devices.
- Display and Graphics — On-chip graphics acceleration and LCD display interface controller to support visual user interfaces and graphics rendering.
- Connectivity — Multiple USB ports: three USB 1.x and one USB 2.0, plus an HDQ/1-Wire interface for simple peripheral and sensor connectivity.
- Package & Mounting — 515-POP-FCBGA (14×14) supplier device package; 515-VFBGA FCBGA package case; surface-mount mounting type for compact PCB integration.
- Commercial Grade & Temperature — Commercial grade device with an operating temperature range of 0 °C to 90 °C.
- Compliance — RoHS compliant.
Typical Applications
- Embedded Systems — General embedded processing where a single 720 MHz Cortex-A8 core with DSP acceleration is required for control and application tasks.
- Multimedia Devices — Devices requiring multimedia processing and accelerated graphics with NEON™ SIMD and on-chip graphics acceleration paired with LCD control.
- USB-Connected Peripherals — Products that need multiple USB interfaces for peripheral connectivity and communication.
- User Interfaces — HMI and display-equipped designs leveraging the LCD controller and graphics acceleration for responsive visual interfaces.
Unique Advantages
- Integrated Processing and DSP: Combines an ARM® Cortex®-A8 core with C64x+ DSP and NEON™ SIMD to handle control, signal processing, and multimedia workloads within a single device.
- Display-Ready Integration: On-chip graphics acceleration plus an LCD controller reduce external component needs for display-driven applications.
- Multiple USB Interfaces: Three USB 1.x ports and one USB 2.0 port enable flexible peripheral and host connectivity options without extensive external logic.
- Compact, Surface-Mount Packaging: 515-POP-FCBGA (14×14) package supports high-density PCB designs and surface-mount assembly processes.
- Commercial Temperature and RoHS Compliance: Rated for 0 °C to 90 °C operation and RoHS compliant to meet commercial product requirements.
- LPDDR Memory Support: On-chip LPDDR controller simplifies memory subsystem design for systems requiring low-profile DRAM.
Why Choose OMAP3530DCBC?
The OMAP3530DCBC positions itself as a compact, integrated MPU for commercial embedded designs that need a balanced combination of general-purpose processing, DSP acceleration, multimedia capabilities, and display connectivity. Its 720 MHz Cortex-A8 core combined with C64x+ DSP and NEON™ SIMD enables designs that consolidate processing tasks and multimedia offload within a single package.
As part of the OMAP3530 series from Texas Instruments, this device is suited to development efforts focused on display-driven embedded products and USB-connected peripherals where package density, integrated interfaces, and compliance with commercial temperature ranges and RoHS are important considerations.
Request a quote or submit a purchase inquiry to receive pricing and availability for the OMAP3530DCBC and to discuss suitability for your design requirements.

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